In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future of technology. New innovations in microelectronics, packaging, and automotive systems highlighted the industry’s focus on efficiency and performance. Major acquisitions reinforced the growing emphasis on secure manufacturing and connectivity, while companies expanded their global presence to strengthen market reach. Industry leaders gathered at conferences, reflecting a continued push towards innovation and collaboration. As the landscape evolves, these developments continue to underscore the industry’s commitment to progress and technological excellence.
Corporate Expansion & Market Growth
Koh Young America expanded its sales network to include Colorado and Utah, offering its electronic assembly products to these regions. The expansion is part of the company’s efforts to enhance its reach and support customers in the growing semiconductor and electronics markets.
Saras Micro Devices is reportedly advancing semiconductor research through funding from Chips Act initiatives. The funding will support the company’s efforts to drive innovation in semiconductor manufacturing and address key challenges in the industry
Surplus Global established a new European branch in Munich, Germany, and appointed a Europe, Middle East, and Africa (EMEA) manager to oversee operations. The move strengthens Surplus Global’s position in the European semiconductor market and expands its customer base in the region.
PDF Solutions finalized the acquisition of secureWIse, LLC from Telit Cinterion IoT Solutions Inc., expanding its capabilities in secure remote connectivity for manufacturing equipment. The acquisition is intended to enhance secure data exchange and collaboration across semiconductor and high-tech industries.
Technological Showcases
StratEdge Corporation showcased its latest molded ceramic package configurations at the IMAPS Device Packaging Conference (March 3-4, Phoenix, AZ) and the GOMACTech Conference (March 18-19, Pasadena, CA). The company’s packages are designed for RF, microwave, and millimeter-wave applications, with options intended to enhance heat dissipation for high-power devices used in defense, aerospace, and other industries.
StratEdge also introduced updates to its Molded Ceramic Series datasheet, providing details on available package configurations.
Excellum recently introduced the MetalJet F1016, a 160 kV microfocus X-ray source that reportedly is capable of delivering up to 1600 W of power at a 30 µm spot size. This development is intended to meet the increasing demands of high-throughput industrial inspection and cutting-edge research.
Brewer Science showcased its latest water quality sensor innovations at NetFlex Innovation Days 2025. The company highlighted advancements in environmental sensing technologies, which are crucial for semiconductor manufacturing and the semiconductor industry’s commitment to sustainability. In a keynote address, Dr. Terry Brewer reflected on Nextflex’s 10th anniversary and the future of hybrid electronics, emphasizing decentralized, intelligent system design inspired by nature’s adaptability.
Indium Corporation showcased its commitment to sustainability at APEC 2025 by demonstrating eco-friendly soldering materials. The company aims to promote greener solutions for the electronics industry while maintaining high performance and reliability in its products. It also presented its latest solder and thermal innovations at IPC APEX Expo 2025 in Anaheim, CA, covering advancements in void reduction, mixed-alloy solder, supercooled solder materials, and high-speed liquid metal paste dispensing. The company also highlighted phase-change metal thermal interface materials for enhanced thermal management.
Koh Young showcased its latest inspection innovations at IPC APEX Expo 2025. The company highlighted advanced inspection solutions that improve quality and efficiency of electronic manufacturing processes, ensuring higher standards in product assembly.
The company also introduced a new approach to evaluating Automated Optical Inspection (AOI) systems with its Benchmark Board, reportedly offering a more objective and realistic method of comparison. Much like the ADAC crash test for cards, which helps consumers assess safety, the Benchmark Board is intended to accurately compare AOI systems. Koh Young is hosting a webinar on April 3, 2025, from 10:00 to 11:00 AM, led by Axel Lindloff, to discuss how demo boards can mislead buyers and how the Benchmark Board may offer a reliable solution.
Conferences & Industry Events
ASE participated in the International Solid-State Circuits Conference (ISSCC) 2025 and the Heterogenous Integration Roadmap (HIR) Symposium 2025, where the discussions focused on heterogeneous integration, chiplets, and advanced packaging. CP Hung delivered a presentation on heterogeneous integration technologies for SatCom applications, while keynote speakers from Intel, MIT, Samsung, and Infineon highlighted advancements in interconnect efficiency, robotics, memory, and automotive digitalization.
At the HIR Symposium, industry professionals discussed power, thermal management, materials, and interconnectivity, emphasizing the role of Heterogeneous Integration Roadmaps in shaping semiconductor manufacturing.
