Experience higher integration density and improved performance through hybrid bonding techniques
Brewer Science, Inc., a pioneer in temporary bonding and materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024 on October 1st, 2024 at 1:15 pm (EST).
Challenges for High-Temperature Processing in Semiconductor Packaging
Traditional high-temperature processing poses a challenge when accommodating higher integration densities and improved performance in advanced semiconductor packaging. The use of low-temperature hybrid bonding with nanocrystalline copper (nc-Cu) and polymer materials offers a solution to this challenge by enabling efficient wafer-to-wafer and die-to-wafer bonding processes at significantly reduced temperatures.
“The development of high-performance materials is critical to advancing hybrid bonding technology,” says Dongshun Bai, Director of Business Development, Senior Technologist at Brewer Science. “As we continue to innovate materials for high-performance computing and AI, we’re excited to share our progress at the IMAPS Symposium 2024.”
Higher integration densities and improved performance achieved by hybrid bonding applications
Bai presents Materials for Hybrid Bonding at IMAPS Symposium 2024 on October 1st, 2024 at 1:15 pm (EST). The presentation addresses material challenges currently faced in wafer-to-wafer and die-to-wafer hybrid bonding, while answering the industry’s most critical questions, including:
- How does temporary and permanent material selection impact the process, and ultimately the device performance?
- What impact do dielectric materials have on bond strength and reliability?
- Why are advanced packaging materials playing important roles for successful hybrid bonding processes?
The presentation covers key concepts from Chapter 4 of Direct Copper Interconnection for Advanced Semiconductor Technology. Members from Brewer Science’s team contributed to the information and data published in Chapter 4.
For those unable to attend the event, additional information can be requested on our website.
