With SEMICON Europa not too far behind us, the industry is already gearing up again for SEMICON Japan. Taking place from December 11-13, this year’s Japan event will feature interactive sessions that we haven’t seen before, including Yoichi Ochiai’s Passion Lab and SEMICON Stadium, where participants will get to engage with sports-themed robots. If any of you get the chance to play sports with a robot, let us know!
In addition, we have a handful of 3D InCites community members presenting at SEMICON Japan, and many more who are exhibiting. Francoise will not be attending, but she’s excited to keep up with the event on LinkedIn!
If you’ll be heading to Japan within these next few weeks, be sure to check out some of our member sessions and events.
Featured Events
SEMI Japan Official Networking Events
- Events take place from December 11-13
- Tuesday, December 14 from 4-5 p.m. at booth 6336
- Tuesday, December 14 from 4-5 p.m. at booth 1310
- Tuesday, December 14 from 4-5 p.m. at booth 6513
- Tuesday, December 14 from 4-5 p.m. at booth 6911
- Tuesday, December 14 from 4-5 p.m. at booth 5806
Featured Sessions
Building The Most Performant AI, From Sand to Cloud
- Wednesday, December 11 from 1:30-2 p.m.
- Dario Gil, IBM
The Future of Fabs: Human Ingenuity Meets AI Speed and Robotic Precision
- Wednesday, December 11 from 3:45-4:15 p.m.
- Tim Archer, Lam Research
Future HPC Packaging Options: Si Interposer, RDL Interposer, or Glass Core Substrate?
- Thursday, December 12 from 2:30-3 p.m.
- Jan Vardaman, TechSearch International
Accelerating the AI Through Effective Heterogeneous Integration by Advanced Packaging
- Thursday, December 12 from 3:30-4 p.m.
- CP Hung, ASE
SEMI Activity Report on Climate Change Keynote (Tentative)
- Friday, December 13 from 11:30-11:40 a.m.
- Mousumi Bhat, SEMI
Semiconductor Technologies in the HPC Era – Official Topic TBD
- Friday, December 13 from 1:36-2:09 p.m.
- Mukesh Khare, IBM
Member Sessions
ASE
Accelerating the AI Through Effective Heterogeneous Integration by Advanced Packaging
- Thursday, December 12 from 3:30-4 p.m.
- CP Hung
Cadence
Frontline of Semiconductor Design with EDA Vendor – Panel Discussion
- Thursday, December 12 from 12:30-2:10 p.m.
- Tadaaki Hitomi
IBM
Building The Most Performant AI, From Sand to Cloud
- Wednesday, December 11 from 1:30-2 p.m.
- Dario Gil
IBM’s Approach for MES for Full Automation in Advanced Packaging
- Wednesday, December 11 from 1:30-2 p.m.
- Masahide Hirouchi
- Thursday, December 12 from 12:30-1:05 p.m.
- Gakuto Kurata
Semiconductor Technologies in the HPC Era – Official Topic TBD
- Friday, December 13 from 1:36-2:09 p.m.
- Mukesh Khare
Women in Business the Second – The Power of Women’s Innovation – Panel Discussion
- Friday, December 13 from 12:40-2:10 p.m.
- Miho Hakoshima
Lam Research
The Future of Fabs: Human Ingenuity Meets AI Speed and Robotic Precision
- Wednesday, December 11 from 3:45-4:15 p.m.
- Tim Archer
Onto Innovation
Inspection & Metrology Innovations in the Age of Artificial Intelligence (A.I.)
- Thursday, December 12 from 3:10-3:50 p.m.
- Mike Rosa
- An application is required to attend this session
SEMI
SEMI PFAS Initiative Activity Report
- Wednesday, December 11 from 2:10-2:30 p.m.
- Reiko Eda
- An application is required to attend this session
Focus on Recent EU Environmental Legislation
- Wednesday, December 11 from 2:40-3:10 p.m.
- Noboru Shimada
- An application is required to attend this session
SEMI Activity Report on Climate Change Keynote (Tentative)
- Friday, December 13 from 11:30-11:40 a.m.
- Mousumi Bhat
SEMI Market Outlook – Year-End Equipment Forecast and Fab Investment Outlook
- Friday, December 13 from 11:45 a.m.-12:15 p.m.
- Clark Tseng
- An application is required to attend this session
Trends of PFAS Countermeasures in SEMI and Semiconductor Industry (Tentative)
- Friday, December 13 from 12:30-12:45 p.m.
- Supika Mashiro
Sustainability Summit – Combatting Climate Change – Topic TBD
- Friday, December 13 from 2:35-2:50 p.m.
- Mousumi Bhat
Siemens
SEMI Global Standards Summit: Flow Manufacturing
- Thursday, December 12 from 11:40 a.m.- 12 p.m.
- Fumiyasu Ohbuchi
Frontline of Semiconductor Design with EDA Vendor – Panel Discussion
- Thursday, December 12 from 12:30-2:10 p.m.
- Kazuyuki Yorogo
Sustainability Initiatives and Efficiency Solutions at the Semiconductor Climate Consortium (SCC)
- Friday, December 13 from 2:50-3:05 p.m.
- Jose Mcllroy
TechSearch International
Future HPC Packaging Options: Si Interposer, RDL Interposer, or Glass Core Substrate?
- Thursday, December 12 from 2:30-3 p.m.
- Jan Vardaman
Semiconductor Packaging Materials’ Technology and Market Trends (Tentative)
- Friday, December 13 from 3:20-3:50 p.m.
- Jan Vardaman
- An application is required to attend this session
Community Member Exhibitor List