SEMI’s Maria Daniel Perez participated in ISS Europe 2025 in Sopot, Poland, moderating the panel discussion “Empowering Europe’s Workforce: Addressing Talent Gaps for Sustainable Growth.” The session explored talent challenges in the semiconductor industry, strategies for bridging skills gaps, and the role of AI and innovation in workforce sustainability.
Additionally, SEMI’s MEMS and Sensors Technical Congress (MSTC) 2025 focused on strategies for bringing advancements in MEMS and sensors to market this month from 26-2. The event will explore cutting-edge technologies and challenges in MEMS and sensor integration, with a focus on market readiness and industry collaboration.
The IMAPS 21st Annual Device Packaging Conference took place at Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. This international event, organized by the International Microelectronics Assembly and Packaging Society, provided a platform for professionals to exchange knowledge. It featured keynote presentations, technical sessions on topics like Heterogeneous Integration and Emerging Technologies, and networking opportunities for attendees in the microelectronics packaging field.
Finetech recently participated in LASER World Photonics China 2025, held at the Shanghai New International Expo Centre. They showcased high-precision die bonding solutions for photonics applications, offering live demos of their manual to fully automated systems.
Brewer Science will advance semiconductor growth in the Midwest at SEMIEXPO Heartland 2025, demonstrating its leadership in material innovations for the semiconductor industry. The company will present new technologies designed to support the region’s expanding semiconductor market.
Evatec attended the 2025 Glass Substrate TGV Industry Chain Summit Forum from March 19-20 in Jiangsu, Suzhou, China. During the event, Yuan Lu, Evatec’s Technical Marketing Manager, presented “From Circle to Square – Evatec’s Etching and Sputtering Solutions for Advanced Packaging FOPLP.” His presentation covered the technical features of the Evatec CLUSTERLINE®600, focusing on the Ti Cu sputtering process for RDL and DRIE etching process.
IMAPS’s 18th European Advanced Technology Workshop on Miropacking and Thermal Management took place March 26-27, 2025, in La Rochelle, France. This event focused on the ongoing challenges and innovations in thermal management across industries such as aerospace, automotive, consumer, industrial, and military sectors. Key topics included advancements in system-level thermal management, power electronics, materials, and testing techniques, as well as innovative cooling solutions like two-phase technologies and liquid cooling.
SEMI Foundation’s “Chips & Childcare” program helps semiconductor companies navigate childcare planning to support employees and enhance workforce development. Key insights from recent work include: many employees qualify for publicly funded childcare but don’t access it, shift workers face challenges in finding evening/overnight care, and custom childcare plans can improve employee retention and productivity. Join the webinar on April 8 to learn from Policy Equity Group, TSMC AZ, and Calumet Electronics Corporation. Register here.
Company Achievements & Milestones
EV Group introduced its next-generation Gemini automated production wafer bonding system, designed to advance 300-mm MEMS manufacturing. The system aims to improve throughput and precision in MEMS production, supporting the growing demand for high-performance microelectromechanical systems.
ASE partnered with Ainos to drive advancements in AI scent digitization within semiconductor manufacturing. This collaboration seeks to innovate the production process by integrating artificial intelligence for real-time sending and enhanced manufacturing capabilities.
MacDermid Alpha unveiled its new product range ‘Low Alpha Tin’ – innovative technology designed to address the growing problem of soft errors caused by alpha emissions in next-generation semiconductors. As smaller, complex, and functional demands increase, the challenge of minimizing alpha particle emissions, which can disrupt performance and reliability, even in tiny amounts. Reducing alpha emissions lowers the risk of these potentially catastrophic errors.
Mycronic’s Global Technologies Division acquired hProbe, a provider of testing solutions for semiconductor devices. The acquisition aims to enhance Mycronic’s portfolio in advanced semiconductor test systems, aligning with its commitment to enabling higher-performance production for its customers.
Circuits Integrated was recognized as one of the top 8 space companies in Greece by F6S this month. This recognition reflects the company’s dedication to providing fast, ubiquitous, and downtime-free communications globally.
The company also won the Launch Pad competition at the inaugural Farnborough International Space Show, where CEO Paolo Fiorvanti presented the company’s FPA chip technology. The technology and pitch were assessed based on innovation, market impact, and team strength. The team expressed gratitude to the Farnborough International Space Show, judges, and supporters, with excitement about continuing to help in advancing the industry.
