As the demand for advanced interconnect solutions continues to grow, PLANOPTIK has developed Advanced Connectivity Technology (ACT), a cutting-edge solution for 3D integration and high-frequency applications. ACT highlights the company’s commitment to pushing the boundaries of glass processing technology to meet the evolving needs of the industry.
New Substrates for Advanced Packaging and High-Frequency Applications
ACT is designed to enhance electrical performance and thermal management, crucial for 5G infrastructure and other high-frequency applications. PLANOPTIK’s glass substrates offer low-loss and high-density interconnects, enabling efficient signal transmission and component miniaturization. The key is copper metallization, which is applied to the wafer to combine the conductive properties of copper with the non-conductive benefits of glass. This allows electrical connections from the front to the back of the wafer through precisely structured holes.
Our Technologies for Your Success
The ACT solution leverages VLIS technology for structuring the panels and wafers, ensuring high precision and performance. This integration underscores PLANOPTIK AG’s role as a leading provider of comprehensive solutions in glass processing, combining innovative technologies to deliver superior products to its customers.
This is not just a promise for the future; it’s a technology already available and making significant impacts in the field of advanced packaging.
