August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved.
Technology Innovation:
Lam Research has introduced Lam Cryo™ 3.0, the latest advancement in its cryogenic dielectric etch technology, designed to meet the growing demands of the AI-driven memory market. This third-generation technology is critical for manufacturing the next iteration of 3D NAND flash memory, which requires ultra-precise etching of deep, narrow high aspect ratio (HAR) memory channels. Lam Cryo 3.0 leverages ultra-cold temperatures, advanced plasma reactor technology, and innovative surface chemistry to achieve atomic-scale precision with a profile deviation of less than 0.1%, significantly improving yields and performance for AI applications.
ACM Research has unveiled the Ultra ECP ap-p tool, the first of its kind to use horizontal plating for fan-out panel-level packaging (FOPLP). This innovative tool delivers exceptional uniformity and precision across large panels, making it ideal for advanced packaging applications such as GPUs and high-density memory. Supporting panel sizes up to 600mm x 600mm, it handles various plating processes, including copper, nickel, and tin-silver. The tool features advanced automation and optimized electrical field management, enhancing production efficiency and reducing contamination risks in the manufacturing of large, high-density panels.
Kulicke & Soffa introduced its APTURA™ thermo-compression platform, advancing chiplet-enabling technology for AI, HPC, mobile, and edge devices. The platform has been adopted by key customers and supports advanced chiplet and stacked-die processes. K&S also demonstrated a new bumpless-FTC process for chip-to-wafer hybrid bonding, expanding its market potential. Additionally, K&S joined the “US-Joint” consortium to further packaging solutions, with a new R&D facility in Silicon Valley set to open in 2025. The company anticipates continued growth in advanced packaging technologies.
StratEdge Corporation is revolutionizing semiconductor packaging with its advanced molded and post-fired ceramic packages, designed for high-reliability in telecom, wireless, satellite, and defense sectors. Their molded packages handle high frequencies up to 18 GHz, while post-fired ceramics manage thermal performance for compound semiconductors like GaN and SiC, up to 63+ GHz. The company’s ISO 9001:2015 certified facility features a Class 1000 cleanroom and state-of-the-art assembly equipment, including a eutectic gold-tin attachment bonder. VP of Global Sales, Casey Krawiec, emphasized the precision and thermal management capabilities critical for optimal performance and reliability.
Veeco Instruments Inc. announced that IBM has selected its WaferStorm® Wet Processing System for advanced packaging applications and entered a joint development agreement to explore various wet processing technologies. The system, to be installed at the Albany NanoTech Complex, supports critical hybrid bonding cleaning processes with high precision and flexibility, handling multiple wafer sizes and thicknesses. Veeco’s Vice President, Mathew Abraham, highlighted the system’s high throughput and cost-effectiveness, emphasizing its role in advancing packaging and technologies such as cloud and AI. The WaferStorm system is recognized for its versatility in various markets, including advanced packaging, MEMS, and photonics.
HEIDENHAIN’s MULTI-DOF technology is pivotal for advancing semiconductor production for AI systems, shifting from monolithic chips to a chiplet approach. This transition has driven miniaturization from electrical-contact distances of 10 µm and accuracies of 1 µm to current standards of 2 µm and 200 nm. HEIDENHAIN’s Dplus encoders, which capture up to six degrees of freedom, support this evolution by enhancing accuracy and productivity in semiconductor manufacturing.
Partnerships:
SEMI’s Q2 2024 Semiconductor Manufacturing Monitor (SMM) Report, in partnership with TechInsights, reveals significant industry improvements, including strong IC sales growth, stabilized capital expenditure, and increased wafer fab capacity. Despite slower recovery in some end markets, the demand surge for AI chips and high bandwidth memory (HBM) is driving expansion. IC sales grew 27% YoY in Q2 and are expected to rise 29% in Q3, surpassing 2021 levels. Wafer fab capacity reached 40.5 million wafers per quarter, with forecasts for a 1.6% increase in Q3. Capital expenditures, down 9.8% YoY in the first half, are anticipated to turn positive, driven by memory investments. SEMI and TechInsights highlight a recovery in the semiconductor supply chain, with AI and HBM driving growth and preparing the market for a surge in 2025.
3D PLUS is proud to support the European Space Agency’s Jupiter Icy Moons Explorer (JUICE) mission with its high-reliability SDRAM, NAND FLASH, EEPROM, and SRAM components, ensuring robust data storage for mission-critical operations. JUICE recently achieved a milestone by completing a flyby using the gravity of both Earth and the Moon and will continue on to Jupiter and its icy moons.
Workforce Development:
The SEMI Foundation and Policy Equity Group have partnered to address the childcare needs of the U.S. semiconductor workforce, particularly in light of the U.S. CHIPS and Science Act. Funded by the W.K. Kellogg Foundation and the David and Lucile Packard Foundation, this collaboration aims to strengthen local childcare systems in Arizona, Ohio, and Michigan. The initiative will involve landscape analyses of the semiconductor workforce and local childcare systems, targeted outreach to connect women and underrepresented minorities to the industry, and the development of childcare plans that meet CHIPS Act requirements. The SEMI Foundation, along with its partners, seeks to create community-based solutions and provide resources to employers, ultimately supporting the growth and sustainability of high-quality, affordable childcare in semiconductor communities.
