2024 IEEE International Electron Devices Meeting Spotlights Advances in Critical Semiconductor Technologies

Shaping Tomorrow’s Semiconductor Technology

Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies. That tradition continues this year, when the 70^th annual IEEE IEDM conference takes place December 7-11, 2024 at the Hilton San Francisco Union Square hotel, with online access to recorded content available afterward.

The IEDM is considered the largest, most prestigious forum where scientists and engineers come together to disclose, discuss and debate the best recent R&D work in electron devices such as transistors. While there are other excellent technical conferences specializing in particular areas of the technology, no other meeting presents so much leading work in so many different areas of the field.

The 2024 IEDM technical program, supporting the theme “Shaping Tomorrow’s Semiconductor Technology” will consist of more than 270 presentations plus a full slate of events including an evening panel, Focus Sessions, Tutorials, Short Courses, a career luncheon, supplier exhibit and IEEE/EDS award presentations.

“Society needs more computing power to satisfy the needs of fast-growing applications like artificial intelligence/high-performance computing (AI/HPC); electrification and automation of transportation and manufacturing; wireless and high-speed communications; quantum computing, and many others,” said Kang-ill Seo, IEDM 2024 Publicity Chair and Vice President, Semiconductor R&D, Samsung Semiconductor.

“These needs will continue to grow, and the IEDM program shows the way to meet them. Many papers discuss striking advances in logic and memory technology, such as monolithic integration of various functions, 3D architectures, and system-level design and technology co-optimization for increased performance at reduced power and cost. Also, many applications of AI are seen throughout the program, in neuromorphic computing and other areas.”

“Since the conference began in 1955, our speakers have gone from talking about single transistors to entire systems,” said Gaudenzio Meneghesso, IEDM 2024 Publicity Co-Chair, and Head of the Department of Information Engineering at the University of Padua. “Noteworthy this year are the many papers on ways to make more efficient, higher-performing CPUs for HPC and machine learning (ML); how gate-all-around (GAA) technology is progressing for next-generation logic; and the high-speed devices which are bringing 6G wireless communications to reality.”

Here are details of the 2024 IEEE International Electron Devices Meeting:

Keynote Presentations – Plenary Session, Monday, Dec. 9

Semiconductor Industry Outlook and New Technology Frontiers, Y-J. Mii, Executive Vice President and Co-Chief Operating Officer, TSMC
Advancing AI with Energy-Efficient Architectures: Innovations in Fab Process, Packaging, and System Integration, Mark Fuselier, Sr. Vice President, Technology and Product Engineering, AMD
Revolutionizing Power Electronics with Silicon Carbide to Pioneer Sustainable Solutions, Elif Balkas, Chief Technology Officer, Wolfspeed

Tutorial Sessions – Saturday, Dec. 7

The Saturday tutorial sessions on emerging technologies are presented by experts in the field to bridge the gap between textbook-level knowledge and leading-edge current research, and to introduce attendees to new fields of interest. There are three time slots, each with two tutorials running in parallel:

1:30 p.m. – 2:50 p.m.

System Scaling with Wafer-Level Integration Technologies, Chih Hang, TSMC
Advances in CMOS Technologies and Future Directions for Cell Height Scaling, Anupama Bowonder, Intel

3:05 p.m. – 4:25 p.m.

Co-Packaged Photonics for Improved Energy Efficiency and Performance of AI Applications, Clint Schow, Univ. California-Santa Barbara
Current Understanding and Future Challenges of Gate Dielectric Breakdown Reliability, Ernest Y. Wu, IBM

4:40 p.m. – 6:00 p.m.

EUV Lithography for the Age of AI, Anthony Yen, ASML
Magneto-Ionics for Energy-Efficient and Reconfigurable Nanoelectronics, Kai Liu, Georgetown University

Short Courses – Sunday, Dec. 8

In contrast to the Tutorials, the full-day Short Courses are focused on different aspects of a single technical topic. They offer the opportunity to learn about important areas and developments, and to network with global experts.

Short Course 1: Technology Innovations Shaping the Roadmap in the Era of AI, organized by Anabela Veloso, IMEC
- Sailing into the Future of the Semiconductor Industry, Lipen Yuan, TSMC
- Into the Multidimensional World of Advanced Logic Technology, Yu-Lin Chao, Intel
- Evolution of Memory Technologies for Advanced Nodes via the Third Dimension, Jeonghoon Oh, Samsung
- The System Revolution Enabled by 2.5D and 3D Technologies, Muhannad Bakir, Georgia Tech
- Advanced Metrology for Next Generations of Stacked Devices/Systems: Challenges and Opportunities, Etienne de Poortere, ASML
- Multiscale Thermal Challenges and Modelling Frameworks for Advanced Device Technologies and Systems, Bjorn Vermeersch, IMEC
Short Course 2: AI Systems and the Next Leap Forward, organized by Andy Wei, Intel
Evolution of AI Hardware: Past, Present and Future, Anand Joshi, TechInsights
AI Accelerator Hardware and Research Directions, Brucek Khailany, NVIDIA
Memory Requirements and Solutions for AI Accelerators and HPC, Emanuele Confalonieri, Micron
3DIC STCO for AI Systems, Victor Moroz, Synopsys
Developing Modern Scalable 3DIC Systems and Next Generation EDA, Vivek Rajan, Intel
Leveraging AI to Revolutionize Semiconductor Manufacturing, Brett Schroeder, Applied Materials

Luncheon – Tuesday, Dec. 10

There will be a career-focused luncheon featuring industry and scientific leaders talking about their personal experiences in the context of career growth. The discussion will be moderated by Janina Beilner, Senior VP Healthcare Vertical, Siemens, and Appointed Lecturer, FAU Erlangen-Nürnberg. The speakers will be:

Anna Fontcuberta-i-Morral, Full Professor at EPFL, who will become the first female president of EPFL in 2025. She is the winner of the 2015 Emmy Noether Award, given to top aspiring female research scientists in any STEM field to help realize their potential careers through financial and networking assistance.
Iuliana Radu, Deputy Director at TSMC, and previously Program Director and Distinguished Member of the Technical Staff at IMEC

Evening Panel Session – Tuesday evening, Dec. 10

The IEDM evening panel session is an interactive forum where experts give their views on important industry topics, and audience participation is encouraged to foster an open exchange of ideas. This year’s panel will be moderated by Ali Keshavarzi of Stanford University. It will focus on the theme, “IEDM at 70 – Building on the Past while Preparing for the Future – What is Next?”

Vendor Exhibition/MRAM Global Innovation Forum

A vendor exhibition will be held once again.
Sponsored by the IEEE Magnetics Society, the 16th MRAM Global Innovation Forum will be held in the same venue the day following the IEDM conference, on Thursday, Dec. 12.

Further information about IEDM

For registration and other information, visit www.ieee-iedm.org.

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