3D InCites is excited to head to Munich this November for another incredible SEMICON Europa event! With three feature presentations, booth parties, and dozens of presentations from 16 member companies, there’s something for everyone to look forward to.
From November 12-15, SEMICON Europa attendees will get access to hundreds of sessions, opportunities for networking with other industry leaders, and hopefully, a bit of time to explore the gorgeous city of Munich.
If you’ve been to SEMICON Europa in the past three years, you may be familiar with our annual 3D InCites Stammtisch! A Stammtisch is a regular gathering of friends at a local pub, and it’s a German tradition. This year’s Stammtisch is generously supported by our title sponsor, LQDX, our keg sponsor, LPKF Laser & Electronics, as well as our wonderful table sponsors.
So, on November 11 from 6:30 to 11 p.m. at the Bamberger Haus, join us for beer, wine, and traditional Bavarian fare. In addition, we’ll be hosting our first ever Interconnectology Invitational Eisstockschiessen! I Googled that word for you, so you don’t have to:
- According to Britannica, Eisstockschiessen is a game played on ice in the winter, similar to curling and shuffleboard. The game became popular in Bavaria and Austria by the late 19th century.
To RSVP to the Stammtisch, please reach out to any of our sponsors for an invitation.
Lastly, although 3D InCites won’t be exhibiting, Francoise will be walking the halls and attending as many member sessions as she can. To schedule a meeting with Francoise at SEMICON Europa, please email her at francoise@3dincites.com.
Featured Sessions
CxO Summit: Deep Tech Collaboration for Power-Efficient Semiconductors
- Tuesday, November 12 at 11:40 a.m.
- Stephan Haferl, Comet Yxlon
CxO Summit: Beyond Simulation: Bridging the Real & Digital World
- Tuesday, November 12 at 12:40 p.m.
- Katharina Westrich, Siemens AG
KEYNOTE: MEMS & Sensors Industry Group Update and Market Outlook
- Thursday, November 14 at 9:10 a.m.
- Tim Brosnihan, SEMI MEMS and Sensors Industry Group
Member Booth Parties
- Wednesday, November 13 at 4 p.m.
- Booth C1311
Trymax Semiconductor Equipment
- Wednesday, November 13 at 6 p.m.
- BV | Hall: C1, Booth C1.255
Other Booth Parties
- According to Sally-Ann Henry from ACM Research, you may want to check out the Technic and NMI booth parties on Wednesday evening. Technic will have a wine tasting, complete with French cheeses and champagne, and NMI will have scotch. You can thank her later.
Member Sessions
Adeia
- Wednesday, November 13 at 4:30 p.m.
- Seung Kang, Adeia
Amkor
Power and Thermal Management in Advanced Chiplet-Based Packaging
- Wednesday, November 13 at 11:20 a.m.
- YoungDo Kweon, Amkor
ASE
Elevating Power Efficiencies Through Advanced Packaging Innovation
- Wednesday, November 13 at 8:45 a.m.
- Mark Gerber, ASE
AT&S
Novel Interconnect Solutions for Improved Signal Integrity Performance
- Tuesday, November 12 at 11:25 a.m.
- Erich Schlaffer, AT&S
Comet Yxlon
Deep Tech Collaboration for Power-Efficient Semiconductors
- Tuesday, November 12 at 11:40 a.m.
- Stephan Haferl, Comet Yxlon
Panel Discussion – Topic Coming Soon
- Wednesday, November 13 at 10:35 a.m.
- Isabella Drolz, Comet Yxlon
AI Powering AI Chip Evolution. From Design to Production With Intelligent 3D X-Ray Inspection
- Wednesday, November 13 at 11:05 a.m.
- Dionys van de Ven, Comet Yxlon
AI-Driven 3D X-Ray Inspection: A Game-Changer for Advanced Semiconductor Packages
- Wednesday, November 13 at 12:30 p.m.
- Isabella Drolz, Comet Yxlon
From Good to Great: How X-Ray Technology is Driving Yield in Advanced Packaging
- Thursday, November 14 at 10:50 a.m.
- Christian Driller, Comet Yxlon
Edwards
New Approaches and Innovations to Improve Effective Use of Vacuum Assets in Cleanroom and SubFab
- Thursday, November 14 at 4 p.m.
- Paul Johnson, Edwards Vacuum
EV Group
Challenges of New Chiplet Integration – How Organic Interposers Challenge BEOL Equipment
- Wednesday, November 13 at 10:05 a.m.
- Elisabeth Brandl, EV Group
Latest Innovations in MEMS Wafer Bonding
- Thursday, November 14 at 12:30 p.m.
- Thomas Uhrmann, EV Group
Innovations for Next-Gen Applications – Smart Mobility Opening and Closing Remarks
- Thursday, November 14 at 4:30 and 5:45 p.m.
- Bernd Dielacher, EV Group
Evatec
Power and Heat Management Opening Remarks and Key Takeaways
- Wednesday, November 13 at 11:15 a.m. and 12:20 p.m.
- Rolan Rettenmeier, Evatec
Henkel
Driving Sustainability in Semiconductor Packaging
- Wednesday, November 13 at 4:30 p.m.
- Pierre Farbos de Luzan, Henkel
IBM
Advancing AI Through Advanced Packaging
- Wednesday, November 13 at 9:25 a.m.
- Arvind Kumar, IBM
- Wednesday, November 13 at 11:30 a.m.
- Heike Riel, IBM Research
KLA
Panel Discussion – Topic Coming Soon
- Wednesday, November 13 at 10:35 a.m.
- Dan Collins, KLA
Sustainable Supply Chain Capabilities Opening and Closing Remarks
- Thursday, November 14 at 9:25 and 10:10 a.m.
- Richard Barnett, KLA
The Most Common Antistiction Films are PFAS. Now What?
- Thursday, November 14 at 11:50 a.m.
- David Springer, KLA
Koh Young
Sinter Print Surface Condition Measurement for Power Electronics
- Wednesday, November 13 at 2:10 p.m.
- Alex Lindloff, Koh Young Europe
Lam Research
Virtual Fab for Advanced Semiconductor Engineering
- Wednesday, November 13 at 1:45 p.m.
- Benjamin Vincent, Lam Research
MKS Atotech
Advanced Electrolytes Meeting Future Requirement in Microbump Technology
- Wednesday, November 13 at 9:45 a.m.
- Jessica Stubbe, MKS Atotech
SEMI
Panel Discussion – The Geopolitics of Semiconductors
- Tuesday, November 12 at 1:05 p.m.
- Stefano Ramundo Orlando, SEMI Europe
Fab Investment Outlook and the Dynamics of Regional Semiconductor Manufacturing
- Wednesday, November 13 at 10:05 a.m.
- Clark Tseng, SEMI
Smart MedTech – A SEMI Global Initiative
- Thursday, November 14 at 3:15 p.m.
- Melissa Grupen-Shemansky, SEMI
- Friday, November 15 at 10:05 a.m.
- Victoria Cummings, SEMI Europe
European Chips Diversity Alliance
- Friday, November 15 at 10:25 a.m.
- Reviliani Gani, SEMI Europe
Siemens
Beyond Simulation: Bridging the Real & Digital World
- Tuesday, November 12 at 12:40 p.m.
- Katharina Westrich, Siemens AG
Panel Discussion – Accelerating the EU CHIPS Act
- Tuesday, November 12 at 5 p.m.
- Thomas Heurung, Siemens EDA
Collaboration in Sustainability
- Thursday, November 14 at 1:20 p.m.
- Katharina Westrich, Siemens
Member Booth Numbers
