January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging, process control, and inspection solutions, while various acquisitions strengthened the U.S. semiconductor supply chain. There were various new hiring opportunities across the industry, upcoming conferences, and notable achievements. Innovation and collaboration remain central themes in the month of January, highlighting this sector’s commitment to continue advancement in semiconductor manufacturing and packaging.
Technology Innovation
In collaboration with imec, Lam Research achieved a significant milestone with its dry photoresist technology for back-end-of-line processes to achieve 28nm pitch, high-resolution patterning for advanced semiconductor devices. This innovation enhances EUV lithography, improving yield, resolution, and cost-efficiency while reducing material usage. It supports next-generation transistor scaling and addresses the trade-off between defectivity and EUV dose, advancing sustainable semiconductor manufacturing.
Onto Innovation expanded its process control solutions for 3D interconnects with its 3Di™ technology, now available on the Dragonfly® G3 system, and the EchoScan™ void detection system. These innovations address challenges in advanced packaging, such as void detection and smaller bump sizes for high-bandwidth memory and logic applications. The EchoScan system can detect voids as small as 1µm without immersion, improving yield in hybrid bonding processes. Initial orders have been secured, with additional shipments planned throughout 2025.
Brewer Science is contributing to the advancement of semiconductor technology through the development of next-generation materials essential for chip innovation. Their work supports initiatives like the newly announced Prototyping and Advanced Packaging R&D Facility at Arizona State University, which aims to strengthen the U.S. semiconductor ecosystem through cutting-edge research and development.
MRSI Mycronic unveiled the MRSI-LEAP, an advanced high-speed die bonder designed for ultra-high-volume manufacturing of AI optical module applications. This system delivers 1µm placement accuracy while increasing production efficiency for semiconductor packaging. The MRSI-LEAP addresses industry demands for precision and speed in next-generation optical and AI-driven technologies.
Yield Engineering Systems (YES) has received multiple orders for its VertaCure PLP systems from a leading semiconductor manufacturer in Japan. These vacuum curing systems are essential for advanced packaging in AI and High Performance Computing (HPC) applications, supporting 2.5D/3D chip control, improved throughput, and uniform film performance, addressing the growing demand for larger substrates and high-performance materials in semiconductor manufacturing.
Partnerships and Alliances
Deca Technologies partnered with RRP Electronics Ltd to enhance semiconductor packaging capabilities in India. This collaboration underscores their commitment to innovation and advancing packaging technologies, driving progress in the semiconductor industry.
Nova signed a definitive agreement to acquire Sentronics Metrology GmbH in an all-cash transaction valued at $60 million. This acquisition reportedly strengthens Nova’s capabilities with cutting-edge metrology solutions.
Micross Components acquired Integra Technologies, creating the largest U.S.-domiciled outsourced semiconductor assembly and test (OSAT) provider. This acquisition reportedly strengthens the domestic advanced packaging, testing, and component services, enhancing supply chain security for aerospace, defense, and high-reliability markets. The combined entity expands capabilities in secure semiconductor solutions, supporting the CHIPS Act’s goals of boosting U.S. semiconductor independence.
StratEdge Corporation partnered with Vitale Engineering as its manufacturer’s representative for Upstate New York. This collaboration aims to expand StratEdge’s presence in the region, providing customers with local expertise and support for high-frequency and high-power semiconductor packaging solutions. The partnership reportedly strengthens StratEdge’s ability to serve industries such as telecommunications, aerospace, and defense.
Koh Young partnered with NTV USA to expand its advanced packaging and semiconductor inspection solutions across the United States. This collaboration enhances Koh Young’s ability to provide cutting-edge inspection technologies, improving quality and efficiency in semiconductor manufacturing. By leveraging NTV USA’s resources, Koh Young aims to strengthen its presence in the U.S. market and support industry growth.
Industry Development
SEMI reports that 18 new semiconductor fabs are scheduled to begin construction in 2025, marking a significant expansion in the industry. These fabs, ranging from 200mm to 300mm, will support the increasing demand for generative AI, high-performance computing, automotive, and Internet of Things (IoT) applications. This expansion highlights a global push to meet the growing need for advanced logic and memory technologies, especially in regions like the Americas, Japan, and China.
The IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) has issued a call for papers for a special issue focused on 2.5D/3D chiplet circuits, systems, EDA, advanced packaging, and test. This issue aims to explore the challenges and advancements in chiplet technology, addressing issues such as interconnects, design complexities, and system integration. Researchers are invited to submit papers on these topics, with the submission deadline set for March 3, 2025.
For more details, visit the call for papers.
Events
IMAPS announced that its 2025 Device Packaging Conference (DPC) will be held from March 3-6 in Phoenix, Arizona. This year, the conference will co-locate with the Advanced Packaging for Medical Microelectronics Workshop from March 5-7, offering a robust program focused on the latest in packaging and microelectronics advancements. Topics will include emerging technologies, medical applications, and semiconductor packaging. This collaboration brings together experts from various industries, providing networking and learning opportunities.
Indium Corporation showcased their power electronics products at NEPCON Japan from January 22-24 in Tokyo. Highlights included reinforced solder preforms, low-temperature solder solutions, and advanced thermal interface materials for AI and automotive applications. A technical presentation on January 23rd addressed innovative solder solutions for high-reliability needs in various industries.
The company also presented at Pan Pacific Strategic Electronic Symposium (Pan Pac 2025) in Maui, Hawaii, from January 27th-30th. Dr. Ronald Lasky discusseds advancements in electronics and low-temperature soldering technologies, while Kevin Brennan focused on managing warpage and thermal gradients in modern electronics manufacturing. Their presentations highlighted key innovations shaping the future of electronics.
TechSearch International kicked off the year by attending global conferences and gathering insights into semiconductor packaging. At the beginning of January, TechSearch president Jan Vardaman moderated the SEMI ISS Advanced Packaging Panel on Meeting the Limits of Scaling: Is Hybrid Bonding the Answer? Panelists included experts from AMD, Applied Materials, Micron Technology, and PDF Solutions.
Awards and Accomplishments
3D PLUS recently marked 30 years of innovation with its Worldwide Sales Meeting 2025, bringing together global business partners to reflect on past achievements and collaborate on future goals. This event highlighted the company’s ongoing dedication to addressing new opportunities and challenges across its key industries in the coming year.
Kiterocket marks its 20th anniversary–a milestone reflecting two decades of partnership, growth, and impactful work. To celebrate, the team launched its “20 Wishes for 2025,” showcasing their commitment to meaningful work and fostering strong relationships. The initiative highlights the talented individuals driving the company’s success as they continue advancing brands that are shaping the future.
Hirings and Workforce Development
Yield Engineering Systems is seeking a Final Test Engineer in Chandler, Arizona to join their team. This opportunity is perfect for professionals passionate about precision and innovation in semiconductor manufacturing. Know someone who might be a great fit? Share this opportunity with your network.
Deca Technologies is excited to announce an opening for a Director of Technology R&D. In this role, you will lead R&D efforts for ShIELD USA, a CHIPS Act initiative, collaborating with Arizona State University to develop advanced organic substrates using Deca’s fan-out technology. You will work closely with industry and academic partners across various sector, including materials, equipment, and chip design for innovations in heterogeneous integration and chiplets.
Onto Innovation is seeking a Senior Product Manager for their Inspection division in Bloomington, Minnesota. The role involves managing the health of inspection products, driving improvements, and leading next-generation initiatives. Responsibilities include developing product strategy, coordinating product life cycle initiatives, collaborating with cross functional teams, and prioritizing engineering projects based on field input.
ERS electronic GmbH is seeking talented professionals to join their advanced packaging team, focusing on product management, innovation, and strategic marketing. The role offers opportunities to lead product life cycles, identify new business avenues, and support sales with technical expertise, all while helping to shape the future of semiconductors. Know someone for the job? Share this opportunity.
Members, have news you want to share that’s not already in a press release? Send it to Camden McCrea and he’ll include it in his monthly round-up.
