Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions:
Heat-Spring® HSx (New)
- Newest pattern designed for large area dies with warpage >200 microns
- Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
- Designed for test heads where clamping forces are limited to <30psi
- Thickness ranging from 300 micron up to 1mm
- Available with or without a diffusion barrier to prevent staining of the die
Heat-Spring® HSD
- The original and best standard option for interfaces with flat, smooth, and parallel surfaces
- Designed for interfaces with tight surface control >30psi
Heat-Spring® High Profile Preforms
- Patterned to optimize contact with non-planar surfaces delivering 86W/mK
- Ideal for assemblies with an extruded, unfinished heat-sink
- Recommended for immersion cooling and burn-in applications
- Provides uniform contact between the burn-in head and the DUT
- Provides more uniform thermal conductivity
Heat-Spring® HSK
- Recommended specifically for burn-in applications where multiple insertions are required
- Provides uniform contact with low resistance for high-density heat loads
- Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
- No staining or cracking
All Heat-Spring® products are recyclable and reclaimable.
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at indium.com/TIMs.
