Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International in Rosemont, Illinois. The company received the recognition in the solder paste category for Indium8.9HFRV, a low-voiding, air reflow, no-clean solder paste that offers excellent stencil print transfer efficiency, response-to-pause performance, wetting, and coalescence.
Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit board assembly and packaging industries introduced in the previous 12 months.
“We are honored to accept this prestigious Global Technology Award for innovation, and extremely proud of our dedicated colleagues who developed Indium8.9HFRV as a unique solution to customer needs,” said Product Development Specialist Kevin Brennan. “Indium8.9HFRV is the superior option for high-reliability alloy systems, providing excellent voiding performance, thermal cycling reliability, as well as electrochemical reliability.”
Indium8.9HFRV is a flux vehicle and drop-in solution fully compatible with the standard SnAgCu, SnAgCuSb high-reliability alloy systems favored by the electronics industry, and Indium Corporation’s enhanced thermal cycling, low-voiding alloy, Durafuse® HR. It is also compatible with both air and nitrogen reflow environments. It is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover. It also features high transfer efficiency through small apertures and can be coupled with Type 4 and Type 5 powder sizes.
