2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments, including the successful ramp-up of our new manufacturing facility, the establishment of a dedicated Quality Department, the expansion of our team with additional Field Service Engineers, and the growing momentum of our USA team, which resulted in multiple purchase orders.
In the broader market, while the automotive sector remains stable, particularly in silicon carbide (SiC) applications, other markets have experienced slower growth. However, we have observed a substantial increase in the storage and availability of data, with ambitious forecasts driven by the increasing demand for high-speed data access everywhere.
The most substantial growth for Trymax this year came from advanced packaging applications. Our process team has been dedicated to developing various process applications related to 2D, 2.5D, and 3D packaging technologies. In 2D IC packaging, components are arranged on a single plane. In 2.5D IC packaging, components remain on the same plane, but an interposer allows for additional integration. 3D IC packaging involves vertically stacking components, enabling higher levels of integration and potentially improved performance and power efficiency. These devices are increasingly interconnected using through-silicon vias, which are fabricated using the Bosch process.
Our Trymax Process Module excels at efficiently cleaning residual polymer after the Bosch process. Additionally, to facilitate easier copper filling of the created vias, our Process Module is capable of creating a bowl etch on top of the vias.
Before Chip-to-Wafer (C2W) or Wafer-to-Wafer (W2W) stacking, it is essential to clean and, where possible, activate surfaces. Our Trymax low-cost Process Module simplifies this cleaning process while simultaneously activating the surface to make it more hydrophilic.
On behalf of the entire Trymax team, I would like to extend our heartfelt thanks to our customers and suppliers for the trust and confidence they have placed in us throughout this year.
This article first appeared in the 2025 3D InCites Yearbook. Read the whole issue here.
