Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules.
Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node
microchips and the related high-end performance package. METI, Japan‘s ministry of
economy, trade and industry, approves Rapidus‘ plan for research and development of
2nm generation semiconductor integration technology for 2024. Thus, Fraunhofer
IZM is happy to announce this corporation for one of the most important topics in the
near future, realizing modules for e.g. 5G communications, autonomous driving, or
high-performance computing.
“In March, we had a very inspiring meeting with Rapidus‘ president, Dr. Atsuyoshi Koike, in which he clearly emphasized the importance, not only of developing the most advanced node chip technology but also a highly advanced packaging technology to enable overall best-in-class performance,” said Dr. Michael Schiffer, project leader at Fraunhofer IZM, ” I‘m really looking forward to a fruitful cooperation with a full
commitment by everyone involved!“
