MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB) assemblies utilizing epoxy processes.
The MRSI-LEAP high-speed 1µm die bonder boasts a range of innovative features that make it an essential tool for ultra-high-volume manufacturing. It offers unparalleled efficiency with exceptional precision <±1µm @ 3σ ensuring long-term stability and high precision in true 24/7 die bonding applications to support ultra-high volume driven by AI.
The machine supports multiple forms of inputs, including wafer, waffle pack, and Gel-Pak®, as well as customized fixtures. It also has an automatic tool changing function to handle different die sizes. Additionally, it features a high throughput capacity with a conveyor designed for a single fixture or multiple cassette inputs, capable of automatically transporting large carriers of dies for active optical cable (AOC), CoB, gold-box packaging, and CoC assemblies in fixtures.
Advanced process options such as flip-chip bonding, UV epoxy dispensing, in-situ UV curing, and wafer-level packaging are also available, making the MRSI-LEAP a versatile and powerful solution for various manufacturing needs.
”To meet the increasing demand of unprecedented high volume manufacturing for high-speed optical modules in AI, we are pleased to introduce the MRSI-LEAP high-speed 1µm die bonding machine,” said Dr. Yi Qian, Mycronic Group VP & MRSI Systems General Manager. “This new product significantly improves production efficiency while maintaining ultra-high precision, greatly enhancing the return on investment for customers. MRSI takes pride in its commitment to continuous innovation to bring value to customers.”
