The 21st Annual IMAPS Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. As preparations begin for the event, IMAPS is currently accepting abstracts for technical presentations and Professional Development Courses through September 1, 2024.
The 2025 IMAPS Device Packaging Conference will feature four keynote presentations, technical sessions on heterogeneous: 2D and 3D integration/emerging technologies/fan-out, wafer/panel level, and flip chip packaging, an embedded Global Business Council plenary session, an interactive poster session, am evening panel discussion, and more.
Those wishing to present their work at the Device Packaging Conference should submit a 500+ word abstract electronically using the online submission system at www.devicepackaging.org. No formal technical paper is required. A two-to-six-page concise summary (“extended abstract”) with text (figures and graphs included if necessary) will be required for the abstract booklet on January 31, 2025.
New Location
Based on the success of the 2024 event, DPC 2025 be held at a new location that can accommodate more session rooms, exhibits and hotel rooms. The Sheraton at Wild Horse Pass is a beautiful resort setting located in Phoenix, Arizona,14 miles south of Sky Harbor Airport. The hotel room block is now open.
Visit the DPC 2025 event page for more information.
