Experience higher integration density and improved performance through hybrid bonding techniques.
Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a pioneer in temporary and hybrid bonding materials for the advanced packaging semiconductor industry, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 28th through May 31st, 2024.
Challenges for High Temp Processing in Semiconductor Packaging
Traditional high-temperature processing poses a challenge when accommodating higher integration densities and improved performance in advanced semiconductor packaging. The use of low-temperature hybrid bonding with nanocrystalline copper (nc-Cu) and polymer materials offers a solution to this challenge by enabling efficient wafer-to-wafer and die-to-wafer bonding processes at significantly reduced temperatures.
“As we continue to revolutionize semiconductor packaging with higher integration density and improved performance, we never lose sight of who impacts these developments,” states Alex Smith, Executive Director of the Semiconductor Materials Business Unit at Brewer Science. “Our customers and industry partners play a crucial role in our development of these next-generation processes, and we are excited to connect with them at ECTC.”
Higher Integration Densities and Improved Performance Achieved by Hybrid Bonding Applications
Brewer Science is co-author for two presentations, both of which address a pressing issue in the advanced packaging semiconductor industry: accommodating higher integration density and improving performance while overcoming the limitations of high-temperature processing.
Multi-Tier Die Stacking Through Collective Die-to-Wafer Hybrid Bonding will be co-presented by imec and Alice Guerrero, Ph.D., Principal Applications Engineer at Brewer Science during Session 15 on Thursday May 30th 9:30 AM – 12:35 PM. You can view the event itinerary here.
The presentation addresses three industry questions shaping this novel technology:
- How can collective die-to-wafer bonding facilitate multi-tier die stacking in 3D IC technologies?
- What are the key metrics such as transfer yields and bond yields achieved in multi-tier die stacking using collective die-to-wafer bonding?
- How does die-to-target wafer alignment accuracy compare between different tiers of bonding in collective die-to-wafer hybrid bonding, and what implications does this have for the scalability and reliability of the process?
Low-Temperature Nanocrystalline Cu/Polymer Hybrid Bonding With Tailored CMP Process will be co-presented by Industrial Technology Research Institute and Alvin Lee, Ph.D., Regional Director at Brewer Science during Session 39 on Thursday May 30th 10:00 AM – 12:00 PM. You can view the event itinerary here.
The presentation answers three industry questions shaping this novel technology:
- How can low-temperature hybrid bonding using nanocrystalline copper (nc-Cu)/polymer structures enable advancements in wafer-to-wafer and die-to-wafer bonding processes?
- What are the mechanical properties and reliability of the nc-Cu/polymer hybrid bonding interface, as evaluated through thermal shock testing and shear testing, and how do these properties support the feasibility of low-temperature bonding for advanced packaging applications?
- How do the distinctive properties of nanocrystalline copper and polymer materials enable low-temperature bonding and interdiffusion processes and what implications does this have for the development of reliable hybrid bonding solutions in the semiconductor industry?
Brewer Science encourages attendees to visit booth 732 for the opportunity to learn about Brewer Science’s advanced BrewerBOND® materials for mechanical and laser debonding, including the VersaLayer system, a set of materials offering versatile, high-thermal-budget solutions for temporary bonding and debonding. For permanent bonding needs, Brewer Science offers PermaSOL® materials, providing robust and reliable solutions for various applications. Members from the team will be at the event to discuss how these innovative material solutions can be tailored to meet specific application requirements.
