This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing chip design and manufacturing. New software tools are boosting design and verification, and our members are driving innovation through key collaborations and contributions. From product development to workforce initiatives that highlight Pride Month and industry inclusion, the semiconductor world is buzzing with activity and progress.
Advancements in Semiconductor Design Tools
Tony Hemmelgarn, President and CEO of Siemens Digital Industries Software (SDI), and other experts, presented new research and advancements in applied AI for semiconductor design at DAC 2024 from June 23-27. Key topics included the role of AI and the Digital Twin in chip design and manufacturing, highlighting the use of comprehensive Digital Twins to integrate design and manufacturing processes. AI is poised to address the growing complexity in semiconductor design by guiding engineers, encapsulating domain knowledge, and transforming data.
The event also explored AI’s impact on granular levels, such as transistor-level simulation and macro placement, demonstrating how Verifiable AI can enhance design and verification processes while reducing resources. These presentations showcased AI’s transformative role in the semiconductor industry.
SDI also took the opportunity to introduce:
- Solido™ Simulation Suite, an integrated suite of AI-accelerated SPICE, Fast SPICE, and mixed-signal simulators designed to accelerate design and verification tasks for analog, mixed-signal, and custom IC designs.
- Innovator3D IC™, a software that streamlines the planning and integration of ASICs and chiplets with advanced 2.5D and 3D semiconductor packaging technologies.
- Calibre 3DThermal, a cutting-edge tool for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).
Innovation Highlights
QP Technologies added a state-of-the-art Disco DFD6362 dicing saw to its manufacturing line, enhancing its die and wafer preparation capabilities. This fully automated system allows rapid processing of 300mm wafers, improving turnaround time and productivity. Additionally, the company has installed a Royce Autoplacer MP 300 die sorter, which enables precise, non-contact pick-and-place of the die during assembly, further extending its wafer prep proficiencies.
Adeia continues to advance hybrid bonding technology for high-performance semiconductor packaging, crucial for AI and other computing needs. Following its pioneering role, Adeia’s hybrid bonding has attracted significant interest, particularly after Kioxia Corporation and Western Digital signed a long-term licensing agreement for Adeia’s semiconductor patents. This technology integrates different functional elements like logic and memory using a direct bond interconnect (DBI®) process, enhancing electrical and thermal performance in compact systems.
NHanced Semiconductors, Inc. recently provided updates on the Odon, Indiana facility’s progress, which shows significant strides towards operational readiness. With a target for full facilitation by August 2024 and production commencement by January 2025, the team has achieved several milestones:
- The Packaging Assembly Cleanroom is fully operational with established Best Known Methods unit processes and a complete staff.
- The Main Manufacturing Cleanroom is equipped for advanced packaging manufacturing, including 2.5D/3D integration, with additional tools continuously being added.
- Infrastructure enhancements include a 30,000 sq. ft. plant, upgraded power and water systems, and robust backup capabilities. The facility also supports local ecosystem development and fosters collaboration with R&D and university partners progressing through ISO certification.
Collaborations
SDI reached a new milestone in its collaboration with Intel Foundry, achieving a new Electronic Design Automation (EDA) product certification. Additionally, they have made a significant breakthrough in embedded multi-die interconnect bridge (EMIB) enablement. These advancements aim to help customers quickly harness the performance, space, and power efficiency benefits of 3D integrated circuit (3D-IC) designs.
Additionally, in collaboration with Samsung Foundry, SDI has developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.
LQDX (say “lik-Wid-ix”) has entered into a multi-year sales and licensing agreement with Kansai Denshi Industries (KDI). This partnership will provide manufacturing support for next-generation IC substrates in semiconductor packaging and advanced printed circuit boards. Learn more here.
EV Group (EVG) and Fraunhofer IZM-ASSID announced a strategic partnership to develop and optimize alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing. Learn more here.
Adeia selected PulseForge photonic debonding equipment for advanced heterogeneous integration in semiconductors. The tool was installed at Adeia’s San Jose, CA, facility. Learn more here.
A joint study conducted by Indium and Pulseforge demonstrated groundbreaking advancements in electronics manufacturing soldering techniques. The study focused on validating photonic soldering using SAC 305 no-clean pastes, achieving surface insulation resistance (SIR) performance that meets IPC J-STD-004B/C standards under optimized process conditions. Key findings highlight the effectiveness of photonic soldering in achieving desired soldering outcomes, particularly with ultra-low residue pastes suited for rapid process cycles. Learn more here.
CTW Solutions and Trymax Semiconductor Equipment B.V. formed a strategic sales partnership to enhance market presence and customer support in the southwestern United States. This collaboration combines CTW Solutions’ innovative semiconductor solutions with Trymax’s leading-edge semiconductor equipment, aiming to deliver exceptional value and support to customers. Learn more here.
Workforce Development/Inclusion
The SEMI Foundation, the non-profit arm of SEMI, formed an industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce. Semiconductor PRIDE (Professionals for Respect, Inclusion, Diversity, and Equity) will focus on LGBTQ+ hiring, STEM outreach, mentorship, and fostering greater inclusion and belonging at semiconductor workplaces. The announcement comes as the world celebrates Pride Month in June.
Indium Corporation welcomes 13 new interns to its award-winning internship program. This launchpad for talented college students provides a unique opportunity to experience the company’s guiding principles of Respect, Appreciation, and Achievement. This program immerses interns in real-world business environments, where they work on projects and assignments aligned with company goals and initiatives. By the end of the program, interns gain valuable insights into the technology industry, build a network of professional contacts, and enhance their résumés and portfolios, ultimately feeding the company’s future employment pipeline
Northeastern University highlighted Onto Innovation for its achievements in providing invaluable skills and experience necessary to help students succeed in their field.
Employee Advancements
Indium Corporation appointed Werner H. J. Wagner as its new General Manager at Indium Corporation Advanced Materials GmbH. With a career spanning over three decades in business management and sales leadership, Wagner brings not just a wealth of experience, but also a proven track record of transformative leadership that is set to drive positive change at the company.
Congratulations to Gaurang Gunde, of Deca Technologies, who won the Best Presentation Award in the Advanced Multi-Die packaging track at CadenceLIVE for his presentation on “Delivering the Full Benefits of Maskless Lithography and Adaptive Patterning with Comprehensive Design Automation.
Congratulations to Jan Vardaman, CEO of Techsearch International, who was among six members of the iEEE Electronics Packaging Society who achieved the Distinguished Achievement award for Technical Leadership and Expertise at ECTC 2024.
Company Recognition
Finetech‘s recent appearance on “Advancements with Ted Danson” on Bloomberg Television highlighted the company’s cutting-edge contributions to microelectronics. Finetech’s die bonders, showcased for their versatility in both R&D and industrial microassembly, combine high throughput with precise placement accuracy and flexible processes.
The episode emphasized FineTech’s role in driving innovation in microelectronics, demonstrating how their high-accuracy micro-assembly equipment supports intricate applications. It underscored the impact of technological advancements on various aspects of daily life, from professional endeavors to leisure activities.
Watch the full episode here. (Finetech will be shown starting at 13:51)
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