IMAPS Device Packaging Conference 2025 Member Preview

3D InCites is excited to be the official industry partner of the 2025 IMAPS Device Packaging Conference (DPC) this March. With such a strong member presence this year, I’m looking forward to meeting so many of you during the course of the event! 

Taking place from March 3-6 in Phoenix at the Sheraton Grand at Wild Horse Pass, this year’s event will feature several technical presentations on 2D and 3D integration, FOWLP, panel level and flip chip packaging, and more. IMAPS DPC will also offer 16 technical presentations and several networking opportunities throughout the conference. 

Our member company, LQDX, will be sponsoring this year’s  3D InCites Backyard Olympics on Wednesday, March 5 from 3:30 – 5:25 p.m. outside on the Hemapik Lawn. Following the DPC poster sessions, teams of four will be competing for gold, silver, and bronze medals in each event. 

• Cornhole 
• Golf chipping 
• Axe throwing 
• Ring toss 
• Pong 

Stop by and enjoy a beer at the open bar, or meet us at booth 701 at any time during the conference. Game sponsorships are still available, and teams and individuals can register here. 

Also, be sure to join us for the 3D InCites Awards on Tuesday, March 4 from 9:45 – 10:10 a.m. Francoise will be announcing the 2025 winners!

With 16 member companies presenting and 18 exhibiting, this list breaks down all of our member activities. 

Adeia 

Advances in Surface Preparation for Die-to-Wafer Hybrid Bonding Stacking

• Guilian Gao, Gill Fountain, Laura Mirkarimi, Rajan Gangadharan, Dominik Suwito, Arianna Avellan, Thomas Workman, Bongsub Lee
• Wednesday, March 5 from 1-1:30 p.m. 

Amkor 

Chiplets and Advanced IC Packaging: Evolution and Tradeoffs

• Michael Kelly, Dave Hiner, Suresh Jayaraman 
• Tuesday, March 4 from 11:15-11:45 a.m. 

Firewalls in Semiconductor Assembly

• Prasad Dhond
• Tuesday, March 4 from 11:45 a.m. – 12:15 p.m.

Metal TIM for Advanced FCBGA packages

• Chandrashekhar Pendyala, Elizabeth Fortin, Wei Lin, Mike Kelly
• Tuesday, March 4 from 2-2:30 p.m. 

Small Form Factor MEMS & Sensor Packages

• Lawrence Natan, Adrian Arcedera
• Tuesday, March 4 from 4-4:30 p.m. 

A Novel Package Structure for Enhancing Power Integrity Performance and Cost Efficiency

• MinWon Park, TaeYong Lee
• Tuesday, March 4 from 4-4:30 p.m. 

A New Optical Packaging Platform for Automotive Optical Sensors

• Weilung Lu, Adrian Arcedera
• Tuesday, March 4 from 4:30-5 p.m. 

A Large Body Lidded FCBGA Thermal Performance Study with Indium-Silver Alloy TIM

• YoungDo Kweon, SangHyuk Kim, MinJae Kong
• Tuesday, March 4 from 4-5:30 p.m. 

IMAPS Poster Session Happy Hour: Advanced Package Production Testing

• Vineet Pancholi
• Wednesday, March 5 from 5:30-9:30 p.m. 

ASE 

PDC7: System-in-Package (SiP) – System Solutions Through Miniaturization 

• Mark Gerber
• Monday, March 3 from 10:30 a.m. – 12:30 p.m. 

PDC15: The Evolution of Flip Chip Package Technology 

• Mark Gerber
• Monday, March 3 from 3:30-5:30 p.m. 

Warpage Evaluation in Embedded Bridge Packages for Advanced Packaging Solutions

• Wiwy Wudjud, Chieh Lo, Lihong Cao, Chin-Li Kao, FY Chen, Yungshun Chang, YiHsien Wu
• Tuesday, March 4 from 4:30-5 p.m. 

Advanced Packaging and Optical Assembly for Co-Packaged Optics

• Sinyuan Mu, ChiaSheng Cheng, Rong Yang, Meiju Lu, Jihan Chen
• Wednesday, March 5 from 1:30-2 p.m. 

Deca & ASE Cost Impact of a Bridge Die in a 600 mm Format

• Jen-Kuang Fang, Ping-Feng Yang, Sheng-Feng Huang, Ping-Ching Shen
• Thursday, March 6 from 11:30 a.m. – 12 p.m. 

Deca

QFN Reimagined: Molded Panel Fan-out Solutions for Cost Efficiency and Scalability

• Chevie Castillo 
• Tuesday, March 4 from 10:45- 11:15 a.m. 

M-Series Molded Interposer Technology (M FIT)

• Robin Davis 
• Tuesday, March 4 from 2-3:30 p.m. 

Achieving Higher Density Embedded Bridge Die Interposers Using Adaptive Patterning

• John Erickson Talain, Jan Kellar, Gaurang Gunde, Tim Olson
• Tuesday, March 4 from 10:45 a.m. – 12:45 p.m. 

