SEMICON Korea 2025 Member Preview: Lead the Edge

In its continued focus on AI and smart devices, SEMI’s theme for this SEMICON Korea 2025 is “Lead the Edge”. The program focuses on how AI, advanced packaging and sustainable semiconductor manufacturing are “transforming chip design, manufacturing processes and the global supply chain.” As such more than 500 semiconductor companies will welcome 70K attendees to their collective 2301 booths.

All of these key areas are sweet spots for 3D InCites member companies, who are leaders in these sectors. To help you navigate this massive event and find our members, we’ve created this easy guide.

Keynote Talks

Wednesday Feb. 19, 10:20-Noon, Auditorium, 3F, COEX

Executives from Samsung, imec, set the tone with aspirational talks on the future of the semiconductor industry, and how it will provide a versatile and improved life for mankind. Keynoters from AMD, Applied Materials, and Synopsys will address the need to improve energy efficiency of semiconductors, and how to get there through innovation and collaboration.

Topics of Interest Throughout the Week

Many forums, the SEMI Technology Symposium (STS), and technology tutorials run concurrently throughout the week. Topics range from market updates, to sustainability, investments, metrology and inspection, smart manufacturing, women in technology, workforce development, and more; as well as the SEMI’s Climate Consortium.

Here’s where you’ll find our members presenting:

Market Trends Forum

SEMI Market Outlook – Semiconductor Equipment Forecasts, Fab Investment and Material Market Outlook
Clark Tseng, SEMI
Wed. Feb 19, 4-4:30pm

Sustainability Forum

Identification, Understanding, Reduction; Edwards’ Vision to Help the Semiconductor Industry Manage the PFAS Challenge
Chris Jones, Edwards
Wed. Feb 19, 1:30 – 2:00 pm

Test Forum

Why is Advanced Packaging So Important?
Jan Vardaman, TechSearch International, Inc.
Wed. Feb 19, 4:05 – 4:35pm

Packaging Tutorial

Advanced Technology Trends of Semiconductor Package
Min Suk Suh, Camtek Korea
Thurs. Feb 20, 10:30 -11:45 am

MI Forum

Memory Defect Baseline Defect Reduction with Un-Patterned Wafer Inspection
Qiguang Li KLA
Thurs. Feb 20, 11:00 – 11:30am

The Next Wave of Convergence: Panel-Level Packaging with Co-Packaged Optics
Sang Hyun Han Nova
Thurs. Feb 20m 2:30-3pm

Enabling High Yield Bumping and Hybrid Bonding Processes for AI Packaging
Damon Tsai, Onto Innovation
Thurs. Feb 20, 3:00 – 3:30pm

Smart Manufacturing Forum

Digital Twin and Big Data Towards Smart Manufacturing and Industry 4.0 for Advanced Packaging Technologies
Chan Pin Chong, Kulicke & Soffa
Thurs. Feb. 20, 4:30-4:55