ECTC 2024 3D InCites Community Member Preview

2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of our community member companies presenting, exhibiting, and in some cases both, this may be our most well-represented year yet!

ECTC 2024 is packed with program sessions, interactive presentations, and special development courses – many of which will feature 3D InCites members. The conference covers everything ranging from advances in packaging technologies, all the way to emerging technologies, interconnections, photonics, and more.

Once again, Francoise von Trapp will be the events’ official podcast. She’ll be chatting with Professor Keren Bergman from Columbia University to discuss her keynote session, Petascale Photonic Chip Connectivity for Energy-Efficient AI Computing. Chet Lenox, of community member KLA, will share takeaways from the special session on metrology. We’re looking forward to it!

For an engaging overview of where the industry is right now, you won’t want to miss this year’s plenary session, The Future of Semiconductor Industry. Emerging Start-ups and Material Innovations in Advanced Packaging. This session will be formatted as a competition, to highlight next-generation materials and start-ups. Rozalia Beica, CCO of member company LQDX, is co-chair of the event. Be sure to check it out on Thursday, May 30 from 8-9:15 a.m. Check out the complete agenda here.

To help you navigate we created our own ECTC agenda with all community member sessions, presentations, and booth numbers. Take a moment to say hi to each other, or stop by the 3D InCites podcast booth to catch up with Francoise and get the latest information on all things ECTC. Members are invited to schedule podcast interviews for the 2024 ECTC Member Spotlight Episode. Remember to reach out and schedule your interview. Space is limited. Slots will be given on a first-come, first-serve basis. The deadline to sign up for podcast interviews is Wednesday, May 22.

Special Sessions Featuring 3D InCites Members

Erik Jung, Fraunhofer IZM

Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe

Tuesday, May 28, 2024, 8:30-10 a.m.

Ivan Ndip, Fraunhofer IZM

4 RF Packaging for Communication and Sensing Applications above 100 GHz – Technologies, Design Challenges and Emerging Solutions

Tuesday, May 28, 2024, 3:30-5 p.m.

Aakrati Jain, IBM

Young Professionals Network Panel

Tuesday, May 28, 2024, 7-7:45 p.m.

Rozalia Beica, LQDX

Substrate-Scaling Challenges in Chiplet Integration

Tuesday, May 28, 2024, 7:45 – 9:15 p.m.

Program Sessions Featuring 3D InCites Members

Session 1: Advances in Fan-Out, Wafer-Level, and Panel-Level Packaging Technologies Enabling New Applications

Wednesday, May 29, 9:30 a.m.

How to Manipulate Warpage in Fan-Out Wafer and Panel Level Packaging
Fraunhofer IZM: Tanja Braun, Ole Hölck, Marius Adler, Mattis Obst, Steve Voges, Karl-Friedrich Becker, Rolf Aschenbrenner

Wednesday, May 29, 10:10 a.m.

Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning With High-Productivity Electron Beam Lithography
Deca Technologies, Inc.: Craig Bishop, Cliff Sandstrom, Tim Olson, Multibeam Corporation: Andrew Ceballos, Kenneth MacWilliams, Ted Prescop, Tsenguun Byambadorj, David Lam

Wednesday, May 29, 11:15 a.m.

600 mm x 600 mm Fan-Out Panel Level Package (FOPLP) as an Alternative to Lead-Frame-Free Quad Flat No Lead (QFN) Package
Deca Technologies, Inc.: Robin Davis

Session 2: Advanced Die-to-Wafer Hybrid Bonding for Heterogeneous Integration

Session Co-Chair: Katsuyuki Sakuma, IBM Research

Session 4: Reliability of Advanced Substrates and Interconnects

Wednesday, May 29, 9:30 a.m.

Reliability Assessment of Stacked-Vias With Different Configurations Through a Unit Cell-based Substrate Design
IBM Corporation: Krishna Tunga, Joseph Ross, Shidong Li, Sushumna Iruvanti, Bakul Parikh

Wednesday, May 29, 11:55 a.m.

Evaluation of Vapor Pressure-Induced Debonding Failure in Fan-Out Package Under Reflow Condition
ASE Taiwan: Wei-Jie Yin, Chin-Li Kao

Session 5: Digital Healthcare: Wearable Sensors, and Flexible Electronics

Wednesday, May 29, 9:50 a.m.

