Get ready, because the IMAPS International Symposium on Microelectronics is coming up quickly. As the event continues its very impressive run of 57 years, this year’s symposium will take place from September 30 – October 3 at the Encore Boston Harbor. With 15 3D InCites Community Members presenting and 20 exhibiting, we’re excited to be well-represented at yet another industry conference!
Not only will so many of our members be there, but 3D InCites will have a significant presence as well. This year, we’re partnering with IMAPS to host the first 3D InCites Community Career Fair at the event on Tuesday, October 1 from 4-6 p.m.
The goal is to match jobseekers in the microelectronics industry and advanced packaging space with our leading-edge member companies in a casual, networking setting. Hiring Managers, if you have open positions that you’d like to fill, please reach out to Brian Schieman at bschieman@imaps.org for more information on how to secure your table.
Francoise will also be on-site podcasting! Members – be sure to secure your spot – as there are only 10 slots available. In the meantime, check out our list of member events and booth numbers to help plan your IMAPS schedule.
Featured Sessions and Events
Special Sessions on Onshoring – Onshoring High-Density Interposers and Fan-Out WLP/PLPs:
- Monday, September 30 from 3:15-4:30 p.m.
- Panel Chair – Ted Tessier, IBM
3D InCites Community Career Fair
- Tuesday, October 1 from 4-6 p.m.
- Hosted by IMAPS
- Meet with Amkor, MRSI, Northrop Grumman
Panel Session – RDL Packaging for High-Performance Applications
- Wednesday, October 2 from 6:30-7:45 p.m.
- Moderated by Jan Vardaman and John Hunt, TechSearch International
- Panelists include Tim Olson from Deca and Ou Li from ASE Group
MRSI Mycronic Tour
- Thursday, October 3 from 1-5 p.m.
- Tour of MRSI Mycronic, Tewksbury facility
3D InCites Member Sessions
TMP2 – Invited Session: Hybrid Bonding – Hybrid Bonding Process Technology
- Tuesday, October 1 from 1:15-2:40 p.m.
- Guilian Gao and Laura Mirkarimi
Amkor
W-AM1 – IC Package Modeling/Simulation and Characterization – Study of the Effect of Gravity Weight on Strip Warpage
- Wednesday, October 2 from 10:30-10:55 a.m.
- Elizabeth Fortin, Nathan Whitchurch, Wei Lin, and EunSook Sohn
W-AM2 – Advances in Wafer Level Packaging – Trace Fusing Current Simulation in Redistribution Layer of Wafer Level Packages
- Wednesday, October 2 from 12-12:25 p.m.
- Nathan Whitchurch, JeongMin Ju, JiYeon Yoon, EunSook Sohn, and KyungRok Park
TH-AM4 – Heterogeneous Integration – Substrates – Selecting Between Strip-Based and Singulated Laminates for Chiplet Packaging Assembly
- Thursday, October 3 from 9:30-9:55 a.m.
- Brendan Wells
TH-AM4 – Heterogeneous Integration – Substrates – Substrate Warpage Study for Chiplets Packaging
- Thursday, October 3 from 10:30-10:55 a.m.
- Hoon Jung, Drake Miller, and Gookjin Jung
ASE Group
The Evolution of Flip Chip Package Technology
- Monday, September 30 from 8-10 a.m.
- Mark Gerber
System-in-Package (SiP) – System Solutions Through Miniaturization
- Monday, September 30 from 1-3 p.m.
- Mark Gerber
W-PM1 – New Material and Process Development for Manufacturing – Embedded Substrate Via Forming Technology Analysis and Profit
- Wednesday, October 2 from 1:30 – 1:55 p.m.
- Huang wen Hung, Tseng Cheng Ming, Chung Yan Wen, Huang MIn Lung, LIn Yue Nung, and Fang Jen Kuang
RDL Packaging for High Performance Applications – Panel Discussion
- Wednesday, October 2 from 6:30-7:45 p.m.
- Ou Li
TH-AM4 – Heterogeneous Integration – Substrates – Heterogeneous Integration Structure – FOSub for High End Product Substrate Development
- Thursday, October 3 from 10-10:25 a.m.
- Huang Wen Hung, Huang Min Lung, Lin Yue Nung, Fang Jen Kuang, and Chou I Hsuan
Brewer Science
TMP2 – Invited Session: Hybrid Bonding – Materials for Hybrid Bonding
- Tuesday, October 1 from 1:15-2:40 p.m.
