In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira Fulton School of Engineering at Arizona State University (ASU). At the time, the organization had just submitted its proposal to the Microelectronics Commons, a national initiative funded through the CHIPS and Science Act.
I went to learn what it was all about, as several 3D InCites members are SWAP Hub partners, including Deca, Lam Research, Siemens EDA, and Cadence. Fast forward 13 months, and the ASU’s SWAP Hub made it through the selection process and ramped up activities.
ASU’s SWAP Hub Update
Last week, a press conference at ASU’s MacroTechnology Works brought together leaders from academia, government, and industry to announce funding awards. It also updated attendees on the progress of ASU’s SWAP Hub and similar initiatives in California.
Through the Microelectronics Commons initiative, The Biden-Harris administration has invested millions of dollars to create and support prototyping hubs across the country. These hubs help bridge the gap between early-stage research and full-scale commercial manufacturing, to keep the U.S. competitive in the global semiconductor industry. This event marked a major milestone, celebrating the award of $270 million across various projects.
Tarun Chhabra, Deputy Assistant to the President for Technology and National Security, spoke about the bipartisan support behind the CHIPS Act and why it is so crucial for the U.S. to regain control over semiconductor manufacturing, especially after the pandemic highlighted the vulnerabilities in global supply chains.
He said Arizona’s SWAP Hub received $30 million for five key projects that will support advancements in technologies like 5G, AI hardware, and secure IoT. Chhabra explained that investments are critical to regaining U.S. leadership in microelectronics and strengthening national defense capabilities.
Chhabra also highlighted the SWAP Hub’ technology transfer agreement with the Deca to create the first R&D facility for fan-out wafer-level packaging (FOWLP). This new R&D center combines state-of-the-art equipment, materials, and expertise to foster the development of next-generation packaging technologies. The goal is to accelerate the transition from proof-of-concept to pilot-scale production, said Chhabra.
Investments in Workforce Development
Apart from the technology focus, I was glad to see the emphasis on workforce development throughout the event.
Kyle Squires, Dean of the Ira A. Fulton Schools of Engineering at ASU, noted that with 33,000 students currently enrolled in engineering programs, ASU is committed to ensuring that its graduates are ready to lead in microelectronics research and manufacturing.
Local leaders like Phoenix Mayor Kate Gallego and Tempe Mayor Corey Woods also spoke about how these investments are transforming the local economy. Phoenix, in particular, is becoming a global hub for semiconductor manufacturing thanks to massive investments from companies like Intel and TSMC.
Gallego shared inspiring stories about how high-wage jobs in this sector are changing lives, especially in underrepresented communities. She mentioned apprenticeships at TSMC, where young Latino and Navajo workers are earning life-changing wages while contributing to a vital industry.
Northwest AI Hub Tackles AI Energy Issue
Presenters at the press conference extended beyond Arizona, with several Hub leaders from California weighing in on their respective projects. The one that captured my attention was presented by Philip Wong, a professor at Stanford University and the lead for the Northwest AI Hub.
His group is addressing the critical issue of power-hungry AI chips by creating energy-efficient, scalable AI hardware systems using heterogeneous integration of specialized chips. I was also excited to learn that one of our member companies, Nhanced Semiconductors plays a crucial role in building these next-generation AI systems.
All in all, I’m excited to see the role Arizona will play in the semiconductor industry’s future. These investments are laying the foundation for future leadership not just in microelectronics, but across critical sectors like AI, healthcare, and national security.
The SWAP Hub at ASU and initiatives like the Northwest AI Hub are at the forefront of this effort, driving innovation, fostering collaboration, and creating opportunities for a new generation of American engineers and scientists. I look forward to what the future holds as these projects begin to deliver real-world results.