Ferrite-Based NFC Antenna and Sensor Package Module Development for Implantable Continuous Glucose Monitor
ASE Taiwan: Ginger Huang, Jackson Chen, Ryan Lai

Wednesday, May 29, 11:55 a.m.

Using Flexible Hybrid Electronics on a Miniaturized Non-invasive Bio-optical Sensor For Hemoglobin Detection
ASE: Yu-Chih Lee, Kai-Lun Yu, Shu-An Tsai, Pai-Sheng Shih, Guo-Sin Huang, Tien-Chia Liu, Hung-I Lin, Jen-Chun Chen, Jen-Kuang Fang, Harrison Chang

Session 7: Heterogeneous Integration: Systems Design, Signal & Power Delivery, and Process Optimization

Session Co-Chair: Lihong Cao, ASE

Wednesday, May 29, 2:40 p.m.

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
IBM Infrastructure: Thomas Wassick, Isabel de Sousa, Divya Taneja
IBM Research: Qianwen Chen, Eric Perfecto, Aakrati Jain, Joseph Ross
IBM Research, Tokyo: Akihiro Horibe, Takahito Watanabe, Chinami Marushima, Sayuri Kohara, Hiroyuki Mori

Session 8: Sub-Micron Scaling in Wafer-to-Wafer Hybrid Bonding

Wednesday, May 29, 4:25 p.m.

0.5µm Pitch Wafer-to-Wafer Hybrid Bonding at Low Temperatures With SiCN Bond Layer
EV Group, Inc.: Taotao Ding, Gernot Probst, Tobias Wernicke, Thomas Uhrmann, Markus Wimplinger

Session 9: Advanced Processes for Chip Stacking

Session Co-Chair: Qianwen Chen, IBM Research

Wednesday, May 29, 2 p.m.

IR Laser Release for 3D Stacked Devices: Effect of The Release Stack Structure on the Debonding Mechanism
EV Group, Inc.: Peter Urban, Julian Bravin, Thomas Uhrmann, Markus Wimplinger

Session 10: Novel 3D Integration and Hybrid Bonding Solutions

Session Co-Chair: Zia Karim, Yield Engineering Systems

Wednesday, May 29, 2 p.m.

Investigation of Distortion in Wafer-to-Wafer Bonding With Highly Bowed Wafers
EV Group, Inc.: Thomas Plach, Gernot Probst, Taotao Ding, Markus Wimplinger, Thomas Uhrmann

Wednesday, May 29, 4:05 p.m.

Moving Towards Microchannel-Based Chip Cooling
Advanced Semiconductor Engineering: Lihong Cao, William Chen
EV Group, Inc.: Garrett Oakes, Dave Kirsch
SEMI: Paul Semenza, Gity Samadi

Wednesday, May 29, 4:25 p.m.

Novel Inorganic IR Release Process for High-Temperature W2W and D2W Integration
EV Group, Inc.: Thomas Uhrmann, Peter Urban, Boris Považay, Michael Josef Gruber, Bernd Thallner, Markus Wimplinger

Session 11: Next-Generation Artificial Intelligence, Quantum Computing, and Secure Packaging

Wednesday, May 29, 2:20 p.m.

Key Technologies and Design Aspects for Wafer-Level Packaging of High-Performance Computing Modules
Fraunhofer IZM: Kai Zoschke, Hermann Oppermann, Michael Schiffer, Ivan Ndip, Karl-Friedrich Becker, Marius Adler, Alexander Gäbler, Uwe Maaß

Session 12: Artificial Intelligence and Advanced Modeling Approaches

Wednesday, May 29, 2:40 p.m.

Creep Parameters for Solder Interconnects by Nanoindentation Inverse-FEA Method
IBM Corporation: Shidong Li, Christine Taylor, Charles Arvin

Wednesday, May 29, 3:45 p.m.

Deep Convolution Neural Networks for Automatic Detection of Defects Which Impact Hybrid Bonding Yield
Adeia: Oliver Zhao, Dominik Suwito, Bongsub Lee, Thomas Workman, Laura Mirkarimi

Session 13: Next-Generation Substrate Manufacturing Technologies

Session Co-Chair, Markus Leitgeb, AT&S

Thursday, May 30, 11:35 a.m.

