Presenting the 2025 3D InCites Awards Finalists!
For the 2025 3D InCites Awards, we settled on three distinct categories: Technology Enablement, Engineer of the Year, and Best Place to Work. These categories highlight the incredible contributions and efforts made by companies and individuals within the semiconductor and advanced packaging industries.
The Technology Enablement Awards will honor companies that have identified and solved critical challenges in the commercialization and manufacturing of HI, 3D HI, and chiplet architectures, driving the industry forward through cutting-edge solutions and advancements.
Engineer of the Year recognizes one individual whose technical expertise, innovation, and leadership have significantly impacted the development and implementation of technologies that shape the future of semiconductor packaging and integration.
Best Place to Work will celebrate companies that have fostered outstanding work environments, where innovation, collaboration, employee well-being, and professional growth are paramount, creating spaces where employees thrive both personally and professionally.
All the finalists for these awards demonstrate exceptional commitment to pushing the boundaries of technology, promoting diversity, fostering strong workplace cultures, and driving the future of the semiconductor industry.
Winners of the 2025 3D InCites Awards will be announced Tuesday, February 3, 2025. Awards will be presented in a ceremony during the IMAPS Device Packaging Conference on March 4, 2025, at 9:55am after the Keynote Sessions. View the 2025 3D InCites Awards Finalists by category below:
