October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance production capabilities to impactful industry events fostering collaboration and engagement, our members have truly been at the forefront of progress. Additionally, new partnerships have emerged, driving innovation in technology and opening doors to exciting opportunities. These accomplishments not only showcase the dedication and hard work of our members but also highlight their commitment to advancing the semiconductor industry as a whole. Let’s take a closer look at this month’s remarkable activities and achievements.
New Facilities
ZEISS recently opened a state-of-the-art semiconductor applications lab in Dresden, focused on advancing physical analysis and nanoscale imaging with its ZEISS Crossbeam FIB-SEM technology. Strategically located in Europe’s semiconductor hub, the lab collaborates closely with industry partners to enhance failure analysis, materials development, and process yields in advanced logic, memory, power semiconductors, MEMS, and packaging. This Dresden site joins ZEISS’ Innovation Centers in Taiwan and Korea, forming a global network to drive innovation and automation in semiconductor microscopy, ultimately addressing the industry’s most complex challenges and supporting lab professionals worldwide.
NHanced Semiconductors is enhancing its Morrisville, NC fab capabilities with the addition of the Arradiance GEMStar XT-D Dual Manifold Thermal ALD Benchtop System. This compact system provides atomic-level precision, enabling ultra-thin film application, uniform coating on complex 3D structures, and seamless integration of conductive and dielectric layers.
Collaborations
Amkor Technology and TSMC have signed a memorandum of understanding to enhance advanced packaging and testing capabilities in Arizona, contributing to the region’s semiconductor ecosystem. This collaboration will support key markets such as high-performance computing, artificial intelligence, and communications. Amkor’s new facility in Peoria will offer advanced packaging and testing services, which TSMC will utilize to support customers at its Phoenix wafer fabrication facilities. The partnership aims to accelerate product cycle times and promote a robust semiconductor manufacturing ecosystem in the United States. It will also leverage advanced packaging technologies like InFO and CoWoS®, enabling faster product cycles and a cohesive U.S.-based manufacturing network. Both companies aim to enhance customer support through seamless integration across front-end and back-end processes.
NHanced Semiconductors is partnering in three projects under the CHIPS-funded Microelectronics Commons initiative with hubs at SCMC, Northwest-AI-Hub, and MMEC. Collaborating with industry leaders and educational institutions, NHanced will drive advancements in Advanced Packaging and support workforce development, fostering the next generation of skilled microelectronics professionals.
Tech Innovation
Nordson ASYMTEK has received the Global Technology Award for the ASYMTEK Select Coat® SL-1040 Conformal Coating System. This prestigious award recognizes the best new innovations for conformal coating equipment, which are used in printed circuit assembly and the advanced packaging industries.
KLA Corporation has introduced an expansive suite of process control and process-enabling solutions for IC substrate manufacturing, addressing the growing needs for higher-density packaging interconnects in high-performance chips. Leveraging expertise in semiconductors, packaging, and IC substrates, KLA’s portfolio includes advanced direct imaging, defect inspection, metrology, and AI-driven process control tools. New offerings like the Serena™ direct imaging platform and Lumina™ inspection system support fine patterning and high-sensitivity detection, enhancing yield and accuracy. This portfolio reinforces KLA’s commitment to innovative packaging solutions that enable higher performance and faster delivery cycles for advanced IC substrates.
Henkel and Teca-Print announced a partnership to advance pad printing in printed electronics, targeting applications in antenna, healthcare, 3D electronics, and smart mobility. Henkel’s expertise in functional inks, combined with Teca-Print’s advanced pad printing technology, aims to accelerate project timelines and provide seamless development support. The partnership was showcased at TechBlick Berlin on October 23–24, highlighting their solutions in “Advancing Pad Printable Solutions with Henkel Materials.”
ZEISS introduces the Crossbeam 550 Samplefab, a fully automated FIB-SEM for TEM sample preparation in semiconductor labs. It achieves over 90% automation yield from bulk milling to TEM grid with minimal manual intervention, producing high-quality lamellae essential for accurate device diagnostics and yield improvement.
Veeco’s GENxcel® R&D Molecular Beam Epitaxy (MBE) System was selected by Ohio State University for epitaxial growth of high-quality gallium-antimonide (GaSb) compound semiconductors for infrared detectors (IR). The system, winner of the 2018 Compound Semiconductor (CS) Industry Innovation Award, will be delivered to the Ohio State University’s Krishna Infrared Detectors Laboratory.
Industry Event Participation
Many of our members kicked off October at the IMAPS International Symposium in Boston MA from September 30-October 3. You can read Françoise’s coverage in her latest blog, and listen to the member spotlight podcast episode here.
Brewer Science is advancing low-loss dielectric materials for high-frequency applications, strengthening domestic production and enabling complex 3D designs. Adam Scotch, R&D Director at Brewer Science, discussed these innovations in depth at the InterPACK Conference on October 10th.
