2025 3D InCites Awards Winner Circle
The Winner’s Circle
The Technology Enablement Awards
Siemens Digital Industries Software
Siemens EDA is committed to enabling the broader adoption of heterogeneous integration driven by our Innovator3D IC technology. To be recognized by this 3DInCites award is one of the highest accolades we could ever expect.Keith Felton, Siemens EDA
Innovator3D IC platform
Siemens’ Innovator3D IC platform, introduced in September 2024, is an AI-enhanced co-design tool that ensures digital continuity using system-centric planning for die, interposer, package, and PCB design. Innovator3D IC leverages predictive modeling for power, performance, area, cost, and reliability optimization, supporting standard interfaces like the Universal Chiplet Internconnect Express (UCIe), high bandwidth memory (HBM), and Bunch of Wires (BoW). By providing early insights into thermal, mechanical, and electrical performance, it reduces design iterations and accelerates development. This comprehensive solution empowers engineers to create optimized, production-ready designs, transforming semiconductor design workflows.
ACM Research
We are honored to be recognized for our new panel electrochemical plating tool, the Ultra ECP ap-p, in this year’s Technology Enablement category. Our state-of-the-art fan-out panel-level packaging solutions demonstrate our commitment to staying ahead of the curve and meeting the evolving demands of modern electronic applications such as AI. We are proud to be a trailblazer in the FOPLP market by offering products that further advance precision panel packaging.Jim Straus, President of Sales, ACM Research
Ultra ECP
With the growing demand for AI applications requiring large chiplet GPUs and high-density HBM, the industry is shifting from traditional 300mm wafer packaging to larger substrates like 510x515mm or 600x600mm to reduce costs and improve efficiency. ACM Research’s Ultra ECP ap-p system is the first commercial high-volume copper deposition tool designed for panel-level packaging, offering advanced solutions for processes like pillar, bump, and RDL plating. Its horizontal chamber configuration is designed to ensure excellent uniformity, minimizes contamination, and supports up to 16 plating chambers. The system is operational in cleanrooms, with additional units set for deployment to customers.
MacDermid Alpha
MacDermid Alpha’s innovation continues to set a benchmark in the industry. Winning the technology enablement award is a testament to our position as a pioneer in performance chemistry. With one of the broadest product and technology portfolio offerings, our R&D and application teams continue to drive the leading edge of technology for the advanced packaging industry.Eric Gongora, VP and GM of MacDermid Alpha Wafer Level Packaging
NOVAFAB Fine Grain Copper
MacDermid Alpha Electronics Solutions addresses key challenges in heterogeneous integration (HI) and hybrid bonding with its NOVAFAB Fine Grain Copper electroplating process. Designed for high-density interconnects, this ultra-pure copper film ensures controlled grain growth during annealing, enabling defect-free bonds and enhanced device reliability. With a sub-2μm grain size, it minimizes signal degradation and meets the mechanical and electrical demands of advanced applications. Seamlessly integrating into high-volume manufacturing, NOVAFAB supports the performance and yield requirements of 3D stacking and chiplet integration, making it a reliable and scalable solution for next-gen electronics.
Saras Micro Devices
We are honored to receive the 3D Incites Technology Enablement Award for our STILE Technology. This recognition not only highlights our commitment to push the boundaries of power efficiency and performance in advanced packaging, but that STILE is a game-changing technology, enabling our customers to achieve unprecedented levels of integration and efficiency. The hard work of our team at Saras Micro Devices is deserving of this recognition! I also want to extend a special thank you to 3D Incites and judging panel!Ron Huemoeller, CEO, Saras Micro Devices
STILE
Saras Micro Devices is redefining power delivery for high-performance computing (HPC) and AI applications with its innovative STILE™ embedded capacitor and voltage regulator solutions. These products enable embedded vertical power delivery (eVPD), reducing power delivery losses and improving efficiency by shortening the power pathway and minimizing the need for surface-mount components. This approach supports higher power densities in compact designs, unlocking the full potential of chiplet-based, multi-device architectures. Manufactured in Chandler, AZ, Saras collaborates with leading semiconductor suppliers to tailor STile solutions, accelerating design cycles and advancing integration for next-generation processors.
