The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a massive effort to collect data, understand customers’ needs, and behavior, and a quick and efficient response to the queries.
A growing number of silicon providers are coming to the market with solutions for training these Generative AI models. Nvidia, AMD, Google, AWS, Intel, Meta, and Tesla are all developing chipsets for AI. Most of these solutions today are a combination of ASICs/GPUs and large stacks of HBMs, usually packaged together. Training for these models typically requires a large dataset that undergoes billions of iterations between ASIC/GPU and Memory. Having ASIC/GPU very close to Memory in a package using 2.5D or 3D construction, improves the performance of the solution.
Such an architecture using chiplets requires a large substrate. These large substrates are not economically possible with traditional organic materials. The semiconductor industry is moving to glass-based substrates for leading-edge applications. Glass provides many benefits related to warpage, signal speed, and thermal management.
YES’s TersOnus TGV tool for panel-level manufacturing of through glass vias (TGV) uses a wet process for creating TGVs. It utilizes a laser-modified post-chemical treatment technology for improved etch rates. It is fully automated and can handle up to 12 panels at a time. This tool also offers integrated in-line metrology for process control and maintaining consistent etch rates with changing chemistry.
The other key building block of AI solutions is large HBM stacks. There could be as many as 8 to 12 stacks of HBMs in an AI solution. The VeroTherm FAR system from YES is designed to provide solutions for achieving sub-10-micron micro-bump structures with fluxless solder and mass reflow processes. This system provides superior quality and total cost of ownership for the manufacturing of advanced packages that use stacked logic and HBM.
Models of TersOnus TGV and VeroTherm FAR tools are on display this week at SEMICON West in Booth 433. YES technology experts can explain the features of these tools, and understand how they may fit your needs. Learn more at YES.tech.
