2024 IMAPS Society Award Winners
2024 IMAPS Society Award Winners
Figure 1: Complete list of IMAPS 2024 Society Award Winners

Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of the winners who attended the the gala event at IMAPS Symposium 2024.

They are, from left to right: Brandon Hamilton, BAE Systems; Casey Kraweic, StratEdge; Gary Hemphill, Retired; Phil Garrou, MCNC; Amy Lujan, Savansys Solutions; Wei-Chung Lo, ITRI; Shin-Puu Jeng, Consultant; Emma Pawliczak, SUNY Binghamton; Dongkai Shangguan, Thermal Engineering Associates and Indium. (Learn more about all of the winners here).

Of special interest to IFTLE was the Lifetime Achievement Award (toot toot)…

Figure 2: The IMAPS Lifetime Achievement Award

The phrase “toot your own horn” has its origins in the 19th century, when people used to announce their arrival or achievements by literally blowing a horn. It was a way to draw attention to oneself. In modern times, it’s more metaphorical, but the idea remains the same – i.e. making noise about your own accomplishments.

So the logical question, though one that is seldom asked of winners of awards like this is, “So what did you do to deserve this award”?

I actually have an answer for that question. I joined the International Society of Hybrid Microelectronics (ISHM) back in 1985 attending my first meeting in Anahiem, CA.  By the mid-1990s, I had become Techincal VP, and it was clear to many of us including Rao Tummala, Paul Van Loan, Harry Charles, Jim Drehle, George Harman and other notables in the packaging arena that the scope of the society had to broaden past its hybrid microelectronics roots to remain relevant.

Phil Garrou is the 2024 recipient of the IMAPS Lifetime Achievement Award.

You would think that would have been a “no brainer”, but there was significant resistance from some (not all) shortsighted hybrid circuit practitioners who at one point actually threatened my impeachment, for daring to tamper with “their” society. Ignoring those threats, in 1997 we merged with the International Electronic Packaging Society (IEPS) to form the International Microelectronics and Packaging Society (IMAPS) (Figure 5) and even had all of our international affiliates on board. So, of all the activities I have been involved in during my 40 years in the organization, certainly that’s the thing I am most proud of and you could say the action that caused the evolution to what IMAPS represents today..

Figure 5: In September of 1997, IEPS and ISHM joined forces to become IMAPS.

For all the latest on Advanced Packaging stay linked to IFTLE………………….

Phil Garrou

Dr Phil Garrou is an Advanced Packaging subject matter expert for DARPA and the DoD…

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