Dr. Dev Palmer Takes over the Reins CHIPS NAPMP
The Department of Commerce has announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP).
Dr. Palmer joins CHIPS for America from DARPA where he most recently served as Managing Director of Next-Generation Microelectronics Manufacturing (NGMM) at the DARPA Microsystems Technology Office (MTO). He has also served as the Deputy Director of the MTO.
Whitney Mason, Director of DARPA MTO, is currently acting as NGMM PM while they search for a permanent PM.
In July, the NAPMP issued a Notice of Intent (NOI) for new R&D activities to establish and accelerate domestic capacity for advanced semiconductor packaging. The CHIPS for America program anticipates up to $1.6 billion in funding innovation across five R&D areas.
NAPMP will award approximately $150 MM each for the listed research areas. These awards will leverage private sector investments from industry and academia. This will be the second funding opportunity for the NAPMP.
The first funding opportunity for the NAPMP was released in February 2024 and focused on advanced packaging substrates and substrate materials.
NAPMP plans to award ~ $300 million in amounts up to approximately $100 million over up to five years per award. Full applications for the first NAPMP funding opportunity were due on July 3, 2024.
New Entrant into the Glass Core Substrate Marketplace
The SCHMID Group announced it is taking the next step towards advanced packaging for integrated circuits with glass cores.
Founded in 1864, the Schmid group employs more than 800 staff worldwide and has technology centers and manufacturing sites in multiple locations including Germany and China. The SCHMID Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. The Group has system and process solutions for substrate manufacturing substrates, printed circuit boards, and other electrical components.
Based on decades of experience in glass processing and substrate manufacturing at their 3000 sqm laboratory located in Freudenstadt, Germany, SCHMID has developed the capability to produce and metalize glass cores, as well as the redistribution layers on both sides.
Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution claims to be the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced IC Package.
The company says it expects the first beneficiaries of this technology to be the AI and data center sectors but soon after, they see glass cores expanding into any high-speed computing application, for example, such as automotive applications.
SCHMID Solution
The SCHMID R&D center reportedly can add this full build-up “fan out” layer on top based on the standard semi-additive process (SAP), or with their internally developed embedded traces (ET) process.
Customers can sample full format packages substrates fabricated on 24 x 24” glass panels with glass core thickness ranging from 200μm to 1.1mm,
All the manufacturing tools are reportedly based on high-volume manufacturing (HVM) platforms and can expand to HVM production. The installed pilot line is also offered to key customers to expand their R&D capability.
SCHMID Expertise in Glass:
SCHMID has provided glass processing solutions to the PV, anti-glare, and display industries for many years. Glass cleaning and etching of ultra-thin glasses including FOUP-based automation is within the SCHMID standard machine portfolio. They report that a high aspect ratio through glass via formation requires the knowledge base for using the right laser and etching parameters for the different types of glasses as well as a profound electro-plating experience for a void-free through-hole copper filling and planarization. All of this has been developed by SCHMID over the last years and will be provided.
Embedded Trace (ET) Technology:
Glass cores have the advantage of offering the required planarity and thermal stability to enable the required size reduction and layer-to-layer registration accuracy. However, this accuracy needs to be matched by the layer build-up technology, too. The SCHMID ET process claims to be the next generation of sequential build-up production technology, offering not only a planar surface for each layer but also access to a new via formation, that does not use laser drilling.
The new SCHMID glass core substrate lab also includes the capability to use the next generation of Ajinomoto Build Up Films (ABF) based fan out.
Calumet Announces Collaboration with Schmid Group
Calumet Electronics and SCHMID Group (Freudenstadt, Germany) recently announced a collaboration to establish a US advanced substrate facility.
Calumet was recently awarded an onshoring PCB contract through the US Department of Defense under DPA Title III.
Through this strategic partnership, Calumet and SCHMID are collaborating to scale domestic production capacity for advanced substrates. SCHMID is providing equipment, while Calumet is taking the lead in expanding its manufacturing capabilities.
According to the announcement, the project will implement cutting-edge processes and production technology, enabling the production of mSAP, SAP, and ET on a single versatile platform.
The project is projected to attract a total capital investment of nearly $50 million. Calumet received a significant investment from the US Department of Defense, which awarded them $39.9 million via the DPA Title III Program. This grant empowers Calumet, in collaboration with SCHMID, to enhance manufacturing capabilities.
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