February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and notable leadership updates. From breakthrough product launches and major acquisitions to industry collaborations, here’s a look at what our members achieved this month.
Technology Innovation and Product Developments
Nordson Electronics Solutions introduced the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station, designed to maintain conformal coating equipment by preventing needle and needle clogging during electronics manufacturing. This programmable system utilizes high-frequency ultrasonic waves to remove material buildup non-invasively, enhancing production efficiency and reducing maintenance costs. The cleaning station integrates with the coater’s self-leveling solvent system and can be scheduled through ASYMTEK’s EasyCoat® 6 software. A demonstration is planned at IPC APEX booth #d3200 from March 18-20 in Anaheim, California.
PulseForge and Global Zeus introduced a Fully-Automated Photonic Debonder for advanced semiconductor manufacturing, aiming to enhance AI chip production. This system utilizes high-intensity pulsed light for damage-free wafer debonding, supporting heterogeneous integration and advanced packaging. The first units are slated for installation by various U.S. integrated device manufacturers. Demonstrations were available at SEMICON Korea 2025, where the Debonder was on full display.
Industry Events and Presentations
The IEEE 2025 Hybrid Bonding Symposium in Silicon Valley brought together over 200 industry leaders to discuss advancements in semiconductor packaging. As a Gold Sponsor, Adeia played a key role in the event, with Dr. Guillian Gao delivering the opening keynote on emerging opportunities and challenges in hybrid bonding implementation.
The symposium featured insights from experts at Sony, NHanced Semiconductors, UCLA, IMEC, and Tohoku University, covering topics such as design methodologies, equipment evolution, and materials science. Discussions emphasized hybrid bonding’s increasing sophistication and its critical role in enabling next-generation semiconductor architectures.
ASE sponsored the 8th Annual Heterogenous Integration Symposium this month, which focused on AI, energy efficiency, and advanced packaging metrology. The event served as a key forum for the industry to discuss the latest advancements in these areas.
EV Group (EVG) showcased its IR LayerRelease™ temporary bonding and debonding solution at SEMICON Korea 2025 in Seoul this February. This technology is said to enhance the production of high-bandwidth memory (HMB) and 3D stacked DRAM devices by enabling the use of thinner dies through laser bonding, eliminating the need for mechanical processes. IR LayerRelease™ offers improved precision, yield, and cost-effectiveness, supporting advancements in AI accelerators and high-performance computing applications.
Nova participated in SPIE Advanced Lithography + Patterning 2025, which took place February 23-27 in San Jose, California. The company presented a short course on scatterometry led by Igor Turovets (Nova Ltd.) and Hugo Cramer (ASML) and contributed to four joint papers in collaboration with imec, IBM, and Samsung.
Brewer Science also presented at SPIE Advanced Lithography & Patterning 2025, showcasing the company’s latest advancements in photolithography and semiconductor packaging solutions. The presentation highlighted key innovations aimed at enhancing performance in next-generation computing applications
ACM Research recently celebrated the Lunar New Year at itstheir new facility in Shanghai, extending warm wishes to partners, employees, and customers worldwide. The event featured traditional festivities, aligning with Shanghai’s vibrant city-wide celebrations. ACM Research’s participation underscores their commitment to cultural appreciation and community engagement.
TechSearch International released Volume 4-0125 of its Advanced Packaging Update. This edition features a financial analysis of Outsourced Semiconductor Assembly and Test (OSAT) providers, discusses trends and drivers in the semiconductor industry, and examines growth in the AI market with package examples. It also provides an update on co-packaged optics and includes a special section on mobile communications via satellites.
The IMAPS 21st International Conference & Exhibit on Device Packaging (IMAPS DPC) will take place in Phoenix, AZ, from March 3-6, 2025, at a new centralized location at the Sheraton Grand at Wild Horse Pass. Panelists include experts from TechSearch International, DECA, Intel, Stats ChipPAC, IBM, and Amkor. Read our full member preview of this event.
