As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo.
Indium Corporation will showcase the following among its featured products:
- Award-winning InFORMS®are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- 9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- Indalloy®301LT for Preforms/InFORMS®is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- SiPaste®series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. The series of products helps Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
- Heat-Spring®, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
- InTACK®is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
Additionally, Indium’s Senior Area Technical Manager, Jason Chou, will deliver a technical presentation at NEPCON Japan. Visitors can view the presentation on Thursday, January 23, at 3 p.m. in East Hall 7.
The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with high-performance computing (HPC) requirements, where thermal management during processing is critical.
To learn more about Indium Corporation’s power electronics solutions, visit www.indium.com or visit our experts at NEPCON Japan at booth E66-22
