May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product launches to educational initiatives and workforce development programs, the semiconductor industry continues to evolve and thrive. Dive into the latest updates from our member companies and stay informed about the cutting-edge developments shaping the future of semiconductors.
Product Introductions
Siemens launched the Solido™ IP Validation Suite, an automated signoff tool for quality assurance in integrated circuit (IC) design intellectual property (IP). This suite ensures comprehensive QA coverage for all IP types, such as standard cells, memories, and IP blocks, across all design views and formats. It also supports version-to-version IP qualification, promoting more predictable full-chip integration cycles and faster market entry. The growing use of off-the-shelf design IP in semiconductor designs highlights the benefits of IP reuse and modularization for quality and time efficiency. Early validation of all IP is crucial to avoid costly tapeout revisions or silicon re-spins caused by late-stage issues in the design process.
EV Group introduced the new EVG®880 LayerRelease™ System, which doubles the throughput of their Semiconductor Layer Transfer Technology. This high-volume manufacturing platform enhances productivity and reduces costs by using infrared laser release technology through silicon carrier wafers for 3D integration applications. The system eliminates the need for glass carriers, enabling ultra-thin chiplet stacking for advanced packaging and 3D layer stacking for advanced logic, memory, and power devices, supporting future 3D integration roadmaps.
ERS Electronic unveiled its latest fully automatic machines in the Luminex product line for temporary bonding and debonding processes. These machines utilize the PhotoThermal debonding technology, providing a zero-stress, zero-force solution and reducing the cost of ownership by over 30% compared to laser debonding. With robust wafer handling down to 100 microns and a throughput of up to 50 wafers per hour, they offer unmatched efficiency and flexibility for semiconductor manufacturers and OSATs. According to Taguhi Yeghoyan, PhD, Senior Technology & Market Analyst at Yole Group, recent advancements in packaging technologies are projected to drive temporary bonding and debonding equipment revenue to $571 million by 2029, with a 16.6% CAGR from 2024-2029.
Strategic Moves
LQDX, previously known as Averatek Corp., announced the sale of its aluminum soldering business, Mina™, to Taiyo America Inc., a prominent global leader in advanced electronic materials. This strategic divestiture will enable enhanced scale-up of existing sales support and manufacturing capabilities. Additionally, the new partnership is expected to foster increased product traction and development, benefiting both companies.
Finetech joined a delegation trip to Singapore from May 27th to May 30th 2024, focusing on business development in the optics and photonics sectors. This initiative, supported by the Federal Ministry for Economic Affairs and Climate Action (BMWK), aims to foster valuable business connections for German companies.
Fraunhofer IZM is collaborating with Rapidus Corporation on advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab in Hokkaido to produce these microchips, with Japan’s METI approving their R&D plan for 2024. This partnership aims to advance technologies for 5G communications, autonomous driving, and high-performance computing.
NHanced Semiconductors Inc. relaunched its website with a new and improved design. The updated site includes insights into their Foundry 2.0 business model, additional news and blog options, an introduction to the company’s leadership team, and an easy online contact form. The goal is to help potential partners better understand NHanced Semiconductors, find suitable solutions, and reach the company quickly and easily. The redesigned website aims to provide more intuitive navigation and a visually appealing representation of the company.
Sustainablity/ESG Reports
SEMI released a report entitled, A Rising Tide: Building a Climate-Resilient Semiconductor Value Chain, which assesses the climate resilience of the semiconductor industry, led by the SEMI Sustainability Initiative ERMR working group. Using Nasdaq Sustainable Lens, the report analyzed sustainability data from 100 semiconductor companies and found that the industry’s climate disclosures are in the “Established” phase, with 40% higher TCFD alignment than average. However, reporting varies across value chain segments, and resilience to climate change remains a significant challenge, particularly in scenario analysis and risk assessments. The report highlights the importance of climate resilience for the industry’s long-term business strategies.
Amkor Technology, Inc. recently published its 2023 ESG Report, which explores its sustainability efforts. Highlights include their commitment to achieving net-zero GHG emissions by 2050, recognition from the Carbon Disclosure Project (CDP) with a Leadership (A-) score for climate change and water security reporting, Prime status from Institutional Shareholder Services (ISS) ESG, and significant progress in reducing environmental impact.
