MRSI Mycronic, a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing solutions focusing on speed, accuracy, safety, and ergonomics.
The next-generation epoxy dispenser represents an ultra-high-speed, flexible solution with multiple dispensing methods and materials, including silver-filled epoxies, conformal coating, sintering paste, thermal grease, and UV adhesive, among others. The system is highly configurable for complex applications, such as microwave modules, optical modules, hybrid circuits, multichip modules, advanced packaging, and semiconductor packaging. Moreover, it offers precise process control and is 35% more energy efficient than previous systems.
Our customers now have two options from this new product. The MRSI-175Ag is our standard option for 25µm accuracy. The MRSI-175Ag+ is an available option that achieves 10µm accuracy.
Francesca Navarro, product manager, MRSI Mycronic, expressed enthusiasm about the launch: “We are excited to introduce the next generation high precision epoxy dispenser and remain committed to ongoing innovation to meet the needs of our customers.”
For further details regarding MRSI and the next generation epoxy dispenser please visit www.mrsisystems.com or reach out to sales.mrsi@mycronic.com.