X-Ray Photoelectron Spectroscopy (XPS) Investigations to Monitor the Surface Chemistry During Palladium-Free Colloidal Copper Activation
Atotech (MKS Instruments): Ibbi Ahmet, André Beyer, Laurence J. Gregoriades, Julia Lehmann, Yvonne Welz

Thursday, May 30, 12:15 p.m.

High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High-Density 3D Advanced Packaging Applications
Yield Engineering Systems: Venugopal Govindarajulu, Coby Tao, Zia Karim, Aneelman Brar

Session 14: Breakthrough Ultra-Fine Pitch Redistribution Layer and Solder Bumping Technologies

Thursday, May 30, 11:15 a.m.

Void Migration Kinetics in Fine Line Cu RDL Under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
ASE: Min-Yan Tsai, Ting-Chun Lin, Yung-Sheng Lin, Chih-Pin Hung, Chen-Chao Wang

Thursday, May 30, 11:35 a.m.

Reliable Chiplet Integration on High-Density Laminate (2.x D) for AI Hardware
IBM Canada, Ltd.: Divya Taneja, Jonathan Pouliot-Grenier, Isabel de Sousa
IBM Research: Joseph Ross, Sathya Raghavan, Griselda Bonilla
IBM Research, Tokyo: Horiyuki Mori
IBM Systems: Brian Quinlan, Thomas Wassick

Thursday, May 30, 12:15 p.m.

Additive Manufacturing of High-Density (2.5 µm L/S) Ag-Cu Stacked Interconnects on Organic Substrates
IBM Canada, Ltd.: Divya Taneja, Jonathan Pouliot-Grenier, Isabel de Sousa
IBM Research: Joseph Ross, Sathya Raghavan, Griselda Bonilla
IBM Systems: Brian Quinlan, Thomas Wassick

Session 15: Novel Materials and Process for Hybrid Bonding

Thursday, May 30, 12:15 p.m.

Multi-Tier Die Stacking Through Collective Die-to-Wafer Hybrid Bonding
Brewer Science Inc.: Alice Guerrero

Session 16: Reliability of High-Density and High-Power Packages

Thursday, May 30, 9:50 a.m.

Reliability Investigations of Advanced Photosensitive Polymer-Based RDL Processes Protected by Inorganic Capping Layers
Veeco: Ritwik Bhatia, Ganesh Sundaram

Thursday, May 30, 11:15 a.m.

Fusing Current Characterization of Various Cu RDL Designs in Wafer-Level Packages
Amkor Technology, Inc.: JeongMin Ju, Nathan Whitchurch, JiYeon Yoon, EunSook Sohn

Session 18: Radio Frequency Antenna-in-Package and Component Design

Thursday, May 30, 9:50 a.m.

Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications
Ajinomoto Co., Inc.: Ryohei Oishi, Reki Nakano
Ajinomoto Fine-Techno USA Corporation: Habib Hichri
Fraunhofer IZM: Thi Huyen Le, Michael Phillip Kaiser, Julia-Marie Köszegi, Kavin Senthil Murugesan, Lutz Gerhold, Ivan Ndip, Martin Schneider-Ramelow

Thursday, May 30, 11:15 a.m.

A Compact mmWave 1×4 Antenna Array Design With Shorted Parasitic Elements for 5G AiP Applications
ASE: Sheng-Chi Hsieh, Cheng-Yu Ho

Session 19: 3D Integration Copper-Copper Hybrid Bonding

Session Co-Chair, John Knickerbocker, IBM Corporation

Session 20: Novel High-Density 3D & Thru-Via Structures and Processes

Thursday, May 30, 2:40 p.m.

3D Interconnects for Quantum Computing
Carl Zeiss Microscopy GmbH: Heiko Stegmann

Thursday, May 30, 3:45 p.m.

Laser Micro Drilling of Around 3 Microns into Ajinomoto Build-up Film
Ajinomoto Fine-Techno Co., Inc.: Shoko Nagayama, Ryo Miyamoto

Session 21: Innovations in Polymer Packaging Materials

Thursday, May 30, 2:20 p.m.

Development of UV-curable molding Materials With Minimum Die-Shift for FOWLP/FOPLP
EV Group, Inc.: Mariana Pires, Mikhail Begel, Andrea Kneidinger, Markus Wimplinger, Thomas Uhrmann

Thursday, May 30, 2:40 p.m.