Adeia was recognized as one of the Most Innovative Companies to Watch in 2025 by The CEO Vision. The company is recognized for its contributions to hybrid bonding technology in semiconductors, as well as its work in media streaming and AI-driven content discovery. These innovations are intended to support the evolution of digital experiences.
Surplus Global announced a milestone achievement that they have reached of shipping over 3,000 semiconductor tools annually. Today, the company is shipping 50 units of their UF3000 system; a tool designed for advanced wafer processing.
DR YIELD is celebrating its 20th anniversary with a stylish twist, unveiling new hoodies featuring their logo and a special “20 Years” detail on the sleeve. The office briefly transformed into a pop-up fashion boutique as the hoodies stacked up, serving as a token of appreciation for the team members who’ve contributed to the company’s journey.
ACM Research announced the qualification of its high-temperature SPM tool for a customer in China. This achievement represents a significant step forward in advanced semiconductor process technology, offering enhanced capabilities for high-temperature applications in semiconductor manufacturing.
Recognition & Awards
Siemens is collaborating with Axiom Space, providing Siemens Xcelerator software to enhance the development of commercial space stations and spacesuits. The integration of digital twin and digital thread technologies is intended to streamline design, manufacturing, and operational processes, improving efficiency and cost management. Axiom Space will reportedly be able to test and simulate designs before production, enabling greater flexibility and workflow integration.
Indium Corporation’s Dr. Yan Liu, Director of Global R&D, was recognized as the Manufacturer’s Association of Central New York (MACNY) 2025 Innovator of the Year for her contributions to solder materials and flux technology. With over two decades at Indium Corporation, she has contributed to R&D efforts globally, progressing advancements in high-performance materials. She will be honored at MACNY’s 112th Annual Celebration of Manufacturing on May 22, 2025, in Syracuse, NY.
Brewer Science‘s Dr. Douglas Guerrero has been honored as The International Society for Optics and Photonics (SPIE) Fellow. This recognition highlights his significant contributions to the semiconductor and photonics industries, particularly in the development of innovative materials and processes.
Hiring & Career Opportunities
Veeco is hiring for a Senior Engineer which will focus on cutting-edge engineering, product design, and development within the semiconductor industry. Apply here.
They are also hiring for a Product Engineer which will work closely with R&D and production teams to improve and develop new products in the semiconductor space. Apply here.
Veeco is also seeking candidates for the Electrical Engineer – Early Career (NCG) Program, along with other positions. The program is designed to provide hands-on experience in semiconductor manufacturing technology and engineering development.
For more details and to explore additional job openings, visit: Veeco Job Listing.
Onto Innovation is seeking a Field Services Engineer in Albuquerque, New Mexico, focused on equipment troubleshooting and customer support. Apply here.
LPKF Laser & Electronics is hiring for multiple roles in laser-based manufacturing solutions, supporting technology development and innovation. Explore openings.
In Memoriam
We were deeply saddened to learn of the sudden passing of Paul Werbaneth, a regular contributor to 3D InCites over the years, and a longtime member of our technical advisory board. His contributions to the semiconductor industry and his passion for innovation left a lasting impact on colleagues and friends alike. Paul’s warmth, knowledge, and enthusiasm will be greatly missed by all who had the privilege of knowing him. May his legacy continue to inspire those whose lives he touched. Paul’s posts were pure poetry. Read Françoise’s tribute to Paul here.
Many were shocked and saddened to hear of the unexpected passing of Shellback Semiconductor’s CEO and co-owner, Wayne Jeveli. The post shared on LinkedIn described Wayne as a driving force behind Shellback’s vision, values, and growth. It cited Wayne’s passion, integrity, and commitment to the company he helped found and named to reflect his naval background. A well-known figure in the semiconductor industry, his loss will be deeply felt across the entire semiconductor community. According to the same post, Graham Stone, Shellback’s co-owner and board member has stepped in as CEO, to ensure uninterrupted service to Shellback’s customers and supply chain partners.
Onto Innovation announced with profound sadness the passing of Paul F. McLaughlin, former CEO of Rudolph Technologies, who led the company from 1996 to 2015. Under his leadership, Rudolph Technologies became a key supplier of process control equipment for the semiconductor industry. McLaughlin played a pivotal role in the company’s IPO in 1999 and the acquisition of August Technology in 2006, both critical to its future growth in process control. His legacy of leadership, vision, and dedication to the industry will be remembered fondly by all who worked with him.
