CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship facilities will establish world-class advanced semiconductor R&D in the United States. “They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across the semiconductor value chain, including universities, small businesses, large manufacturers, and government agencies, and help build vibrant semiconductor ecosystems in the U.S. that bolster cutting-edge R&D and create quality jobs.”
Specifically, these first three facilities will:
- Accelerate innovation by enabling world class R&D across the full range of microelectronics technical areas—including access to extreme ultra violet (EUV lithography, which is needed for research using the most advanced patterning technology
- Create differentiation to ensure there is a clear value to the semiconductor ecosystem beyond existing comparable facilities
- Be financially sustainable by creating enduring value for decades and attracting investment from all types and sizes of companies
- Be independent and neutral by enabling Natcast, on behalf of the NSTC, and the NAPMP to make strategic decisions about the operation of the facilities, and by ensuring that the facilities are places where all member entities and their employees have the opportunity to successfully innovate
- Exist in thriving and vibrant ecosystems that can provide, foster, and grow a talented workforce and a robust ecosystem of semiconductor companies, educational and research institutions, and local support to advance the mission.
Albany, NY
In October of 2024 the Department of Commerce and Natcast [the operator of the National Semiconductor Technology Center (NSTC)], announced that the Albany NanoTech Complex in Albany, New York, was the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within this site supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state-of-the-art EUV technology and the R&D that relies on it.
Sunnyvale CA
In Nov of 2024 the Department of Commerce and Natcast, announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility. The DCF will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.
Arizona State chosen as Third CHIPS for America R&D Flagship Facility
The Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.
The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility,
will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. This newly constructed facility is expected to be operational in 2028 and will play a key role in driving U.S. leadership in semiconductor innovation, economic growth, and national security.
The PPF’s prototyping capabilities will consist of at least one 300mm full-flow complementary metal-oxide-semiconductor (CMOS) technology as a stable baseline for experiments. The facility will also allow for a variety of R&D in a manufacturing-like environment that would not be feasible at a manufacturing site, including novel materials and device architectures. Key packaging capabilities are expected to include a baseline advanced packaging piloting line to enable the development and commercialization of new packaging processes
What about Texas?
IFTLE’s understanding is that The Texas Institute for Electronics (TIE), while part of the broader effort to boost the U.S. semiconductor industry, is NOT one of the three CHIPS for America flagship facilities. TIE is a consortium supported by the University of Texas at Austin, and it has received significant funding to develop advanced semiconductor technologies, particularly for defense applications. There is considerable focus on focus on 3D Heterogeneous Integration (3DHI) technology and pilot manufacturing capabilities.
Government Packaging Programs
A lot of you readers have shared that the government advanced packaging programs are at the very least confusing. IFTLE has created the table below to try to compare the programs, their supporting organizations, focus and timelines. If anyone sees any errors in this table please let me know.
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Feature image: Researchers work inside the clean room area at the MacroTechnology Works facility in the ASU Research Park in Tempe, Arizona. Photo by Deanna Dent/Arizona State Universit
