The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a call for papers for ECTC 2025, the conference’s 75th anniversary.
The 75th annual IEEE Electronic Components and Technology Conference ECTC will take place from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.
The deadline for submissions is October 7, 2024. To submit an abstract, visit www.ectc.net.
The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas, including:
- Applied Reliability
- Assembly and Manufacturing Technology
- Electrical Design and Analysis
- Emerging Technologies
- RF, High-Speed Components & Systems
- Interconnections
- Materials & Processing
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies
- Photonics
- Interactive Presentations
For all details, please refer to: https://www.ectc.net/abstracts/75thCallforPapers-Web.pdf