Cadence Design Systems has launched Fem.AI, a $20 million initiative to promote gender equity in the tech sector, focusing on AI opportunities. Over the next decade, the Cadence Giving Foundation will provide funding and support to nonprofits, university programs, and women-led ventures aligned with Fem.AI’s mission. The initiative addresses key challenges such as low female graduation rates in computer science, difficulties in securing AI jobs, and high attrition rates among women in tech. The inaugural Fem.AI Summit will be held on October 1 to foster industry-wide collaboration on gender equity.
Awards:
Indium Corporation has honored nine employees with its Silver Quill Award for their contributions to technical content creation in the electronics industry. The award recognizes innovative and cutting-edge research shared through conference papers, articles, and presentations. This year, two papers were highlighted: one on a bismuth-free, indium-containing solder paste for wafer-level packaging and another on reducing energy consumption using low-temperature solder alloys. Indium Corporation President and COO, Ross Berntson, encouraged the honorees to continue sharing their expertise, emphasizing that their work not only excites customers, but it also strengthens the company’s position as an industry leader and fosters a culture of continuous learning and improvement.
LQDX has been recognized in Semiconductor Review Magazine’s Top 10 Semiconductor Manufacturing Awards for this year, alongside prominent companies such as Applied Materials, Microchip Technology Inc., and Plasmatreat.
Sustainability:
SEMI released its first region-specific analysis of South Korea’s low-carbon energy (LCE) markets to help the semiconductor industry reduce greenhouse gas emissions. The report, developed by the SEMI Energy Collaborative (EC) with input from partners and the South Korean government, highlights the need for increased LCE investments and policy changes. It projects a significant gap in South Korea’s ability to meet 2030 corporate LCE targets, potentially reaching up to 50 TWh. Key recommendations include improving LCE procurement, enhancing community collaboration, and streamlining regulations for solar and wind projects. SEMI is working with South Korea’s Ministry of Trade, Industry, and Energy (MOTIE) to implement these solutions.
Events:
The IEEE Electronic Components and Technology Conference (ECTC) will mark its 75th anniversary from May 27-30, 2025, at the Gaylord Texan Resort & Convention Center in Dallas. The conference will feature over 2,000 attendees discussing advancements in semiconductor packaging, including emerging technologies. Abstract submissions are due by October 7, 2024, with details available at www.ectc.net.
Indium Corporation will showcase its advanced heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, September 4-6, in Taipei. Key offerings include the SiPaste® series for fine-feature printing, with new SiPaste® C312HF providing excellent performance and easy cleanability. Their Heat-Spring® TIMs, ideal for TIM2 applications, deliver high thermal conductivity and sustainability, while the GalliTHERM® portfolio features gallium-based liquid metals for superior heat dissipation and longevity. Visit booth #L0330 at SEMICON Taiwan to see how Indium’s innovations are driving AI advancements.
EV Group (EVG) will showcase its latest 3D integration process solutions, including hybrid and fusion wafer bonding, IR laser layer release technology, and advanced lithography at SEMICON Taiwan 2024. Highlights include presentations on EVG’s LITHOSCALE® maskless exposure system and disruptive 3D integration technologies for stacked systems. Dr. Thorsten Matthias notes Taiwan’s critical role in semiconductor production, and EVG’s expansion in local offices underscores its commitment to the region. Visit EVG at booth L0316 for insights into their advancements in automotive, communications, HPC, AI, and AR/VR.
Yield Engineering Systems announced its debut at SEMICON India from September 11-13, 2024. Attendees are invited to visit booth H1S11 to discover how YES’s products are engineering the intelligent future. Additionally, YES will host a fireside chat discussing India’s pivotal role in the advanced packaging ecosystem.
ASE Malaysia hosted C-suite executives from major government-linked investment companies and officials from key Malaysian government agencies. This effort was led by Deputy Minister, YB Chin Tong Liew, as part of a semiconductor study tour organized by Khazanah Nasional Berhad and REFSA. The visit highlighted ASE Global’s leadership in IC packaging, recent developments in Penang, and future plans, including an AI-driven wire bond line. The event facilitated valuable dialogue on advancing Malaysia’s role in the global semiconductor supply chain, with a focus on creating job opportunities and strengthening collaboration.
KLA employees from around the world recently participated in an extended reality hackathon hosted at the company’s India office. The event highlighted innovation and teamwork across regions.
Company Advancements and Opportunities:
Finetech has launched a new business development team, combining experienced professionals and fresh talent to elevate process development and client support. This team is dedicated to creating flexible, machinery-independent processes to enhance client support and position Finetech as a top solution provider. Their mission is to build and refine processes that maximize revenue potential and boost production system efficiency, focusing on innovation and precision to deliver high-quality solutions.
ACM Research introduces Sally Ann Henry as their new chief technologist.
SEMI is hiring a communications coordinator for EU-Funded projects in Berlin.
Mosaic Microsystems is hiring a senior R&D project manager based out of Rochester, New York.
Onto Innovation is hiring a project manager based out of Wilmington, Massachusetts.
Yield Engineering Systems is hiring a technical support engineer based out of Chandler, Arizona.
