Santee, Calif. – 30 November 2023 –StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF, microwave, and millimeter-wave devices, proudly announces its latest presentation, “Package and Die Attach Materials for High-Power GaN Devices,” which was presented at InterPACK 2023 in San Diego in October. This presentation delves into crucial aspects of packaging, materials, and assembly methodologies significant to Gallium Nitride (GaN) devices. StratEdge’s research underscores that maximizing thermal dissipation for high-power devices is achievable through the optimization of the die-attach assembly process and package material choices.
InterPACK is the primary annual technical conference of the Electronics and Photonics Packaging Division (EPPD) of the ASME. The conference served as an enriching platform for the exchange of state-of-the-art knowledge encompassing research, development, manufacturing, and applications in packaging.
The conference marked a successful culmination of this year’s networking and events for StratEdge. StratEdge not only sponsored the conference but also showcased its groundbreaking findings. “The success of a package’s performance hinges upon the base material, the quality of package construction, and the attachment process,” elucidated Casey Krawiec, Vice President of Global Sales at StratEdge. Krawiec further explained, “Our presentation offered valuable insights through comparisons utilizing simulation data, shedding light on the impact to chip-to-package junction temperatures, while highlighting avenues for enhancement.”
For further information or to schedule a meeting, please reach out to StratEdge via email at info@stratedge.com or visit our website www.stratedge.com.
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