SEMICON Taiwan 2024 “Breaking Limits” Member Preview

Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering the AI Era, the event will showcase how the semiconductor industry is driving AI technology. 

We’re excited to share that SEMI, one of our member companies, has achieved record sales for SEMICON Taiwan! This year will feature more than 1,100 exhibitors across 3,700 booths, presentations from 17 of our member companies, and booths for 21 member companies. Registration is open. 

Like always, SEMICON Taiwan will host several themed pavilions and innovation zones. New pavilions for this year include AI, smart mobility, silicon photonics, and precision machinery. In addition, green manufacturing, heterogeneous integration, materials, Taiwan localization, testing, and workforce development pavilions will be returning. 

Although 3D InCites will not be attending this year, our members will be (check out the table below)! We look forward to living vicariously through all of you. If you’ll be at the show, be sure to stop by any of the following presentations and booths. 

Featured Sessions

3D IC/CoWoS for AI Summit – HIGS Series Event

Keynote session

• Wednesday, Sept. 4 from 10:55-11:15 a.m. 
• Mike Hung – ASE

The Role of Packaging in the Next Wave of Emergent Opportunities

Imec Technology Forum 

• Tuesday, Sept. 3 from 3:30-4:00 p.m. 
• Tien Wu – ASE 

Semiconductor R&D Master Forum

Talent program

• Friday, Sept. 6 from 1:40 – 3:30 p.m. 
• Mike Hung – ASE 

Member Directory

ASE Group 

Navigating the New Sensor Emerging Era

• Tuesday, Sept. 3 from 1:55 – 2:20 p.m.  
• Ryan Lai 

Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO

• Tuesday, Sept. 3 from 3:25 – 3:50 p.m.
• Vincent Lin   

The Role of Packaging in the Next Wave of Emergent Opportunities

• Tuesday, Sept. 3 from 3:30-4:00 p.m. 
• Tien Wu 

3D IC/CoWoS for AI Summit – HIGS Series Event

• Wednesday, Sept. 4 from 10:55-11:15 a.m. 
• Mike Hung

FOPLP manufacturing excellence

• Wednesday, Sept. 4 from 2:00 – 2:25 p.m. 
• Teck Lee

Path to net-zero emissions in IC assembly

• Wednesday, Sept. 4 from 3:45 – 4:05 p.m. 
• Louie Huang

Semiconductor R&D Master Forum

• Friday, Sept. 6 from 1:40 – 3:30 p.m. 
• Mike Hung

Brewer Science 

The Role of Cutting-Edge Materials in Advanced Packaging in AI and High-Performance Computing

• Friday, Sept. 6 from 12:00 – 12:20 p.m. 
• Alexander Smith 

Material efforts towards sustainable processes

• Friday, Sept. 6 from 2:20 – 2:40 p.m. 
• Douglas Guerrero

Cadence

New Era of Intelligent Heterogeneous System Design and Co-Optimization

• Thursday, Sept. 5 from 3:00 – 3:25 p.m. 
• MJ Lai

Edwards 

Driving Sustainable Transformation: Reducing Greenhouse Gas Emissions in Semiconductor Manufacturing

• Wednesday, Sept. 4 from 11:10 – 11:40 a.m. 
• Colin Reid 

EV Group 

Disruptive 3D Integration Technologies for Advanced Stacked Systems

• Friday, Sept. 6 from 2:25 – 2:45 p.m. 
• Thomas Uhrmann

HEIDENHAIN

Designing to Decrease TCO: Solutions to Hybrid Bonding Challenges

• Tuesday, Sept. 3 from 2:45 – 3:15 p.m. 
• Hervé Stämpfli

Henkel 

Recent Developments in Advanced Packaging Materials to Address In-Process and Thermo-Mechanical Challenges in 2.5, 3D, and Large Body Packages

• Tuesday, Sept. 3 from 3:25 a.m. – 3:55 p.m. 
• Ram Trichur

IBM

The Future of Computing

• Wednesday, Sept. 4 from 9:00 – 9:35 a.m. 
• Norishige Morimoto

Forum Panel Discussion

• Wednesday, Sept. 4 from 12:10 – 12:35 p.m. 
• Norishige Morimoto

Model Reprogramming: A New Alternative to Resource-Efficient Fine-tuning for AI

• Thursday, Sept. 5 from 10:05 – 10:30 a.m. 
• Pin-Yu Chen

KLA

The Via Reveal Process in High Volume 300mm Wafer Level Packaging

• Friday, Sept. 6 from 2:45 – 3:05 p.m. 
• Douglas Macfarlane and Tarran Grange

Kulicke & Soffa 

Fluxless TCB for Chiplet Integration

• Tuesday, Sept. 3 from 4:25 – 4:55 p.m.
• Samuel Goh 

Smart Manufacturing Increasing Value in Semiconductor Backend Assembly

• Thursday, Sept. 5 from 2:25 – 2:50 p.m. 
• Chan Pin Chong

Lam Research 

Deep Silicon Etch – Enabling Solutions that Support the Convergence of Sensing & AI

• Tuesday, Sept. 3 from 2:20 – 2:45 p.m. 
• Michelle Bourke 

Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI

• Wednesday, Sept. 4 from 10:40 – 11:10 a.m. 
• Martyn Coogans

Talent Program: Career Talk

• Wednesday, Sept. 4 from 1:30- 3:30 p.m. 
• Tina Li

Enabling Solutions for the High-Volume Manufacturing of GaN Devices

• Wednesday, Sept. 4 from 2:25 – 2:50 p.m. 
• David Haynes

Machine Learning in Process Model Calibration and Recipe Optimization: Cutting-Edge Techniques for Process Technology Development

• Thursday, Sept. 5 from 2:50 – 3:15 p.m. 
• Joseph Ervin 

Tackling the big problems in patterning small features

• Friday, Sept. 6 from 9:45 – 10:05 a.m. 
• Vahid Vahedi

Designing Efficient Plating-Process Computational-Models for Feature, Die, Wafer and Panel Scale Solutions

• Friday, Sept. 6 from 11:35 a.m. – 12:00 p.m. 
• Steven Mayer

Nordson Test & Inspection

Revolutionary Acoustic Technology for Wafer-Level Applications

• Thursday, Sept. 5 from 11:50 a.m. – 12:15 p.m. 
• Brad Perkins 

Onto Innovation 

Addressing Key Challenges in Enabling AI and Specialty Applications Through Unique Metrology, Inspection and Lithography Technologies

• Friday. Sept. 6 from 11:20 a.m. – 12:00 p.m. 
• Al Gamble 

PulseForge 

Enhancing Semiconductor Manufacturing with PulseForge Photonic Debonding Technology

• Tuesday, Sept. 3 from 11:45 a.m. – 12:15 p.m. 
• Vikram Turkani 

Siemens

Mask Synthesis in the Wake of GPU and ML

• Friday, Sept. 6 from 11:05 – 11:25 a.m. 
• Danping Pen 

SEMI 

SEMI Market Outlook – Semiconductor Equipment Forecasts, Fab Investment, and Material Market Outlook

• Tuesday, Sept. 3 from 2:45 – 3:10 p.m.
• Clark Tseng 

Techsearch International, Inc.

HPC Packaging Options: Silicon and RDL Interposer plus Bridges, Is There Room for Glass?

• Tuesday, Sept. 3 from 10:05 – 10:35 a.m.
• Jan Vardaman