Temperature-Dependent Dielectric Characterization of Low Loss Thin Film Polymers up to Sub-THz Bands
Ajinomoto Fine-Techno USA Corporation: Habib Hichri, Ryohei Oishi, Reki Nakano
Fraunhofer IZM: Ivan Ndip, Martin Schneider-Ramelow, Kavin Senthil Murugesan, Jens Schneider, Michael Kaiser, Julia-Marie Köszegi

Session 23: Novel Bonding Technology for Advanced Assembly Substrates and Integration

Session Co-Chairs: Valerie Oberson, Pascale Gagnon; IBM

Thursday, May 30, 2 p.m.

Advanced Thermocompression Bonding on High-Density Fan-Out Embedded Bridge Technology for HPC/AI/ML Applications
ASE: Wiwy Wudjud, ShuYu Lin, Yungshun Chang, Jean Yen, Reno Liao, Leo H.S. Cheng, YiHsien Wu, Simon Y.L. Huang, Ivan R.C. Chen, ChengYu Lee, Joey C.I. Huang, Lihong Cao

Thursday, May 30, 2:20 p.m.

Various Defect Mechanism Analysis for Optimization of Vacuum Fluxless Solder Reflow Performance Using 10 µm or Below Microbumps
Yield Engineering Systems: Lei Jing, Alvin Lin, Xinxuan Tan, Anderson Chen, Vladimir Kudriavtsev, Lucky Murugesh, Zia Karim

Thursday, May 30, 3:45 p.m.

Novel Molded FCBGA Package Platform for Highly Reliable Automotive Applications
Amkor Technology, Inc.: Youngdo Kweon
Amkor Technology Korea: Inrack Kim, Nari Kim, Gayoung Shin

Thursday, May 30, 4:45 p.m.

High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry
Adeia: Bongsub Lee, Oliver Zhao, Arianna Avellán, Suhail Sadiq, Gill Fountain, Dominik Suwito, Guilian Gao, Laura Mirkarimi

Session 24: Advances on Flex and Redistribution Layer Technologies and Warpage

Thursday, May 30, 3:45 p.m.

Monitoring of Wafer Thinning Induced In-Die Mechanical Stress With Embedded Sensors for Heterogeneous Integration
PDF Solutions: Alberto Piadena, Michele Quarantelli, Sharad Saxena, Christopher Hess, Larg Weiland, Rakesh Vallishayee, Yuan Yu, Tomasz Brozek, Andrzej Strojwas

Thursday, May 30, 4:45 p.m.

Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP Through Experimental and Numerical Investigations
Fraunhofer IZM: Saskia Huber, Philipp Scheibe, Sükrücan Mutlu, Olaf Wittler, Martin Schneider-Ramelow

Session 25: High-Performance Computing, Design Challenges, and Solutions

Friday, May 31, 11:35 a.m.

Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology
ASE Corporate R&D Center: Chen-Chao Wang, Chih-Yi Huang, Hung-Chun Kuo

Session 27: Advanced Die Bond and Board-Level Reliability

Friday, May 31, 9:50 a.m.

The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications
Indium Corporation: Hongwen Zhang, Kyle Aserian, David Hu, Tyler Richmond, Leo Hu

Session 28: Optical Interconnections

Session Co-Chair, Masao Tokunari, IBM

Friday, May 31, 9:30 a.m.

Fiber Array Attach for Co-Packaged Optics: High-Volume Production Process Control and Performance

IBM Canada, Ltd.: Paul Gond-Charton, Sebastien Gouin, Steve Pellerin, Louis-Michel Collin, Michelle Sevigny, Patrick Jacques, Elaine Cyr

Session 29: Reliability in Harsh Environments Including Automotive

Friday, May 31, 11:35 a.m.

High Acceleration Dynamic Methodology for Board-Level Shock Solder Joint Reliability Approach
ASE: Min-Cheng Yu, Nan-Yi Wu, Wu-Lung Wang, Hsin-Chih Shih, Wei-Hong Lai, Chin-Li Kao, Chen-Chao Wang, CP Hung

Session 31: Advances in Flip Chip and Chip Scale Packages

Friday, May 31, 2 p.m.