Workforce Development
IMAPS introduced the IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development. IMAPS has a strong track record of delivering in-person professional development initiatives and is now expanding to an on-demand environment. Students and professionals of all experience levels in the semiconductor advanced packaging ecosystem can learn about relevant processes, materials, and structures that are key in enabling microelectronic packaging directly from leading industry experts.
Siemens Digital Industries Software launched a new program to credential students, enhancing their career readiness and creating a stronger engineering talent pipeline. These credentials will supplement formal degrees by validating industry-specific knowledge and skills. The program includes pilot credentials, set to be the first recognized by ABET, ensuring they meet quality standards and address skill gaps in the engineering workforce.
SEMI launched SEMI University, an online learning platform offering certification programs to address the semiconductor industry’s talent gap by training and upskilling workers. These programs are designed to accelerate career development in the semiconductor field, catering to both newcomers seeking rewarding careers and experienced professionals aiming to update their skills to meet growing industry demand. SEMI is also supporting the European Chip Skills Academy Summer School, scheduled for August 18-23, 2024, in Bologna, Italy. University students will connect with professors to explore semiconductor learning paths and employment opportunities. The event, part of an EU-funded project coordinated by SEMI Europe and held at the University Residential Centre, University of Bologna, aims to grow the microelectronics industry workforce. Funded through the Erasmus+ program, the ECS Academy promotes dialogue and strategic planning in microelectronics. The Summer School will provide insights into current and future semiconductor technologies.
Industry Recognition
Gaurang Gunde at Deca Technologies was awarded the Advanced Multi-Die Packaging Best Presentation Award at the recent CadenceLIVE conference. The presentation was in regard to delivering the Full Benefits of maskless lithography and adaptive patterning with comprehensive design automation.
EV Group won its 12th consecutive Triple Crown Win in TechInsights 2024 Customer Satisfaction Survey. The company ranked 1st status across all participating award categories, including a first-place finish in “10 Best” and “The Best” suppliers segments as well as lithography equipment for the first time.
Trymax was recognized as a top manufacturing solutions provider in 2024 by the Semiconductor Review for delivering their next-generation wafer solutions.
Cadence has been recognized as one of the UK’s best workplaces for development by the Great Place To Work UK.
Workforce Gender Equality
Industry Events
SEMI hosted this year’s Women in Semiconductors (WiS) conference in mid-May, which reflected the growing strength of the movement to address challenges for women in the workplace and help them succeed in their chip industry careers, reaching a record attendance of nearly 220. Themed ‘Fostering an Inclusive and Equitable Workplace,’ the event was held in Albany, NY helped attendees establish meaningful connections, develop new soft skills, and recognize that they belong to a greater network and community of women and allies.
Brewer Science, Inc., recently presented and exhibited at the Electronic Components and Technology Conference (ECTC) on May 28th through May 31st, 2024. Brewer Science co-authored two presentations, both of which addressed a pressing issue in the advanced packaging semiconductor industry: accommodating higher integration density and improving performance while overcoming the limitations of high-temperature processing.
EV Group (EVG), presented on new developments in heterogeneous integration enabled by its advanced wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography, and revolutionary infrared (IR). Laser release solutions were highlighted in multiple papers at the Electronic Components and Technology Conference (ECTC) last week. EVG had a record seven papers and three posters in the ECTC technical program this year.
Indium Corporation featured its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the recent ECTC. Research Associate Kyle Aserian delivered a presentation as part of the Advanced Die Bond and Board Level Reliability session. Aserien examined the findings from the technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
Indium will share technical insights at PCIM Europe, June 11-13, in Nuremberg. Dean Payne will discuss Pb-free alternatives for power discrete die-attach, Andreas Karch will present on optimizing solder materials for power module heat dissipation, and Joe Hertline will explore materials selection for SiC molded packages and solder preform technology. Presentations will cover thermal management, reliability, and innovative solder alloys, with a mix of English and German sessions.
Career Opportunities
PDF Solutions is hiring for a remote Data Visualization Architect. This role offers the opportunity to be the Data Flow Master to design and implement optimized data pipelines and architectures to power visualizations, handling high-velocity, complex datasets in cloud (AWS, Azure, GCP) and on-premises environments. Apply today.
LDQX is searching for a Senior Product Development Engineer to be based out of Santa Clara, CA. They are searching for experienced candidates who are passionate about entrepreneurship and innovation. Apply through LinkedIn here.