Brewer also presented a groundbreaking continuous polymer precipitation process at the AIChE Conference, showcasing substantial improvements over traditional batch methods. This new system, optimized using Bayesian methods, significantly reduces antisolvent usage, processing time, and sublimation defects, while achieving high-purity polymers vital for semiconductor applications. Key presentations included Dr. Zhiqiang Fan on Bayesian optimization of this process and Dr. Walter Barnes on specialty materials manufacturing challenges, highlighting Brewer Science’s focus on efficiency and scalability in advanced materials production.
At the IEEE’s Packaging Chips with CHIPS: West Coast Summit, October 17, Tim Olson, founder and CEO of Deca Technologies, participated in a panel discussion focused on the CHIPS Act and Arizona’s innovation economy. Joined by experts from ASU, NXP Semiconductors, Amkor, the Greater Phoenix Economic Council, and the Southwest Advanced Prototyping Hub, Olson shared insights into Arizona’s increasing significance in the semiconductor industry.
Indium Corporation participated in the International Electronics Manufacturing Technology Conference (IEMT) from October 16-18 in Penang, Malaysia, where five experts presented their latest research on Pb-free soldering solutions for power electronics and advanced packaging. Strategic Advisor Dr. Dongkai Shangguan delivered a keynote on interconnect reliability in high-density, high-performance applications. Presentations included Product Manager Dean Payne’s insights into Pb-free die-attach alternatives, Demi Yao’s work on Cu sintering pastes for power applications, Sunny Neoh’s poster on low- and mid-temperature Pb-free solder preforms, and Mary Li Ma’s study on voiding control in QFN packages.
StratEdge Corporation participated in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) from October 27-30, 2024, in Fort Lauderdale, Florida, where it showcased its advanced thermally-enhanced ceramic and molded semiconductor packages. Designed to support applications from DC to over 63 GHz, these packages provided ultra-low-loss performance and efficient heat dissipation, essential for high-frequency devices in automotive, wireless, and aerospace sectors.
Veeco is excited to announce that it will ring the NASDAQ Opening Bell on Tuesday, November 19th, to celebrate its 30th anniversary as a NASDAQ-listed company. More information and a link to the live stream will be provided as the date approaches.
ZEISS showcased its latest advancements at the 50th Annual ISTFA Conference from Oct. 28 to Nov. 1, 2024, in San Diego. Activities included four tutorials, six paper presentations, two panel discussions, and a Tools of the Trade tour, focusing on AI-driven fault isolation, failure analysis, and yield enhancement. In addition, ZEISS offered in-booth virtual demos of its new VersaXRM 730 X-ray microscope, featuring 450 nm resolution and AI-powered DeepRecon Pro for faster, high-quality imaging.
Company Development
ASE is celebrating 40 years of pioneering advancements in Advanced Packaging technology since its founding in 1984. Committed to the belief that “Technology can make a better world,” ASE focuses on continuous progress and innovation.
Brewer Science has appointed Dan Brewer and Dr. Sri Kommu as co-CEOs, marking a strategic step in driving innovation in semiconductor materials. Dan, former EVP of Corporate Resources, and Sri, former EVP of Corporate Operations, will jointly lead the company, focusing on growth, collaboration, and cutting-edge technology. Founder Dr. Terry Brewer will continue providing guidance, supporting the company’s ongoing leadership in advancing next-generation computing technologies.
Amkor Technology reported strong third-quarter financials, with net sales of $1.86 billion, a 27% sequential increase driven by demand for their Advanced SiP technology in communications and consumer markets. The quarter saw a gross profit of $272 million, operating income of $149 million, and net income of $123 million, with earnings per share of $0.49. Amkor’s focus was on scaling production for high-volume products and reinforcing key industry partnerships to support regional supply chain resilience.
EV Group has expanded its management team, welcoming Alexander Rank as Executive Corporate Functions Director. With over a decade at EVG, Rank will oversee finance, controlling, purchasing, human resources, and other corporate functions. This new role aligns with EVG’s growth strategy and ongoing investments in development, production capacity, and global infrastructure enhancements to better support manufacturing customers and development partners.
TechSearch International emphasizes the importance of understanding the companies and individuals driving innovation in the semiconductor industry. This month, the team is traveling across Asia, sharing updates from team member Jan Vardaman’s visits.
Finetech’s Summer Party turned it’s team into Olympic hopefuls, celebrating core values like courage, respect, and fair play. The event fostered strong community spirit, with team members and their families participating in activities like table tennis, archery, and a cocktail workshop. Children enjoyed face painting, VR experiences, and visits from popular characters.
Sustainability
SEMI’s Energy Collaborative (EC) released a report recommending policy changes to expand low-carbon energy (LCE) options in Taiwan, addressing regional challenges in LCE procurement. The report outlines strategies such as introducing diverse procurement mechanisms, revising offshore wind policies, and refining power purchase agreements (PPAs) to help Taiwan’s corporate energy users meet 2030 LCE goals. SEMI applauds recent policy updates in Taiwan and anticipates continued collaboration with industry and government stakeholders to drive LCE adoption across Taiwan and other key semiconductor regions.
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