Co-located with IMAPS Device Packaging Conference 2025 (March 3 – 6)
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in Phoenix, Arizona on Advanced Packaging for Medical Microelectronics on March 5-7, 2025. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations. This two-day event will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly.
Call for Abstracts
Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the workshop, please submit a 100+ word abstract no later than November 1, 2024. Please contact kbowman@imaps.org if you have questions. Full papers are not required. PowerPoint format recommended; no event template required. A post-event download containing the presentations will be distributed to attendees. Speakers are required to pay a reduced registration fee.
Topics Include
- Diagnostic Devices
- DNA Sequencing Devices
- Single-Cell Diagnostics
- Injectibles & Ingestibles
- Si Lab-on-Chip Glass Microfluidics Device Miniaturization Power & Energy Harvesting
- Implantables Wearables Flexible
- RF & Wireless Applications/Products
- Smart Electrodes & Catheters
- Brain-Computer Interface Devices Cochlear/Retinal/Olfactory
- AI for Medical Devices
