Mosaic Microsystems, a pioneering leader in advanced microelectronics glass packaging technology, is delighted to announce the successful award of a Phase II Small Business Innovation Research (SBIR) contract by the Department of Defense (DoD). This award reflects Mosaic Microsystems’ commitment to pushing the boundaries of innovation and its dedication to enhancing national defense capabilities.
Under this Phase II SBIR effort, Mosaic Microsystems will develop ultra-thin glass interposers with through-glass via (TGV) technology. These cutting-edge interposers will serve as the foundation for a high-speed packaging solution designed for analog and digital electronics and photonics. As part of this transformative initiative, in collaboration with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), Mosaic Microsystems’ will demonstrate the integration of fiber optics, waveguides, and photonic integrated circuits (PICs) with glass.
Advanced application-specific integrated circuit (ASIC) or PIC-based systems currently rely on a silicon (Si) substrate for the electronic interposer or electronic and photonic interposer (respectively) and an organic laminate substrate for RF signals, power, and control. Mosaic Microsystems’ effort will leverage the capabilities of AIM Photonics’ Test, Assembly and Packaging (TAP) facility to develop photonics-enabled glass interposers. Mosaic’s glass interposers promise greater efficiency, superior electrical and thermal isolation, and more compact packaging solutions compared to the conventional packages.
This innovative approach will apply not only to defense technology but also to commercial applications. By introducing thin glass photonic interposers, Mosaic Microsystems seeks to demonstrate substantial cost savings, reduced size and weight, and enhanced overall performance over current solutions. These advantages are expected to have far-reaching implications for next-generation digital communications and have the potential to shape the future of 5G and ‘Next G’ technologies.
“This DoD SBIR Phase II contract supports our team’s ability to drive technological innovations in the important area of photonics packaging,” said Shelby Nelson, Chief Technology Officer and Co-Founder at Mosaic Microsystems. “We are thrilled to collaborate with AIM Photonics TAP on this venture, as we help build the future of electronics, photonics, and communications technologies.”
About AIM Photonics:
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) is one of nine Manufacturing Innovation Institutes established and managed by the U.S. Department of Defense to advance new technology and capabilities into products and systems that help secure national defense and economic priorities.
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, NY. Mosaic delivers robust solutions to enable thin glass products for exciting initiatives in RF communications, particularly for 5G, as well as advanced packaging, MEMs and sensors for the internet of things (IoT). Mosaic’s solutions provide customers with the ability to establish high volume manufacturing of thin glass solutions using existing industry standard equipment and processes.
