Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025 Critical Materials Council (CMC) Conference in Austin, Texas.
Dr. Chacko will deliver a technical presentation titled “Temporary Bonding Materials for Chiplet Integration” on April 10th at 10:20 a.m., highlighting Brewer Science’s latest advancements in enabling the next generation of semiconductor packaging.
Heterogeneous integration and ultrathin dies rely on optimized TBDB processes
As the semiconductor industry moves toward heterogeneous integration and advanced chiplet-based architectures, the ability to handle ultrathin dies presents significant manufacturing challenges. Brewer Science’s BrewerBOND® VersaLayer System materials are designed to optimize temporary bonding and debonding (TBDB) processes, offering a reliable, scalable, and cost-effective solution for thin die handling, wafer thinning, and advanced packaging applications such as die-to-wafer (D2W) hybrid bonding and fan-out wafer-level packaging (FOWLP).
Dr. Chacko will discuss how Brewer Science’s innovative bonding process minimizes process steps, reduces die warpage, and enhances throughput for advanced semiconductor packaging.
For more information, visit www.brewerscience.com or connect with us at the conference.