2022 3D InCites Awards Vote

Silver Sponsors:

Cast Your Vote for the 2022 3D InCites Awards!

The 2022 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration technologies. Online voting for the technology awards begins February 16 and closes February 24, 2022. Winners will be announced on the website on March 1 and will be presented at an in-person ceremony on Tuesday, March 8 as part of the Keynote Session at IMAPS Device Packaging Conference in Fountain Hills, AZ.

Important Dates:

  • Nominations Open: January 20-February 11, 2022
  • Voting Begins: February 16-February 24, 2022
  • Winners Notified: Monday, March 1, 2022
  • Awards Presented: Tuesday, March 8, 2022

The Rules:

  • The nominees are listed below by category. You can learn more about them here
  • Please vote for one per category. You are not required to vote in every category
  • You may vote one time in a 24-hour period.
  • Voting closes midnight, PST, February 24, 2022.
This poll has ended (since 2 years).

Device Manufacturer of the Year

Micross Components
38.54%
NHanced Semiconductors
36.67%
StratEdge Corporation
24.79%

Device Technology of the Year

AMD V-Cache
55.96%
Sony Stacked CMOS Image Sensor Technology with 2-Layer Transistor Pixel
31.02%
CVInc. Flex Design Package
13.02%

Engineer of the Year

Richard Otte
42.36%
Dr. Sangki Hong
30.71%
Terence Collier
26.93%

Equipment Supplier of the Year

Veeco
40.63%
ERS electronic GmbH
24.03%
FormFactor’s FRT MicroProf AP with SurfaceSens
9.80%
Lam Research
6.56%
Finetech
5.22%
MRSI Systems (Mycronic Group)
4.66%
SET
3.32%
SurplusGLOBAL
2.21%
Trymax Semiconductor Equipment BV
2.06%
JetStep X500 Lithography System from Onto Innovation
1.50%

Herb Reiter Design Tool Provider of the Year

Deca Technologies
45.98%
Cadence Design Systems, Inc. for the Integrity 3D-IC platform
32.76%
Monozukuri Technologies
14.49%
Anemoi Thermal Solver
6.77%

Materials Supplier of the Year

Atotech
23.31%
Gel-Pak Textured Film/Device Carrier (TXF)
20.73%
Indium Corporation / SiPaste® Solder Paste Series
20.46%
Heraeus Electronics
13.69%
Technic
11.52%
Ajinomoto Fine-Techno Corporation
10.30%

Process of the Year

Adaptive Patterning - Deca Technologies
24.09%
SPTS Mosaic™ Plasma Dicing
23.48%
Self-assembly process for Die-To-Wafer technology
15.09%
AT&S / FOPLP- Packaging Solutions using Large Panel Technologies
12.77%
DBI® Ultra Hybrid Bonding Process
9.12%
Technic
8.76%
X-Celeprint's Micro Transfer Printing Process for Heterogeneous Integration
6.69%

Research Institute of the Year

Fraunhofer IZM: Panel Level Packaging Consortium 2.0
41.43%
IMEC
33.02%
NCSU
12.36%
CEA
8.10%
TEL Tech Center
5.09%

Startup of the Year

Mosaic Microsystems
73.70%
Anemoi Thermal Solver
26.30%