NHanced Semiconductor
NHanced is honored to have our innovative mixed-materials heterogeneous bonding recognized as a major step forward for the industry. We worked with many partners and customers to break through barriers and bring this technology to market. I want to personally thank our NHanced team for their brilliant work and dedication – and thank you to 3D InCites for this terrific award.Bob Patti, CEO, NHanced Semiconductors
NHanced Semiconductor Inc. is revolutionizing heterogeneous 3D hybrid integration (3DHI) by overcoming challenges associated with integrating diverse materials like GaN, SiC, and LiNbO3. Using techniques such as incremental annealing and material thinning, NHanced achieves high-density interconnects with hybrid copper and covalent oxide bonding. These innovations enable the production of advanced 3DHI devices with unprecedented performance and power efficiency. By facilitating the integration of exotic materials, NHanced unlocks new possibilities, including intelligent AI-enabled IR sensors, advancing applications previously unattainable with traditional approaches.
Special Consortium Award
Resonac
It's an honor to receive the Special Consortium Award from 3D InCites! This award highlights the value of Resonac collaborative activities, and we remain dedicated to furthering innovation in advanced semiconductor packaging.Mitsukura Kazuyuki Xinau, Resonac
To address challenges in heterogeneous integration and chiplet packaging, Resonac developed the JOINT2 Consortium, which focused on fine pitch bonding, underfill materials, and advanced processes like semi-additive plating and polymer damascene. Achievements include successful 10μm pitch bonding with flux-less technology and demonstrated 1/1μm line/space capabilities. Building on this success, Resonac is leading the US-JOINT consortium in Silicon Valley, partnering with 10 global manufacturers and institutions like the Texas Institute for Electronics to accelerate R&D in advanced packaging. This initiative fosters collaboration across materials, equipment, and design to fast-track commercialization and innovation.
Engineer of the Year
Rex Anderson, Micross
I am grateful and humbled to receive this award from 3D InCites! I would not be receiving this award without the shared commitment of my colleagues at Micross Advanced Interconnect Technology to create an ecosystem that provides a wide
range of advanced packaging solutions for our customers. I am excited for the future and thankful to be a contributing member of Micross’ advanced packaging ecosystem enabling a secure post-CMOS 100mm-300mm wafer processing foundry for collaboration and innovationRex Anderson
With over 25 years of semiconductor expertise and a PhD in Nuclear Engineering from the University of Michigan, Rex Anderson has a track record of innovation at Applied Materials, Amkor, and RTI Microsystem Integration. He leads the Secure Center for Advanced Packaging of Excellence (SCAPEx), the company’s largest project under the DoD RESHAPE program, The goal is to establish a secure 300mm wafer bumping and finishing facility. Through meticulous planning and collaboration, Rex has kept the project on schedule and within budget, with the 300mm line set to launch by late 2025, solidifying Micross as a leader in advanced wafer processing.
Best Place to Work
Saras Micro Devices
We are extremely humbled to be awarded the 3D InCites ‘Best Place to Work’ award, especially as it represents the voice of our employees. It is their dedication, innovation, and collaboration that shapes our work environment and guides our success. I want to sincerely thank our team for making this achievement possible and 3D Incites for the recognition!Ron Huemoeller, CEO
Saras Micro Devices is known for its inclusive, dynamic, and thriving environment that fosters continuous learning, professional development, and employee well-being. Innovation through collaboration is central to the company’s culture, where cross-functional teams work together, and diverse perspectives drive progress. Saras celebrates diversity, equity, inclusion and belonging through team-building activities and community outreach initiatives. The company supports work-life integration with flexible hours and generous paid time off while offering competitive salaries, benefits, and performance bonuses. Saras values its employees through peer recognition and rewarding milestones with unique experiences, making it a place where careers flourish and employees feel truly valued.
