Nordson Te
st & Inspection today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan.
In booth #L0516, the company will be showcasing its state-of-the-art inspection and metrology solutions, including the Quadra 7 Pro Manual X-ray Inspection (MXI) System, the new SpinSAM Acoustic Micro Imaging (AMI) system and the Gen 7 AMI system. The company will also demonstrate the WaferSense® Auto Teaching System™ (ATS2) for semiconductor tool set-up and maintenance.
The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.
Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.
Enhancing the Quadra 7 Pro’s capabilities is the newly developed Revalution™ software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution™ software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.
The new SpinSAM AMI system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with the best-in-class defect capture and image quality.
With 4 matched waterfall transducers in a compact footprint, the system was meticulously engineered to attain full wafer scans in less than 6 minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.
The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.
The WaferSense® Auto Teaching System™ (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum™ software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.
Nordson is a platinum sponsor of Semicon Taiwan and will be delivering a presentation titled ‘Revolutionary Acoustic Technology for Wafer-Level Applications’ at the Heterogeneous Integration Global Summit on Thursday, September 5th at 11:50am local time at 701GH, 7F, Taipei Nangang Exhibition Center Hall 2.
For more information, visit www.nordson.com.