- Dongshun Bai, Andrea Chacko, and Rama Puligadda
Deca
RDL Packaging for High Performance Applications – Panel Discussion
- Wednesday, October 2 from 6:30-7:45 p.m.
- Satoru Kuramochi
TPM2 – Invited Session: Hybrid Bonding
New Developments for Low Temperature Fusion and Hybrid Bonding Technology
- Tuesday, October 1 from 3:45-5:40pm
- Viorel Dragoi, Thomas Plach, Thomas Uhrmann and Paul Lindner
Fraunhofer IZM
Antenna-In/On-Package Platform Technologies and Materials for Radar, 5G, and 6G
- Monday, September 30 from 8-10 a.m.
- Ivan Ndip
Fundamentals of Substrates for High-Frequency Packaging and Heterogeneous Integration
- Monday, September 30 from 1-3 p.m.
- Ivan Ndip
TPM1 – System Architecture, Design & Integration: Molded SiP Manufacturing with Integrated Shielding Layer for Optimized EMI Robustness
- Tuesday, October 1 from 2:15-2:40 p.m.
- Karl-Friedrich Becker, Steve Vogues, and Gueven Safak
Henkel
Fundamentals of Electronics Thermal Management
- Monday, September 30 from 10:30 a.m. – 12:30 p.m.
- Rita Mohanty
W-AM2 – Advances in Wafer Level Packaging – Low Warpage Liquid Compression Molded Underfill for Wafer Level Packaging
- Wednesday, October 2 from 11:30-11:55 a.m.
- Raj Peddi
TH-AM5 – Epoxies and Dielectrics/ Thermal Management Processes & Materials – Next Gen Phase Change Material for High Power Electronics
- Thursday, October 3 from 12-12:25 p.m.
- Rita Mohanty and Tho Quang Nguyen
IBM
Interactive Special Session – Onshoring High Density Interposers and Fan-Out WLP/PLPs
- Monday, September 30 from 3:15-4:30 p.m.
- Brandon Hamilton
TPM4 – 2.5D/3D – Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips
- Tuesday, October 1 from 1:15-1:40 p.m.
- Marc-Olivier Pion
Indium
TH-AM5 – Epoxies and Dielectrics/ Thermal Management Processes & Materials – Study of Thermal Conductivity and Reliability of InAg Soldering Thermal Interface Material by Reflow Process in Formic Acid Atmosphere for TIM1 IC Module Package
- Thursday, October 3 from 9:30-9:55 a.m.
- Guangyu Fan and Jie Geng
Kulicke & Soffa
Wire Bond Physics & Process Optimization
- Monday, September 30 from 10:30 a.m. – 12:30 p.m.
- Aashish Shah and Henri Seppanen
LPKF
W-AM4 – Glass – Technical Innovations in Advanced Packaging: Integrating functional Structures within Glass Substrates Using Laser Induced Deep Etching (LIDE) Technology
- Wednesday, October 2 from 11-11:25 a.m.
- Nils Anspach, Daniel Dunker, Richard Noack, Roman Ostholt, Rafael Santos, and Norbert Ambrosius
Mosaic Microsystems
W-AM4 – Glass – Integrity and Reliability of Cu Through-Glass Vias in Thin Glass Substrates
- Wednesday, October 2 from 10:30-10:55 a.m.
- Joshua Roys, Brittany Hedrick, Kyle Liddle, Shelby Nelson, and David Levy
MRSI Mycronic
- MRSI Mycronic tour
- Thursday, October 3 from 1-5 p.m.
NAMICS
TH-AM1 – Innovative Materials for Integration and Assembly – Printable Epoxy Paste for Varistor Applications
- Thursday, October 3 from 11:30-11:55 a.m.
- Nick Krasco, Zhixiang Lu, and Kazu Imai
Siemens
TPM1 – System Architecture, Design & Integration: Using a Novel Co-Design Prototyping Approach for Mixed Memory System-in-Package Devices
- Tuesday, October 1 from 1:15-1:40 p.m.
- Kevin Rinebold, Justin Locke, and Keith Felton
TechSearch International
RDL Packaging for High Performance Applications – Panel Discussion
- Wednesday, October 2 from 6:30-7:45 p.m.
- Moderated by Jan Vardaman and John Hunt
Member Exhibitor List
