Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider of advanced microelectronics assembly and packaging services. The purchase of the FINEPLACER® pico 2 will advance AmTECH’s flip chip bonding and precision die bonding manufacturing services. Designed to deliver high placement accuracy for an array of processes: flip chip bonding, precision die bonding, wafer level packaging, 2.5D and 3D IC stacking, chip-on-board (COB), chip-on-flex (COF), chip-on-glass (COG); in addition to a wide range of other assembly technologies.
The new FINEPLACER® pico 2 system delivers several features that will further benefit AmTECH’s customers seeking flip chip and die bonding with precision placement accuracy requirements in optical, medical/ biotech, defense/ aerospace, automotive/ LiDAR, RF/ microwave/ mmWave and other market applications. The FINEPLACER® pico 2supports all typical bonding technologies such as soldering/ eutectic/ sintering die bond, adhesive bonding, flip chip thermocompression and ultrasonic bonding; as well as process forming gas, epoxy dispensing and UV curing.
Combining micron placement accuracy with a 350mm x 155mm large work area,component sizes up to 100mm x 100mm and a wide range of controlled bonding forces up to 500N; the FINEPLACER® pico 2 system features a modular design for valuable flexibility.
“I am so pleased that AmTECH has chosen our technology to deliver the flexibility needed in high-accuracy bonding applications for a very diverse customer base. Whether it is heterogeneous integrated assemblies or traditional single die-to-substrate bonding, the pico 2 will address them all. We look forward to supporting AmTECH in meeting their customers’ challenges.” stated Neil O’Brien, General Manager, with Finetech
“The FINEPLACER® Pico 2 is the perfect addition to our other microelectronics assembly & packaging equipment and extends our extreme placement accuracy and control to the next level,” said David Walter Chavez, Operations Manager for AmTECH. “We are excited about the additional capability and capacity we now have available to support our customer’s flip chip and die bond high accuracy placement needs.”
