2020 3D InCites Awards Vote

Cast Your Vote for the 2020 3D InCites Awards!

The 2020 3D InCites Awards program recognizes industry-wide contributions in the development of heterogeneous integration technologies. The event is hosted in conjunction with the International Microelectronics and Packaging Society during the IMAPS International Device Packaging Conference.

Winners of the 2020 3D InCites Awards will be selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via this online ballot. The voting begins on February 3 and ends February 13, 2020. Winners will be announced on Friday, February 14, 2020. Awards will be presented in a ceremony during the IMAPS Device Packaging Conference in Fountain Hills, AZ (March 2-5, 2020)

The Rules:

The nominees are listed below by category. You can learn more about them here
Please vote for one per category.
You may vote one time in a 24-hour period.
Voting closes midnight, PST, Thursday. February 13, 2020.

This poll has ended (since 4 years).

Design Tool Provider of the Year

zGlue / ChipBuilder 3.0

38.36%

Coventor, a Lam Research Company - SEMulator 3D

36.71%

ANSYS

24.93%

Device Manufacturer of the Year

OmniVision Technologies, Inc.

40.21%

ASE Group

30.12%

Nepes

15.55%

StratEdge

14.11%

Device Technology of the Year

TSMC's SoIC™

33.25%

SmartSens - SC132GS (Metis)

25.19%

OmniVision’s OX08A and OX08B Automotive Image Sensors

18.42%

3D Integration For HPC & AI, CEA-Leti

14.13%

Co-EMIB (Intel EMIB and Foveros combined)

9.01%

Engineer of the Year

Dr. Doug Yu, Vice President of Integrated Interconnect and Packaging, TSMC

31.36%

Beth Keser and Steffen Kröhnert, Co Authors, Advancements in Embedded and FOWLP Technologies

30.37%

Laura Mirkarimi, Xperi

17.61%

Annette Teng, Ph.D., CTO, Promex

11.26%

Bill Chen, Chair, HIR and Fellow, ASE Group

9.40%

Equipment Supplier of the Year

EV Group (SmartView® NT3 Automated Bond Alignment System)

43.82%

ERS electronic GmbH

41.66%

Onto Innovation Inc.

14.52%

Materials Supplier of the Year

Brewer Science

38.00%

Plan Optik AG

35.47%

Atotech Group

26.53%

Process of the Year

Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL, 3DiS Technologies

27.92%

DBI® Ultra, Xperi

18.17%

Cu-Interposer Technology, Plan Optik

17.33%

Quazi-Zero Die Shift, Brewer Science

17.15%

ChipInFlex: Wafer Level Integration Of Thin Silicon Bare Dies Within Flexible Label, CEA - Leti

13.00%

Vacuum Cure, YES

6.44%

Research Institute of the Year

Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany

47.40%

UCLA Center for Heterogeneous Integration and Performance Scaling

27.90%

CEA-Leti

24.70%

Startup of the Year

Sensry GmbH, Dresden, Germany

41.49%

SVXR

21.71%

FLICQ

20.90%

Rohinni LLC

15.89%

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