Deca & ASE Cost Impact of a Bridge Die in a 600 mm Format

• Clifford Sandstrom, Timothy Olson, Benedict San Jose
• Thursday, March 6 from 11:30 a.m. – 12 p.m. 

Evatec 

Advanced Packaging Innovations for AI and HPC: Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness Optimization 

• Markus Frei, Roland Rettenmeier, Kenton Read, Ewald Strolz, Riccardo Morciano, Patrick Carazzetti
• Thursday, March 6 from 11-11:30 a.m. 

Fraunhofer IZM 

PDC1: Fundamentals of Substrates for High-Frequency Packaging and Heterogeneous Integration (Part 1) 

• Ivan Ndip 
• Monday, March 3 from 8-10 a.m. 

PDC8: Packaging Technologies, Materials and Applications of Antenna-in/on-Package 

• Ivan Ndip 
• Monday, March 3 from 10:30 a.m. – 12:30 p.m. 

PDC9: Fundamentals of Substrates for High-Frequency Packaging and Heterogeneous Integration (Part 2)

• Ivan Ndip 
• Monday, March 3 from 1-3 p.m. 

Innovative High-Density Adaptive Redistribution Technology for High I/O Embedded Devices

• Lars Böttcher
• Tuesday, March 4 from 3-3:30 p.m. 

IMAPS Poster Session Happy Hour: Recent Developments in 2.5 and 3D Heterogeneous Integration on 300 mm Wafers for Next Level of Advanced Packaging

• Manuela Junghaehnel, Frank Windrich
• Wednesday, March 5 from 5:30-9:30 p.m. 

Indium 

SAC305 Solder Electromigration Kinetics

• Hongwen Zhang
• Thursday, March 6 from 10-10:30 a.m. 

KLA 

Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding Interconnect

• Mike Pavlov, Artyom Duev, Danni Lin, Eugene Shalyt
• Wednesday, March 5 from 1:30-2 p.m. 

Kulicke & Soffa 

Advances in Vertical Wire Bonding for Through Mold Interconnect and Fan Out Wafer Level Packages

• John Foley, Daniel Tan 
• Tuesday, March 4 from 11:15-11:45 a.m. 

LQDX 

Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal Ink

• Sue Kao, Simon McElrea, Gibran Liezer Esquenazi, Sunity Sharma
• Tuesday, March 4 from 3-3:30 p.m. 

MacDermid Alpha 

Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding

• Jianwen Han, Pingping Ye, Stephan Braye, Abdelhamid ElSawy, Harshul Khanna, Veronica Lambert, Adam Letize, Kyle Whitten, Thomas Richardson, Elie Najjar
• Wednesday, March 5 from 2-2:30 p.m. 

Electrochemical Plating of Metastable Fine Rain Cu for Cu-Cu Hybrid Bonding Application 

• Jianwen Han, Pingping Ye, Abdelhamid EISawy, Stephan Braye, Veronica Lambert, Harshul Khanna, Adam Letize, Kyle Whitten, Thomas Richardson, Elie Najjar
• Wednesday, March 5 from 2:30-3 p.m. 

NHanced Semiconductors 

Si Interposer 2.5D Test Platform for Thermo-Mechanical Simulation and Reliability Studies in Extreme-Environments

• Josh Atwater, Pete Conway
• Wednesday, March 5 from 5-5:30 p.m. 

Saras Micro Devices 

Saras eVR STile – Enabling the Next Generation of AI & HPC Power Delivery Network Designs

• Bartlet DeProspo, Eelco Bergman
• Thursday, March 6 from 11-11:30 a.m. 

Siemens EDA

Multi Physics Analysis of 3D Integrated Circuits

• Tarek Ramadan
• Thursday, March 6 from 10-10:30 a.m. 

TechSearch International

Evening Panel Session: Preparing for the Coming AI Winter

• Jan Vardaman 
• Tuesday, March 4 from 6:30-7:30 p.m. 

Global Business Council Plenary Session: Scaling of AI From Datacenter to Consumer

• Jan Vardaman 
• Wednesday, March 5 from 10:50-11:20 a.m,

YES 

Advanced Fabrication Techniques for Through Glass Via (TGV) Metallization in Glass Core Substrates for 3D Advanced Packaging Applications 

• Venugopal Govindarajulu, Purnima Narayanan, Vladimir Kudriavtsev, Coby Tao, Rajeev Bajaj, Zia Karim
• Tuesday, March 4 from 10:45 a.m. – 12:45 p.m.

IMAPS Poster Session Happy Hour: Optimizing Flow Dynamics and Deposition Uniformity in Electroless Processing of Glass Panels

• Vladimir Kudriavtsev, Rajeev Bajaj, Chris Lane, Zia Karim
• Wednesday, March 5 from 5:30-9:30 p.m. 

Member Exhibits