Indium Corporation Senior Product Specialist Jason Farrell will present on gold solder solutions for medical applications at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, March 5-7 in Phoenix, Arizona. His talk will highlight the role of gold solder in implantable electronics, surgical instruments, and robotic surgery, emphasizing its biocompatibility, corrosion resistance, and durability. The presentation is scheduled for March 6 at 5:30 pm.
StratEdge Corporation will showcase its latest molded ceramic semiconductor packages at the IMAPS Device Packaging Conference and GOMACTech Conference (March 18-19, Pasadena, CA). Designed for RF, microwave, and millimeter-wave applications up to 18 GHz, these packages reportedly offer enhanced thermal management options for high-power devices in defense and aerospace. StratEdge experts will be on-site to discuss packaging solutions and application-specific needs.
Indium Corporation’s technical support engineer, Carson Burt, will present at TestConX 2025 in Mesa, Arizona this upcoming March. His presentation, “Solving Warping Issues with Novel Metal Compressible TIM,” will introduce innovative thermal interface materials designed to enhance performance in high-power applications. The session will take place on Tuesday March 4, at 1:30 pm.
SEMI’s SEMIEXPO Heartland, an inaugural event scheduled for April 1-2, 2025 at the Indiana CoOnvention Center in Indianapolis, will feature speakers discussing advancements in smart manufacturing and smart mobility. Industry leaders will share insights on semiconductor innovation, workforce development, and regional supply chain growth. The event aims to foster collaboration within the expanding semiconductor industry.
Company Expansions and Collaborations
ASE officially launched its fifth plant in Penang, Malaysia, expanding its advanced packaging and test capabilities. The facility, part of ASE’s strategic growth plan, increases total floor space to 3.4 million square feet and integrates AIoT and Industry 4.0 technologies to enhance productivity. With semiconductor demand rising for AI, edge computing, and autonomous applications, ASE’s expansion reportedly strengthens its role in the global supply chain and is expected to create 1,500 new jobs over the coming years.
Nova completed the acquisition of Sentronics Metrology GmbH, a German-based provider of wafer metrology tools for backend semiconductor fabrication, in a transaction valued at approximately $60 million. This strategic move aims to enhance Nova’s dimensional metrology portfolio, with the intention of enabling the company to offer a comprehensive range of solutions for both backend and frontend fabrication processes.
ERS Electronic inaugurated a new production and R&D facility in Barbing, Germany, alongside a competence center for advanced packaging and backend technologies. This expansion aims to accelerate process development and production of ER’s advanced packaging equipment, offering customers direct access to technical expertise in wafer and panel debonding, as well as warpage handling and measurement.
Deca Technologies extended the reach of its wafer-level chip scale packaging (WLCSP) and M-Series fan-out waferl level packaging (FOWLP) technologies through a collaboration with India-based assembly and test provider, RRP Electronics. The company will integrate Deca’s WLCSP and FOWLP technologies into its assembly processes. According to Tim Olson, Founder & CEO, Deca Technologies, the collaboration will accelerate RRP ambitious plans and strengthen India’s position in the global semiconductor value chain.
LQDX Inc. formalized its collaboration with Arizona State University (ASU) to advance semiconductor packaging technologies. Building upon their 2024 partnership, the focus is on developing advanced IC substrates, Fan-Out Wafer Level Packaging (FOWLP), and glass core metallization, utilizing LQDX’s Liquid Metal Ink (LMI®) technology. This collaboration aligns with ASU’s commitment to semiconductor packaging research and the establishment of its advanced packaging piloting facility, aiming to accelerate the development and scaling of cutting-edge semiconductor technologies.
Trymax Semiconductor Equipment joined Accuron Technologies, a global precision engineering and technology group, as part of a strategic acquisition. The move expands Trymax’s reach in the semiconductor industry while strengthening Accuron’s portfolio in plasma-and UV-based process equipment. This partnership aims to drive further growth and enhance Accuron’s presence in the European market.