New Double Sided Molded Package Platform Development With Open Cavity Mold on One Side and Exposed Die Mold on the Other Side
Amkor Technology Korea: MiKyeong Choi, HoSeung Seo, SeMin Gim, GyeongCheol Lee, JungHoon Na, GaHyeong Hwang, WonBae Bang, KiDong Sim, WonChul Do, KyungRok Park
Amkor Technology, Inc.: Ted Adlam, Jeff Davis

Session 32: Advancement in Copper Hybrid Bonding Technologies Common to Multiple Applications

Friday, May 31, 2 p.m.

A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
IBM Research: Roy Yu, Katsuyuki Sakuma

Session 33: Fine-Pitch Materials and Processes

Friday, May 31, 3:45 p.m.

Ultra High-Density RDL Patterning of High–Resolution Dielectrics by Maskless Exposure Technology for High-Performance Computing and Artificial Intelligence
EV Group, Inc.: Ksenija Varga, Thomas Uhrmann, Roman Holly, Tobias Zenger

Friday, May 31, 4:25 p.m.

Cu Nanowire Fine-Pitch Joints for Next-Gen Heterogeneous Chiplet Integration
Fraunhofer IZM: Steffen Bickel, Iuliana Panchenko, Manuela Junghaehnel

Session 34: Photonics Integration, Materials, and Processes

Friday, May 31, 4:05 p.m.

Laser Attach Process Development and Material Selection
IBM Corporation: Alexander Janta, Pascale Gagnon, Eric Turcotte, Elaine Cyr, Jason Zheng

Friday, May 31, 4:25 p.m.

Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-Millimeter Heterogeneous Integration Packaging
IBM Research: Frank Libsch, Steve Bedell, Cyril Cabral, Arun Paidimarri, Chitra Subramanian, Seiji Munetoh

Session 35: Reliability and Current Stressing of Solder Interconnections

Friday, May 31, 2 p.m.

Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints
IBM Corporation: Prabjit Singh, Larry Palmer, Mehdi Hamid, Thomas Wassiac

Session 36: Thermal Management and Cooling Solutions

Friday, May 31, 3:45 p.m.

Thermal Performance of an Indium-Silver Alloy Metal TIM for a Large Body Lidded FCBGA After EOL and Long-term Reliability Tests
Amkor Technology, Inc.: YoungDo Kweon
Amkor Technology Korea: SangHyuk Kim, EunSook Sohn, KyungRok Park

Friday, May 31, 4:05 p.m.

AI-driven Cold Plate Design and Optimization
Cadence Design Systems: Yue Wu, Eric Chu, Fiona Shiau, Nathan Ai, Albert Zeng, Hoa Pham

Friday, May 31, 4:25 p.m.

Heat Dissipation Measurement in Flip-Chip Package Using Microfabricated Temperature Sensors on Lid
IBM Canada, Ltd.: Éric Duchesne, Stéphanie Allard

Friday, May 31, 4:45 p.m.

Innovative Two-Phase Immersion Cooling Solutions for High-Power Advanced Packages
ASE: ICheng Huang, Ying-Xu Lu, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hung

Interactive Presentations

Session 37: Interactive Presentations 1

Session Co-Chair, Venkata Mokkapati, AT&S

Wednesday, May 29, 10 a.m. – 12 p.m.

Multiphysics Overlay Modeling of Monolithic 3D Fusion and Hybrid Bonding Processes
EV Group, Inc.: Christian Mühlstätter, Lukas Koller, Markus Wimplinger, Viorel Dragoi

Wednesday, May 29, 10 a.m. – 12 p.m.

Thermal Resistance Prediction Model for IC Packaging Optimization and Design Cycle Reduction
ASE: Tang-Yuan Chen, Chen-Chao Wang

Session 38: Interactive Presentations 2

Session Co-Chairs, Frank Libsch, Pavel Roy Paladhi, IBM

Wednesday, May 29, 2:30 p.m. – 4:30 p.m.

The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package
Amkor Technology, Inc.: Heejun Jang, Kyun Ahn, Jinhan Kim, Taekyeong Hwang

Wednesday, May 29, 2:30 p.m. – 4:30 p.m.

Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices
Indium Corporation: Guangyu Fan, Jacob Wells