In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring microelectronics.
Office of Industrial-Based Policy
Adele Ratcliff, Director of the Innovation Capability and Modernization Office discussed Manufacturing Capability Expansion and Investment Prioritization (MCEIP).
The mission of the Office of Industrial-Based Policy is to “…work with domestic and international partners to forge and sustain a robust secure and resilient industrial base enabling the warfighter now and in the future.”
MCEIP comprises the production act investments (DPAI) and innovation, capability, and modernization (ICAM).
The so-called “Title 1” (national defense and emergency preparedness) and “Title 3” (investments to ensure domestic supply chains and reduce reliance on foreign supply chains) fall under DPAI.
ICAM oversees the Industrial Base Analysis and Sustainment (IBAS) programs’ authority to address industrial base health and risks.
IBAS RESHAPE Program
Matt Walsh of NSWC Crane discussed the Reshore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) Program, which was developed by Army Protective Technologies, NSWC Crane, and AFRL. The program is led by Donna Joyce, Army Senior Research Scientist (ST).
Establishing a US Secure Packaging Ecosystem will hopefully solve DoD access, availability, and security issues. The IBAS-supported RESHAPE program sought RFPs to put on-shore commercial capability in place that would be accessible to the DoD in the following technological areas:
US-based advanced packaging capability will benefit DoD applications such as:
- Radar and EW sensors
- 5/6G telecommunications
- Anti-tamper
- Hardware-based cyber security
- Radiation hardened hardware
- Assurance
- Secure solutions
- Space
Proposal winners will be announced shortly.
CHIPS for America – Dept of Commerce / NIST
Will Osborn of NIST, who is Sr. Advisor to the CHIPS R&D Office, discussed the CHIPS for America program. I will not go into detail on the whole program here, since we have covered this program multiple times in IFTLE [see IFTLE 531, IFTLE 552]
As part of CHIPS for America, the National Advanced Packaging Manufacturing Program (NAPMP) will be led by the Director of NIST in coordination with the National Semiconductor Technology Center (NSTC)
NAPMP will develop advanced packaging and related R&D and stipulates that NAPMP should have competency in:
- Heterogeneous integration
- Chiplets
- Photonics
- Chip/package co-design
NAPMP should have easily accessible user facilities that focus on low volume/prototype facilities including materials characterization, metrology, modeling, and simulation.
The NAPMP will:
- Partner with the NSTC to support packaging facilities that enable R&D efforts
- Allow prototype and pilot scale integration of components fabricated at NSTC or 3rd party sources
- Establish baseline processing flows
- Have tool redundancy to allow research at the same time to maintain baseline capacity
- NSTC and NAPMP may form partnerships with US OSATS and EMS to facilitate migration to production
- Will develop R&D for advanced packaging that is used to integrate chiplet devices
- Develop programs targeted explicitly at accelerating the development of chiplet architectures.
PCB Executive Agent
Craig Herndon, DoD PCB Executive Agent discussed “PCB Executive Agent Activities and Perspectives”. The goal of the DoD executive agent is to ensure DoD access to trusted and affordable electronic interconnect necessary for critical defense systems and warfighter superiority”. The following is a list of issues and existing government initiatives to address them that Herndon presented.
For all the latest in Advanced Packaging stay linked to IFTLE……………
