This is the application you must complete if you’d like to be considered for a 2024 3D InCites Awards. The awards will be presented in the following categories:
- Advanced Technology Enablement Awards
- Engineer of the Year
- Sustainability Award
- Adele Hars Award for DEI
- Best Place to Work in Heterogeneous Integration
The Advanced Technology Enablement Awards recognizes efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
The Engineer of the Year recognizes one individual who has contributed significantly to the advancement of technologies to support the heterogeneous integration roadmap described above.
The Sustainability Award recognizes a company in the semiconductor and microelectronics industries that demonstrates best practices in support of sustainable semiconductor and microelectronics manufacturing.
The Adele Hars Award for DEI recognizes a company in the semiconductor and microelectronics industries that demonstrates best practices to provide a workplace where diversity, equity, inclusion and belonging are paramount.
The Best Place to Work in Heterogeneous Integration recognizes a company whose employees have determined that it is the best place to work in the industry.
To be considered, applicants must complete the questionnaire and submit it no later than midnight on Tuesday October 20, 2023. Applications will be reviewed by the 3D InCites Member Advisory Board, and finalists will be notified by mid-November. All finalists will be acknowledged featured in the 2024 3D InCites Yearbook.
Finalists will be required to provide additional supporting information to the advisory board, and the Best Place to Work Award will be selected through an online ballot. Winners will be notified in Mid-February and awards will be presented in a ceremony on March 19, 2024, during the opening of the IMAPS Device Packaging Conference.
