Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around the globe for a year, and you’ll hear similar presentations. The talking points of our industry tend to evolve slowly, and we hear similar talks from event to event. What’s always fresh is the local attendees and the exhibitors, and thus the conversations and connections.
The 2024 Interconnectology Eisstockschiessen Invitational
3D inCites is all about making connections. So we kicked off SEMICON Europa 2024 with our 3rd Annual 3D InCites Stammtisch, and the addition of our 2024 Inteconnectology Eisstockscheissen Invitational.
Guests for the evening arrived looking apprehensive as they took in the outdoor venue, the eisstock tracks, and roomy “hutte” that accommodated 7 long tables of 10 a bar, and a heaping buffet of traditional Bavarian fare. Fortified with Augustiner Helles fresh from the keg and steaming cups of house-made “glühwein”, they warmed up quickly.
As the evening progressed so did the cheers and laughter as teams bonded, and new connections formed. It was a great way to kick off the week. I heard from several of the guests that those introductions turned into meetings later in the week. While we only filled 42 of those seats this year, something tells me that next year, we’ll fill up the venue.
3D IC is the Future of Semiconductors
SEMICON Europa 2024 messages pretty much picked up where Europa 2023 left off, with updates on SEMI Europe’s programs focused on workforce development, sustainability, and achieving the $1 Trillion goal by 2030. SEMI CEO, Ajit Manocha, even went so far as to predict that the demand for semiconductors is there to double that Trillion by 2040. The key will be getting there sustainably.
For me, the CXO Summit highlight was when imec’s Luc Van den hove used his CXO Summit keynote talk at SEMICON Europa 2024 as a teaching platform for 3D IC technology, He calls it CMOS 2.0, and says it will extend scaling for the next two decades.
Now that 3D IC and advanced packaging are critical for growth instead of a necessary afterthought, there is a new generation of interconnectologists to educate. So, we went on a mission at SEMICON Europa 2024 to make new connections with the newcomers and help them learn about this important segment of the industry. We also learned a lot from them.
Making Memorable Connections
The connections I’ll remember most from this year’s SEMICON Europa were with some of the industry newcomers, from new companies to new talent.
I met Julius Hållstedt, Excillum, when he requested an invitation to the 2024 3D InCites Stammtisch. I first learned about Excillum from the application he submitted for the 2025 3D InCites Awards. The company developed an X-ray source by adapting cutting edge electron beam technology to illuminate advanced diamond transmission targets to achieve small, precise X-ray spots. He’s interested in meeting our members who specialize in X-ray technology.
I reconnected with Sebastiaan Müller, who is transitioning from a role at Taiwanese chemical filter distributor, Yasiang, to an Australian start-up, Syenta. The new company has an additive manufacturing process that could be a game changer for electroplating. I’m excited to learn more about it when Syenta becomes part of the 3D InCites community in 2025.
My old friend, Carl McMahon introduced me to the CEO of his new company, Dr. Paulo Fioraventi, of Circuits Integrated Hellas, based in Greece. CI’s technology stacks gallium arsenide on silicon and RF antennas to create 3D heterogeneously integrated phased array antennas for satellite communications, 5G, and IoT applications. We hope to welcome them as new members in 2025.
I spent time brainstorming new applications for BOBOO Hitech’s products with Eunseo Choi. The company specializes in heater components used for thermocompression bonding, and she’s looking to branch out into related markets. We talked about possibilities in compound semiconductors or even MEMS.
Some of my most memorable conversations were with with the recipients of SEMI Europe’s 20 under 30 Recognition Award that I interviewed for an upcoming podcast episode: Augustin Detruit, ERS Electronic GmbH; Charis Kalantzi, Cadence; James McGrath, KLA; and Luca Sinkó, SEMILAB.
I also spoke with Dr. Jessica Stubbe, of MKS Atotech, who presented at the Advanced Packaging Conference how copper electrolytes make it possible to reduce micro-bump pitch sizes by addressing the current mechanical challenge.
All these individuals are in their first jobs post university/grad school and have rapidly accelerated on a leadership track. They shared qualities of initiative, passion for their work, combined with a certain humility. None of them went into their studies with plans for a career in semiconductors or microelectronics. It was all by happenstance – the jobs were available and they learned as they went.
Connect with Caroline Bucknam
Saving the best for last – hands down the most memorable connection I made at SEMICON Europa didn’t happen at the Munich Messe. It happened at the Dive Bar on Garntnerplatz, where my husband, Stephen, and I were having a nightcap after just arriving at our Air BnB. Caroline was there with her friend Olivia, and we struck up a conversation.
Originally from Dallas, TX with a recent degree in marketing from the University of Oklahoma, Caroline came to Munich as an Au Pair, and to put her degree to work in Europe. I suggested she consider the semiconductor industry. She asked me how to get started, and I suggested she check out SEMICON Europa. I offered to introduce her to some people.
And she showed up! I was so impressed by her initiative! She took her day off to come in on Wednesday, getting there right in time to see a podcast interview happen at Koh Young. Then we hit the booth parties. She engaged and asked questions with everyone I introduced her to. I’ve known her a day, but my gut feeling says she’d be a great hire for any European company looking to hire an entry level marketing employee. You can connect with her on LinkedIn. Tell her I sent you!
But Wait – There’s More
This is it for the blog – but there’s lots more to come in the form of podcast interviews with CXO Summit keynote speakers and our 3D InCites members. You’ll get insight on solving the industry’s power challenges, how chiplet architectures can take us to the next level of autonomous vehicles, and how digital twins can help the industry with everything from power and cost savings, to addressing the talent gap.
We talked to Comet about the unveiling of the CA20 automated 3D X-ray inspection tool; we learned about DSV’s upcoming acquisition of Schenker; and got an update from Trymax on what’s driving growth for the company.
Lastly, we talked with Koh Young about the difference between 2D and 3D measurement technologies for process control. All these episodes will drop between now and the end of the year. If you’re not already following the podcast on your favorite app, you can find it here.
