This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. Here’s a closer look at the highlights and achievements they’ve been up to this month.
Partnerships and Collaborations
Arizona State University and Deca Technologies were selected to lead the $100 million SHIELD USA project, a groundbreaking initiative under the CHIPS Act’s National Advanced Packaging Manufacturing Program. As part of the broader $11 billion CHIPS R&D initiative, SHIELD USA aims to strengthen U.S. semiconductor packaging capabilities, expand advanced packaging capacity, and restore U.S. leadership in microelectronics while enhancing national security. This project marks a significant step toward driving innovation in domestic microchip packaging and shaping the future of microelectronics. Other community members that are participating in this project include Saras Micro Devices and IBM.
StratEdge Corporation appointed Coastal RF Systems as its exclusive representative for Southern California, expanding its advanced packaging solutions into telecommunications, aerospace, and defense industries. StratEdge President Tim Going highlighted Coastal RF’s expertise in high-frequency applications, while Coastal RF President Frank Edwards emphasized the partnership’s potential to deliver high-performance solutions to clients.
Veeco will supply Ohio State University’s Krishna Infrared Detectors Laboratory with its GENxcel R&D MBE System for growing high-quality gallium-antimonide (GaSb) semiconductors for infrared detectors. Led by Professor Sanjay Krishna, the lab will use the award-winning system to advance semiconductor research and train future experts. This partnership supports the expanding IR detector market, projected to grow to $731 million by 2028.
Indium Corporation announced InnoJoin GmbH as the exclusive global sales partner for NanoFoil in component mounting applications. Based in Bremen, Germany, InnoJoin has extensive expertise in NanoFoil technology and operates advanced laser systems and a dedicated lab for precision cutting and nanobonding trials. This expanded partnership aims to enhance service in key markets worldwide and broaden the NanoFoil product line. NanoFoil is a reliable, cost-effective material widely used in industries such as semiconductor, aerospace, and defense, known for its precision and repeatability in bonding applications.
Siemens Digital Industries and Infineon partnered to integrate Siemens’ AUTOSAR-based platform with Infineon’s AURIX TC4x microcontroller, enabling production-ready software for Software-Defined Vehicles (SDVs). This collaboration, including work with BMW, addresses the need for advanced performance, safety, and cybersecurity in autonomous driving, ADAS, and electrification, paving the way for next-generation automotive systems.
Lightmatter and Amkor Technology have partnered to create the largest-ever 3D-packaged chip complex using Lightmatter’s Passage platform, a groundbreaking photonic engine that overcomes traditional I/O limitations with 3D integration and optical interconnects. This collaboration combines Lightmatter’s photonics innovation with Amkor’s advanced multi-die packaging expertise to deliver unparalleled bandwidth, energy efficiency, and scalability for AI and HPC workloads, addressing the increasing power and performance demands of next-generation processors.
Technology Development
Siemens Digital Industries Software has introduced Tessent In-System Test, a new design-for-test (DFT) solution that enhances in-system testing for next-gen integrated circuits (ICs). This software, developed to address challenges like aging and environmental factors that can lead to Silent Data Corruption, is the first in-system test controller compatible with Siemens’ Tessent Streaming Scan Network software. Tessent In-System Test allows for embedded deterministic test patterns throughout the lifecycle of ICs, improving reliability, security, and performance. It integrates with existing test infrastructures, reducing test time and improving chip planning, particularly for safety-critical industries like automotive, aerospace, and medical devices.
Cadence achieved a major milestone with the successful tape out of its first Arm-based system chiplet, a groundbreaking innovation in chiplet technology. This design integrates processors, system IP, and memory IP using the Universal Chiplet Interconnect Express (UCIe) standard and Arm’s Chiplet System Architecture (CSA), delivering exceptional bandwidth and resource management. Developed in partnership with Arm, the chiplet leverages Cadence’s advanced IP and EDA solutions, accelerating time-to-market for customers while addressing the challenges of slowing Moore’s Law scaling. With applications in high-performance computing, automotive, and data centers, this achievement sets a new standard for efficiency, scalability, and innovation in the chiplet ecosystem.
Award Recognitions
ASE Group recently received TSMC’s Open Innovation Platform’s Partner of the Year Award 2024 as a 3DFabric OSAT. Mark Gerber accepted the award on ASE’s behalf. This accolade recognizes ASE’s dedication in supporting TSMC‘s mission to accelerate innovation, efficiency, and productivity within semiconductor ecosystem.