Awards and Recognitions
NHanced Semiconductors CEO Bob Patti took center stage at the IEEE 3DIC Conference in Sendai, Japan, not only delivering a keynote address but also participating in a traditional Sake Barrel Breaking Ceremony–a prestigious honor extended by the event hosts (Figure 1). This Kagami Biraki ceremony, a tradition dating back over 300 years, symbolizes prosperity, new beginnings, harmony, good fortune, and group success.
Nordson Electronics Solutions was honored with the 2024 Best Strategic Supplier Award by Jabil. This recognized them as providers of superior performance in quality, delivery, innovation, and partnership. The award was presented during the Jabil Asia Indirect Supplier Conference in Shenzhen, China. Justin Hall, vice president of Nordson Electronic Solutions, expressed gratitude for the recognition and highlighted the global team’s dedication to operational excellence.
MRSI Mycronic’s MRSI-A-L Active Aligner received the “Most Competitive Products of Optical Communication” award at Infostone China’s 11th Heroes List Award conference. This marks the sixth consecutive year MRSI Mycronic has been honored by infostone China. The MRSI-A-L Active Aligner is recognized for its high-precision, flexibility, and integration capabilities in optoelectronic packaging.
Fraunhofer IZM honored Professor Herbert Rechl as he celebrated his 80th birthday in January. A gathering commemorated his contributions to microelectronic research and the founding of the institute. His work has left a lasting impact on the field, and the institute extended their gratitude and best wishes to Professor Rechl at this event.
Circuits Integrated Hellas (CIH) joins Paris Space Week Innovation Challenge, as one of the 12 companies selected, showcasing its advanced SatCom chip technology to aerospace leaders. CIH’s 3D packaging solution integrates III-V compound semiconductors with silicon, reducing footprint, weight, and cost by 60% for LEO satellite applications. The company was also recognized at the EPIC European-Singaporean Space Start-up Competition and will participate in the Global Space Technology Convention 2025.
Workforce and Leadership Announcements
Kulicke & Soffa is thrilled to promote Chris Morrison as its new Sales Director. With extensive industry experience, he brings valuable leadership to the company’s sales initiatives. Congratulations to Chris on this new role!
Brewer Science, Inc. appointed Ms. Poupak Khobadendeh as Chief Business Officer. Ms. Khobadandeh brings decades of industry experience, including leadership roles at Chemtrade Corporation and Henkel Corporation. Her expertise is expected to bring strategic growth in advanced packaging and photolithography technologies, aligning with the company’s focus on next-generation computing advancements.
Koh Young America, announced the addition of MaRC Technologies as its sales representative for the Pacific Northwest region, effective February 24, 2025. MaRC Technologies will support Koh Young’s expanding customer base across Oregon, Washington, Idaho, and Montana.
Policy and Market Trends
SEMI reports strong Q4 2024 semiconductor industry growth, with Integrated Circuit (IC) sales up 29% year-over-year, driven by AI demand. Semiconductor CapEx rose 3%, with memory investments surging 56%. Wafer fab equipment spending increased 14%, and global fab capacity exceeded 42 million wafers per quarter. Industry outlook remains optimistic for 2025.
Additionally, the SEMI Energy Collaborative publicly released its analysis and report: Challenges and Potential Solutions for Acceleration of Low-Carbon Energy Deployment in Singapore. Now available for download, the report combines input from SEMI and its Energy Collaborative sponsors and suggests solutions for policymakers, low-carbon energy (LCE) developers, and semiconductor industry companies to further increase the pace and scale of access.
Trymax Semiconductor is CHIPS Act compliant, ensuring alignment with U.S. initiatives to strengthen domestic semiconductor manufacturing. This compliance guarantees transparency in the supply chain and adherence to federal regulations. Trymax offers plasma-based and UV-based process equipment, providing a reliable solution for companies benefiting from CHIPS Act funding.
Job Announcements and Opportunities
Veeco is hiring a New Product Introduction (NPI) Project Engineer at its Somerset, NJ location. This role focuses on managing manufacturing operations during product development and transitioning to full production. Key responsibilities include project timeline management, process improvement, and cross-functional collaboration. Learn more here.
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