Are you heading to SEMICON China this year? Taking place from March 26-28 at SNIEC in Shanghai, SEMICON China will feature programs on IC manufacturing, supply chain management, compound semiconductors, sustainability, workforce development, and more. Six of our 3D InCites member companies will be presenting, and 11 will be exhibiting. If you’re thinking about attending, registration is open! But for now, check out our community member preview.
Did we miss your booth or presentation? If so, please reach out to jmc@3dincites.com for assistance.
ASE
Heterogeneous Integration and Packaging Solution
- Scott Chen
- Tuesday, March 25 from 10:30-11 a.m.
Edwards
Panel Discussion – Topic TBD
- Jason Xu
- Friday, March 28 from 10:30-11 a.m.
Lam Research
Enable Endless Possibilities of Heterogeneous Integration by Exploring Panel Level Packaging
- Frank Su
- Tuesday, March 25 from 2-2:20 p.m.
Title TBD
- Sun Lifei
- Thursday, March 27 from 10:10-10:30 a.m.
Preparing for GaN Device Manufacturing at 300mm
- David Haynes
- Thursday, March 27 from 2:50-3:15 p.m.
Onto Innovation
High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies
- Mike Rosa
- Thursday, March 27 from 2-2:25 p.m.
TechSearch International
Markets and Applications for Chiplets: Enabling High-Performance Packaging
- Jan Vardaman
- Tuesday, March 25 from 4:40-5 p.m.
Veeco
Novel Techniques for Production Molecular Beam Epitaxy
- Matthew Marek
- Wednesday, March 26 from 2:50-3:15 p.m.
Member Exhibits
