Submit your 2020 3D InCites Awards nomination to recognize excellence in heterogeneous integration.
Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.
Winners will be selected by a panel of five judges: four are industry experts and the fifth judge is YOU, the 3D InCites Community, via the online ballot.
2020 Judges Panel
Techsearch International, Inc.
Yole Développement
Microtech Ventures, Inc.
3D Integration Expert
Nominations are now closed!
See who has been nominated!
The voting begins on February 3 and ends February 13, 2020. Winners will be announced on Friday, February 14, 2020 and awards will be presented in a ceremony during the IMAPS Device Packaging Conference in Fountain Hills, AZ (March 2-5, 2020).
Important Dates:
- Nominations open January 13, 2020, and closes on January 29, 2020.
- Voting begins February 3, 2020, and closes on February 14, 2020.
- Winners will be announced Monday, February 17. 2020
Learn more about the awards
There is no fee for submitting a 2020 3D InCites Awards nomination, but we welcome donations in any amount, which will be donated to for STEM education.