Nordson Electronics Solutions won the 2024 Global Technology Award for its ASYMTEK Select Coat SL-1040 Conformal Coating System, recognized for its innovation in enhancing conformal coating processes in printed circuit assembly and advanced packaging. The system improves electronic device reliability by selectively applying protective coatings to avoid critical components, reducing process costs and boosting efficiency. Featuring the ASYMTEK SC-450 PreciseCoat Jet, enhanced EasyCoat software, and an ultrasonic nozzle cleaner for better uptime and yield, the SL-1040 also offers dual and triple applicators to maximize throughput and ensure consistent, traceable performance. The award was presented at SMTA International 2024 in Chicago, where Jeanine Norlin, Senior Marketing Manager, accepted the honor.
Nordson Test & Inspection received the 2024 Global Technology Award for its SpinSAM Acoustic Microimaging (AMI) system in the test equipment category, announced during SMTA International. The SpinSAM AMI system delivers unmatched speed and precision, scanning up to four 300mm wafers simultaneously at 41 wafers per hour, with best-in-class defect detection and image quality. Designed for semiconductor mid-end applications, it excels in bonded wafers, Chip-on-Wafer, MEMS, and more.
Indium Corporation was also honored with a 2024 Global Technology Award for its Indium8.9HFRV solder paste, recognized for its low voiding, air reflow, no-clean properties, and exceptional stencil print transfer efficiency, response-to-pause performance, wetting, and coalescence. Compatible with standard and high-reliability alloy systems like Durafuse HR and supporting both air and nitrogen reflow environments, Indium8.9HFRV provides superior voiding performance, thermal cycling reliability, and electrochemical reliability.
SEMILAB announced that Luca Sinkó, R&D Team Leader of the SRP Application Team, was named one of this year’s “SEMI 20 Under 30” honorees, recognizing young professionals making significant contributions to the semiconductor industry. A physicist and leader in the Electrical Metrology and Characterization Department, Luca excels in developing metrology techniques for silicon and wide bandgap materials, advancing global training initiatives, and contributing to the HiConnects EU project. Notably, Luca played a key role in the development of the Spreading Resistance Profiler, enhancing material research, failure analysis, and process control to improve product quality. Her leadership extends to coordinating software developments and effectively addressing customer needs. This well-deserved honor reflects her dedication, innovation, and bright future in driving Semilab’s success.
In addition to Luca, five other employees of 3D InCites member companies received recognition as part of SEMI Europe’s 20 under 30 Award program. They are:
- Annika Schnell, Application Specialist – D.R. Yield
- Charis Kalantzi, Lead Application Engineer, Cadence
- Elisabeth Brierley, Sustainability Graduate, Edwards
- James McGrath, CVD Process Engineer, KLA
- Kamal Rudra, R&D Integration Engineer, IBM
Congratulations to all!
Events
SEMI Americas will host the inaugural SEMIEXPO Heartland event from April 1-2, 2025, at the Indiana Convention Center in Indianapolis. The event will feature two tracks: Smart Mobility, exploring advancements in EVs, autonomous vehicles, MEMS, and chiplets; and Smart Manufacturing, focusing on AI, ML, digital twins, and robotics in semiconductor production. A Workforce Development Pavilion will offer career resources for students, veterans, and job seekers. Organized with regional partners, SEMIEXPO Heartland aims to drive collaboration and innovation in the semiconductor industry.
Indium Corporation’s Senior Area Technical Manager for East China, Leo Hu, will present at the SiP China Conference 2024 on November 27 in Suzhou, China. His presentation, Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging, will highlight advancements in low-temperature alloys for solder bump and Cu pillar interconnects. Hu will discuss industry challenges, material readiness, and innovations in low- and mid-temperature solder alloys for enhanced reliability and thermal fatigue performance. With over 19 years of semiconductor packaging expertise, Hu leads technical support in East China and collaborates globally to provide advanced assembly solutions.
Ramakanth Alapati, CEO of YES and Managing Director at KCK, participated in a USIBC-hosted industry roundtable in Palo Alto, where Hon’ble Minister Lokesh Nara of Andhra Pradesh shared his vision for the state’s growth. Minister Nara highlighted opportunities in Andhra Pradesh’s IT, electronics, and communications sectors and underscored the urgency of attracting and scaling diverse businesses in the region.
Company Development
John Ferguson has announced a new role as Senior Director of Product Management for Calibre 3D IC Solutions at Siemens EDA, while continuing to oversee traditional Calibre nmDRC product management activities.
ACM Research highlighted Stephen Hensley, Engineer in Charge in Hillsboro, Oregon, in its latest employee spotlight. Known for his engineering expertise and leadership, Stephen has created a dynamic work environment, demonstrating dedication and a strong work ethic.
Interested in becoming part of the 3D InCites Community? We are now accepting new memberships for 2024. Details are here.
