The 2024 SEMI Europe 3D & Systems Summit takes place on June 12-14 at the Hilton Hotel in Dresden, Germany. Aptly themed Heterogeneous Systems for the Intelligently Connected Era, this conference will focus on component integration for powering the next wave of technological innovation.
From artificial intelligence, sensor data processing, and more, these innovations of the future will rely on the seamless integration between multiple different electronic components. Registration is open.
Steffen Kröhnert from E-SPAT Consulting and a member of our advisory board will represent 3D InCites at the event. Connect with Steffen onsite to learn more about becoming a 3D InCites member.
Catch our Members in Action
Don’t miss these presentations from 3D InCites Community Members.
Accelerating the AI Economy Through Heterogeneous Integration and the HIR
- Keynote presented by Bill Chen, from ASE Group
- Wednesday, June 12 from 3:30-3:50 p.m.
Opening Remarks by Session Chair
- Chris Jones, PVD Product Management, SPTS Technologies Ltd, a KLA company
- Wednesday, June 12 from 4:40-4:45 p.m.
Enabling AI with 3D
- E. Jan Vardaman, President, TechSearch International, Inc.
- Wednesday, June 12 from 5:55-6:15 p.m.
- Vardaman will also moderate the corresponding panel discussion from 6:15-6:55 p.m.
Key Takeaways by Session Chair
- Chris Jones, PVD Product Management, SPTS Technologies Ltd, a KLA company
- Wednesday, June 12 from 7:00-7:05 p.m.
Crossing the Chasm to a Chiplet Ecosystem: Test Innovation to Bridge Design and Manufacturing
- Ming Zhang, Vice President of R&D, PDF Solutions
- Thursday, June 13 from 9:05-9:25 a.m.
Co-Optimization of Semiconductor Systems: Extending the Roadmap Beyond Physical Scaling
- Seung Kang, Senior VP of Semiconductor Strategy, Adeia
- Thursday, June 13 from 9:25-9:45 a.m.
Accelerating 2.5D/3D Heterogeneous Packaging
- Anna-Lisa Stenger, Field Application Engineer, Siemens EDA
- Thursday, June 13 from 11:05-11:25 a.m.
Next Generation LASER Grooving for Plasma Dicing Integration
- Stephen Bamforth, Etch Product Manager Engineer, SPTS Division, KLA Corporation
- Thursday, June 13 from 11:55 a.m.-12:15 p.m.
Combination of High-Density Interconnect Technologies for Chiplet Integration on Si Interposer
- Juliana Panchenko, Fraunhofer Institute for Reliability and Microintegration IZM
- Thursday, June 13 from 1:35-1:55 p.m.
Innovative Equipment and Process Solutions for 3D Integration
- Lee Chee Ping, Senior Director, Advanced Packaging Customer Operations, Lam Research Singapore
- Thursday, June 13 from 2:15-2:35 p.m.
Opening Remarks by Session Chair
- Manuela Junghähnel, Head of Department Wafer Level System Integration, Center ASSID, Fraunhofer Institute for Reliability and Microintegration IZM
- Thursday, June 13 from 2:40-2:45 p.m.
Motion System Solutions for Hybrid Bonding Challenges
- Hervé Stämpfli, Head of Systems Product Portfolio, HEIDENHAIN Group
- Thursday, June 13 from 3:45-4:05 p.m.
Key Takeaways by Session Chair
- Manuela Junghähnel, Head of Department Wafer Level System Integration, Center ASSID, Fraunhofer Institute for Reliability and Microintegration IZM
- Thursday, June 13 from 4:25-4:30 p.m.
Towards Photonics Chiplets
- Tolga Tekin, Principal Investigator, Fraunhofer IZM
- Thursday, June 13 from 5:10-5:30 p.m.
How Environmentally Friendly Manufacturing and Disruptive Technologies Enable Greener Semiconductors
- Markus Wimplinger, Corporate Technology Development and IP Director, EV Group (EVG)
- Friday, June 14 from 10:45-11:10 a.m.
For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe on X or LinkedIn – @SEMIEurope, #3DSummit.
