Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing
Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up: Materials Innovation for Additive Electronics at InterPACK 2024 on October 10, 2024.
The U.S. supply chain needs innovative materials to ramp up additive electronics manufacturing
As the electronics industry faces new challenges in miniaturization and performance, there is a critical need for innovative materials and processes to drive the next wave of growth. Traditional microelectronics technologies, from photolithography to printed circuit board (PCB) fabrication, have remained largely unchanged for decades. While additive manufacturing has seen rapid development, primarily in polymers and metals for structural applications, there is a significant opportunity to advance materials specifically for electronics, such as low-loss dielectrics materials for high-frequency applications.
As the U.S. seeks to close the gap with global competitors and build a robust domestic infrastructure, additive manufacturing offers a pathway to achieving these goals. With a strong foundation in materials science and a commitment to advancing additive electronics, Brewer Science is poised to lead the charge for change in the electronics industry, just as it did with bottom antireflective coatings 40 years ago.
“As the demand for miniaturization and high-performance electronics grows, the U.S. supply chain must create new innovative materials that can meet these challenges,” states Adam Scotch, director, R&D, printed electronics at Brewer Science. “Our development of low-loss dielectric materials for additive manufacturing is key to enabling the next generation of electronic devices and strengthening domestic production.”
Materials expertise and industry collaboration pave a future of innovative microelectronic production in the U.S.
Brewer Science is at the forefront of materials innovation, leveraging its extensive expertise in polymer chemistry to develop printable, low-loss dielectric materials that meet the needs of modern electronics. These materials have the potential to revolutionize domestic electronics packaging by enabling new capabilities, reducing costs, and supporting a more resilient domestic supply chain.
Additive manufacturing will enable more freedom for integrated and innovative design approaches, such as creating complex 3D traces and vias, and embedded functions like RF and optical waveguides, all within a single manufacturing process. This holistic method allows for the construction of electronic circuits from the ground up, breaking down traditional silos by merging the function of chips, packages, and PCBs into unified multifunctional components.
The presentation addresses three prominent industry questions:
- How can innovative materials like low-loss dielectrics advance additive manufacturing for high-frequency electronic applications?
- What role does additive manufacturing play in reshaping domestic electronics packaging and supply chain resilience?
- How can integrated design approaches, enabled by additive electronics, overcome the limitations of traditional microelectronics technologies?
Building Circuits from the Ground Up: Materials Innovation for Additive Electronics will be presented by Adam Scotch, Ph.D., director, R&D, smart devices and printed electronics at Brewer Science during Additive Manufacturing for Electronic Devices and Interconnects Session on October 10th 11 a.m. PST in Salon M at InterPACK Conference in San Jose, California. You can view the event itinerary here.
For those unable to attend the event, additional information can be requested at the bottom of our website.
